HP Elite Tower 600 G9 Instrucciones de montaje

EL-MF877-00 Page 1

Template Revision D

last updated May-2022

HP Inc. instructions for this template are available at EL-MF877-01

Product End-of-Life Disassembly Instructions

Product Category: Desktops

Marketing Name / Model

[List multiple models if applicable.]

HP Elite Tower 600 G9 Desktop PC; HP Elite Tower 680 G9 Desktop PC; HP Elite Tower 800 G9 Desktop PC; HP Elite Tower 880 G9

Desktop PC; HP Z1 G9 Tower Desktop PC

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the

disassembly of HP Inc. products to remove components and materials requiring selective treatment, as defined by EU directive

2012/19/EC, Waste Electrical and Electronic Equipment (WEEE).

NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking code on the

plastic part. For any questions on plastic marking or identification of location of parts or components requiring selective treatment,

please contact HP’s Sustainability Contact.

1.0

Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment. An “X” in the list of components and parts indicates the product

contains the component or part requiring selective treatment

Item Description Components and parts requiring selective treatments

Quantity of

items

included in

product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA) with a surface greater than 10 sq cm

☒

Main board (MB) PCB

☒

Solid state drive (SSD) PCB

☐

Wireless WAN module (WWAN) PCB

☐

Touch module PCB

☒

Power supply PCB

☒

External Keyboard (KB)

☒

External Mouse

☒

Others: HDD PCB, Memory PCB

Batteries, excluding Li-Ion batteries. This includes

standard alkaline, coin or button style batteries

☒

RTC/CMOS battery

☐

Others: _____________

Ion batter

ies

. Include

all

Ion

batteries if more

than one is provided with the product (such as a

detachable notebook keyboard battery, etc.)

ion b

attery(ies) are attached to the

product by

☐

screws

☐

snaps

☐

adhesive

☐

other. Explain

Mercury-containing components. For example,

mercury in lamps, display backlights, scanner lamps,

switches,

batteries

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm. Includes background illuminated

displays with gas discharge lamps

☐

Panel LCD 0

EL-MF877-00 Page 2

Template Revision D

last updated May-2022

HP Inc. instructions for this template are available at EL-MF877-01

Item Description Components and parts requiring selective treatments

Quantity of

items

included in

product

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring greater

than 2.5 cm in diameter or height

☒ Power Supply capacitor(s) or condenser(s) 1

External electrical cables and cords ☒ AC power cord

☐ Audio, video or data cables

☐ Other: _________

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants (not

including external electrical cables and cords, PCBs or

PCAs already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner.

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing refractory

ceramic fibers

Components, parts and materials containing

radioactive substances

Components containing chlorofluorocarbons (CFC),

hydrochlorofluorocarbons (HCFC) or

hydrofluorocarbons (HFC), hydrocarbons (HC)

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components and

materials requiring selective treatment can be removed.

Tool Description Tool Size (if

applicable)

Hexagon Screw Driver T-15

Crisscross Screw Driver

PH1

oldering Iron

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment including

the required steps to remove the external enclosure.

1. Use T-15 screw driver to loose thumb screw and remove access panel.

2. Disconnect ODD power cable and ODD SATA cable from ODD.

EL-MF877-00 Page 3

Template Revision D

last updated May-2022

HP Inc. instructions for this template are available at EL-MF877-01

3. Press the ODD’s latch on ODD cage

4. Remove the ODD from ODD cage

5. Remove Front Bezel from chassis

6. Disconnect HDD power cable and HDD SATA cable from HDD.

7. Remove the driver cage from Chassis

8. Use T-15 screw driver to loose the screws of HDD and release HDD latch

9. Remove HDD from HDD cage

10. Disconnect system fan cable from MB

11. Disconnect Cooler Fan cable from MB

12. Use T-15 screw driver to loose the cooler screws and remove cooler from MB

13. Use T-15 screw driver to loose the screws and remove the fan

14. Separate the fan from CPU heat sink

15. Remove memory from the MB

16. Rotate the handle and open it up

17. Remove the CPU from the board

18. Remove SSD M.2 Card

19. Remove WLAN M.2 Card

20. Remove the battery from the system board

21. Use T-15 screw driver to loose the screws of MB from board

22. Remove MB from chassis

23. Remove speaker from Chassis

24. Remove System fan

25. Remove Front Antenna cable

26. Remove Rear Antenna cable

27. Use T-15 screw driver to loose the screws of PSU

28. Press the PSU’s latch on chassis

29. Remove the PSU from chassis

30. Remove four screws covered

31. Remove the screw and open case

32. Use PH1 screw driver to remove FG screw

33. Disconnect fan connector and inlet connector

34. Loose screws and remove PCB from case

35. Loose screws and remove PSU fan

36. Use Soldering Iron to remove Ele-Cap from PCBA

3.2 Location of components requiring selective treatment. The photos and/or graphics below identify the location of the parts or

components requiring selective treatment within the main unit. For End-of-Life product disassembly instructions of external

accessories including external power supply (EPS), external keyboard (KB) external mouse and external cables and cords, refer to the

following URL: End-of-Life Product Disassembly Instructions (hp.com)

Step1 Use T-15 screwdriver to Loose thumb screw and

remove access panel

Step2 Disconnect ODD power cable and ODD SATA cable

from ODD

EL-MF877-00 Page 4

Template Revision D

last updated May-2022

HP Inc. instructions for this template are available at EL-MF877-01

Step3 Press the ODD’s latch on ODD cage Step4 Remove the ODD from ODD cage

Step5 Remove front bezel from chassis

Step6 Loose the screws of Graphic card holder and rotate

it up.

EL-MF877-00 Page 5

Template Revision D

last updated May-2022

HP Inc. instructions for this template are available at EL-MF877-01

Step7 Remove the SATA cable and Power cable from cage Step8 Use T-15 screwdriver to loose the screws of HDD and

release HDD latch.

Step9 Remove HDD from HDD cage. Step10 Disconnect system fan cable from MB

Step11 Disconnect Cooler Fan cable from MB Step12 Use T-15 screw driver to loose the cooler screws and

remove cooler from MB

EL-MF877-00 Page 6

Template Revision D

last updated May-2022

HP Inc. instructions for this template are available at EL-MF877-01

Step13 Use T-15 screwdriver to loose the screws and

remove the fan

Step14 Separate the fan from CPU heat sink

Step15 Remove memory from the MB

Step16 Rotate the handle and open it up

Step17 Remove

the CPU from the board

Step18 Remove SSD M.2 Card

Memory*2

EL-MF877-00 Page 7

Template Revision D

last updated May-2022

HP Inc. instructions for this template are available at EL-MF877-01

Step19 Remove WLAN M.2 Card

Step20 Remove the battery from the system board

Step21 Use T-15 screwdriver to loose the screws of MB

from board

Step22 Remove MB from chassis

SSD PCB

EL-MF877-00 Page 8

Template Revision D

last updated May-2022

HP Inc. instructions for this template are available at EL-MF877-01

Step23 Remove speaker from Chassis Step24 Remove System fan

Step25 Remove Front Antenna cable Step26 Remove Rear Antenna cable

EL-MF877-00 Page 9

Template Revision D

last updated May-2022

HP Inc. instructions for this template are available at EL-MF877-01

Step27 Use T-15 screwdriver to loose the screws of Power

supply

Step28 Press the PSU’s latch on chassis

Step29 Remove the PSU from chassis

Step30 Remove screws covered

EL-MF877-00 Page 10

Template Revision D

last updated May-2022

HP Inc. instructions for this template are available at EL-MF877-01

Step31 Remove PSU Cover

Step32 Use PH1 screw driver to remove FG screw

Step33 Disconnect fan connector and inlet connector

Step34 Loose screws and remove PCB from case

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