HP Compaq Business Desktop dx2000 uT Series Instrucciones de montaje
HP-00007-01, Appendix 3 30-June-2005
HP Restricted
Page 1
Appendix 3 Product End-of-Life Disassembly instructions
Product Identification:
Marketing Name / Model Description
HP Compaq Business Desktop dx2000 uT Series Microtower, ATX board
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the
basic instructions for the disassembly of HP products to remove components and materials requiring
selective treatment.
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in
the right column, as applicable.
Item Description
Notes
Qty items in
product.
Printed Circuit Boards (PCB) or Printed
Circuit Assemblies (PCA)
With a surface greater than 10
square cm
3 (sys board,
modem card &
power supply bd
Batteries All types including standard
alkaline and lithium coin or button
style batteries
1
Mercury containing components For example, mercury in lamps,
display backlights, scanner lamps,
switches, batteries
Liquid Crystal Displays (LCD) with a
surface greater than 100 square cm
Includes background illuminated
displays with gas discharge lamps
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing
PCB / PCT)
Electrolytic Capacitors / Condensers
measuring greater than 2.5 cm in
diameter or height
External electrical cables and cords PSU, IDE, SATA cables.
Gas Discharge Lamps
Plastics containing Brominated Flame
Retardants
Components and parts containing toner
and ink, including liquids, semi-liquids
(gel/paste) and toner
Include the cartridges, print
heads, tubes, vent chambers, and
service stations.
Components and waste containing
asbestos
Components, parts and materials
containing refractory ceramic fibers
Components, parts and materials
containing radioactive substances
HP-00007-01, Appendix 3 30-June-2005
HP Restricted
Page 2
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a
point where components and materials requiring selective treatment can be removed.
Tool Description Tool Size (if applicable)
Torx Screw Driver
Long, slender flat blade screwdriver
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials
requiring selective treatment:
MODEM CARD
1 To remove an access panel (see Figure 1 below):
a) Remove the screws that secure the access panel to the computer chassis. Some
access panels use captive thumbscrews.
b) Slide the access panel back about 1 inch (2.5 cm), and then lift it away from and
off the unit.
2 To remove the PCI modem card (see Figures 2 & 3 below):
a) Remove the right access panel.
b) Remove the screw from the top of the expansion slot that secures the modem card to
the chassis.
c) Hold the card at each end and rock it back and forth until the connectors pull free from
the socket.
SYSTEM BOARD
1 Remove both access panels (see step 1 in Modem Card).
2 To remove the front bezel, grasp the bottom of the front panel below the lowest air vent
and pull the panel out and up to release it from the chassis (see Figure 4 below).
3 To remove the diskette drive (see Figure 5 below):
a) Disconnect the power and data cables from the back of the drive.
b) Remove the four screws, two from each side, that secure the drive in the drive cage.
c) Slide the drive out of the front of the chassis.
4 Disconnect the power and data cables from the back of all installed 3.5-inch drives.
5 To remove the lower drive cage (see Figures 6 & 7 below):
a) Remove the four screws that secure the drive cage to the front of the chassis.
b) Remove the single screw that attaches the lower drive cage to the fixed upper drive
cage on the right side of the chassis.
c) Slide the lower drive cage back about 1.25 cm (1/2 inch) to release it from the
upper cage.
6 Unplug all cables from the system board.
HP-00007-01, Appendix 3 30-June-2005
HP Restricted
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7 To remove the heatsink and processor from the system board (see Figure 8 below):
a) Unplug the fan cable from the system board.
b) Use a long, slender screwdriver to unscrew the four processor retaining screws that
secure the heatsink to the system board tray.
NOTE: The spring-loaded retaining screws are captive to the heatsink.
c) Twist the heatsink to break the bond between the heatsink and the processor, and then
lift the heatsink from the processor.
d) Raise the handle on the ZIF socket to the fully open position.
e) Grasp the processor by the edges and pull it straight up from the socket.
8 To remove the system board (see Figures 9 & 10 below):
a) Remove the eight screws that secure the system board to the chassis.
b) Slide the system board toward the front of the chassis until the all rear I/O ports clear
the chassis, and then lift the system board out of the chassis.
POWER SUPPLY PCA
1 To remove the power supply (see Figures 11 & 12 below):
a) Disconnect all power cables.
b) Remove the four screws secure the power supply to the chassis.
c) Slide the power supply toward the front of the chassis, and then lift it out of the chassis.
2 To remove the cover from the power supply (see Figure 13 below):
a. Remove the five screws that secure the cover to the power supply.
b. Cut the tie-wrap that secures the cables to the chassis.
c. Lift the cover off the power supply.
3 To remove the power supply PCA:
a) Remove four screws that secure the power supply PCA to the power supply
(see Figure 14 below).
b) Remove the screws that secure the inlet and switch to the power supply
(see Figure 15 below).
c) Cut the two tie-wraps that secure cables to the power supply (see Figure 16 below).
d) Remove the grounding screw, and then remove the grounding cable
(see Figure 17 below).
e) Cut the white and black cables that connect the PFC transformer (see Figure 18 below).
f) Remove the power supply PCA from the power supply.
BATTERY
To remove the battery (see Figures 19 & 20 below):
a) Locate the battery and battery holder on the system board.
b) Pull back on the clip that holds the battery in place, and then remove the battery.
HP-00007-01, Appendix 3 30-June-2005
HP Restricted
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3.2 ILLUSTRATIONS
FIGURE 1: Removing the access panel FIGURE 2: Modem card
FIGURE 3: Removing a PCI expansion card
FIGURE 4: Removing the front bezel
FIGURE 5: Removing a diskette drive FIGURE 6: Drive cage
HP-00007-01, Appendix 3 30-June-2005
HP Restricted
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FIGURE 7: Removing the lower drive cage FIGURE 8: Removing the heatsink and
processor
FIGURE 9: System board
FIGURE 10: Removing the system board
FIGURE 11: Power supply FIGURE 12: Removing the power supply
HP-00007-01, Appendix 3 30-June-2005
HP Restricted
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FIGURE 13: Tie wrap to cut FIGURE 14: Power supply PCA screws
FIGURE 15: Inlet and Switch screws FIGURE 16: Tie wraps to cut
FIGURE 17: Grounding screw FIGURE 18: PFC cables – cut location
HP-00007-01, Appendix 3 30-June-2005
HP Restricted
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FIGURE 19: Battery location on system
board
FIGURE 20: Removing the battery
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