HP EliteDesk 800 G4 Instrucciones de instalación

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Product End-of-Life Disassembly Instructions

Product Category: Personal Computers

Marketing Name / Model

[List multiple models if applicable.]

HP EliteDesk 800 G4 SFF

Purpose:

The document isintended for use byend-of-life recyclers or treatmentfacilities. Itprovides the basic instructions

for the disassembly of HPproducts to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.1

Itemslisted belowareclassifiedasrequiringselectivetreatment.

1.2

Enter the quantity of items contained within the product which require selective treatment inthe right column, as

applicable.

Item Description

Notes

Quantity

of items

included

in product

PrintedCircuit Boards(PCB) orPrintedCircuit

Assemblies (PCA)

With a surface greater than 10 sq cm

Batteries

All types including standard alkaline andlithiumcoin

or button style batteries

Mercury-containing components

For example, mercury inlamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm

Includesbackgroundilluminateddisplayswithgas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

Chicony 250W EPA92 HV :C1

External electrical cables and cords

Gas Discharge Lamps

Plasticscontaining BrominatedFlameRetardants

weighing > 25grams (not including PCBs or PCAs

already listed as a separate itemabove)

Components and parts containing toner and ink,

Include the cartridges, print heads, tubes, vent

1.0 Items Requiring Selective Treatment

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including liquids, semi-liquids (gel/paste) and toner

chambers, and service stations.

Components and waste containing asbestos

Components,partsandmaterialscontaining

refractory ceramic fibers

Components,partsandmaterialscontaining

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically beused to disassemble the product to a point where components

and materials requiring selective treatment can beremoved.

Tool Description

Tool Size (if

applicable)

Description #1 Screw Driver, Cross Type

Description #2 Cut-Pliers, Small Size

Description #3

Description #4

Description #5

3.0 Product Disassembly Process

3.1

List the basic steps that should typically be followed toremove components andmaterials requiring selective treatment:

Slide the latch and remove access panel.(see Figure 1-2below)

Rotate the driver cage form the hook on slide rail.(see Figure 3 below)

Disconnect power cable from the MB.(see Figure 4 below)

Disconnect SATA cables from the MB.(see Figure 5below)

Disconnect speaker cable from the MB.(see Figure 6below)

Disconnect other PSU cables from the MB.(see Figure 7-8below)

Remove the fan duct (see Figure 9-10below)

Disconnect P3 cable from MB.(see Figure 11 below)

Remove HDD/ODD from chassis.(see Figure 12-19below)

10.

Remove the heatsink from MB.(see Figure 20-21below)

11.

Separatethe fanfromCPU heatsink.

（

seeFigure22below

）

12.

Remove the memory card from the MB.(see Figure 23 below)

13.

Remove the CPU from the MB.(see Figure 24-25below)

14.

Remove M/B from chassis .(see Figure 26-27below)

15.

Remove the battery from MB.(see Figure 28 below)

16.

Remove LEDholder from MB.(see Figure 29below)

17.

Remove front panel from chassis.(see Figure 30 below)

18.

Remove Speaker from chassis.(see Figure 31 below)

19.

Unscrew the PSU and disconnect all PSU cables from chassis.(see Figure 32-35 below)

20.

Remove PSU cover and remove the Electrolytic Capacitors.(see Figure 36-41 below)

3.2

Optional Graphic. If the disassembly process iscomplex, insert a graphic illustration below toidentify theitems

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

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Figure 1Slide the latch and remove access panel

Figure 2 Remove the access panel

Figure 3 Rotate the driver cage from the hook

Figure 4 Disconnect Power SATA cable from MB

Figure 5 Disconnect All SATA cables from MB

Figure 6 Disconnect Speaker cable from MB

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Figure 7 Disconnect P1 power cable from the MB

Figure 8 Disconnect P2 power cable from MB

Figure 9 press the hook and pull up the fan duct

Figure 10 Remove the fan duct

Figure 11 Disconnect P3 Power cable from MB

Figure 12 Pull the HDD latch and rotate the HDD up

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Figure 13 Disconnect power cable from HDD

Figure 14 Disconnect SATA cable from HDD

Figure 15 Remove the HDD from HDD cage

Figure 16 Disconnect power cable from ODD

Figure 17 Disconnect SATA cable from ODD

Figure 18 Press the ODD latch and remove it

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Figure 19 Remove ODD from ODD cage

Figure 20 Disconnect CPU fan cable from MB

Figure 21 Use T15 screwdriver to unscrew the screw and

remove the heatsink

Figure 22 Use PH1 screwdriver tobreak upthe heatsink

into fan and cooler

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Figure 23 Remove memory from MB

Figure 24 Rotate the handle and pull it up

Figure 25 Remove CPU from the socket

Figure 26 Use T15 screwdriver toremove all MB screws

from MB

Figure 27 Remove MB from chassis

Step 28. Remove battery from MB

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Step 29 Remove LED cover from MB

Step 30 Remove the front bezel

Step 31Use T15 screwdriver remove speaker from the

front wall

Step 32Use T15 screwdriver toremove the PSU screws

from rear wall

Step 33 Remove all the power cables from the hook

Step 34 Press the latch and slide the PSU out

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Step 35 Remove the PSU from chassis

Step 36De-screwed from the external case top, use tool

Step 37De-screwed from the external case bottom, use

tool #1

Step 38 Remove the external case of back side

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Step 39De-screwed from the main PCBA (solder side),

use tool #1

Step 40 Pull-off the connectors/housings

Step 41Cut-off andremove the biggest electrolyte

capacitor(C1), use tool #2

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