HP JG589A Instrucciones de montaje

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PSG instructions for this template are available at EL-MF877-01

Product End-of-Life Disassembly Instructions

Product Category: Networking Equipment

Marketing Name / Model

[List multiple models if applicable.]

HP A-MSR OAP FIC Module（JG277A）

HP MSR OAP VMware vSphere FIC Module（JG533A）

HP SBM FIC-OAP Module（JG589A）

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description

Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

Batteries

All types including standard alkaline and lithium coin

or button style batteries

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

External electrical cables and cords

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing

refractory ceramic fibers

Components, parts and materials containing

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radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Screw driver

Continuous vacuum desoldering system

Desoldering tip

Damp sponge

Flux-cored solder

tweesers

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Remove shielding finger 2 from filler panel 1.

2. Remove film 3 from filler panel 1.

3. Unscrew the screws on radiator 4, and then remove radiator 4.

4. Unscrew the screws on PCB 6, and then remove PCB 6.

5. Unscrew the screws on part 5, and then remove part 5.

6. Unscrew the screws on PCB 7, and then remove PCB 7.

7. Remove conformal coating (if any) and clean work area of any contamination, oxides, adhesives, residues or fluxes.

8. Install thermal drive desoldering tip handpiece.

9. Start with tip temperature of approximately 315°C and change as necessary.

10. Thermal shock tip with damp sponge.

11. Tin tip with solder. (See Figure 2.)

12. Confirm complete solder melt of contacted lead. (See Figure 3.)

13. For a flat lead, move lead back and forth; for a round lead, use a circular motion and apply vacuum while continuing

lead movement. (See Figures 4&5.)

14. Lift tip from lead, hold vacuum for an additional 3 seconds to clear all molten solder from heater chamber. (See Figure

6.)

15. Repeat for all solder connections.

16. Re-tin tip end with solder and return handpiece to its stand.

17. Lift the component body free of the printed board.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

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Figure 1 Treatments to filler panel

Figure 2 Position Tip

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Figure 3 Melt Solder

Figure 4 Move Lead & Apply Vacuum

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PSG instructions for this template are available at EL-MF877-01

Figure 5 Move Lead & Apply Vacuum

Figure 6 Lift Handpiece

4. Revised record

Date

Version

Author

Modify content

2012.11.09

Wu Xuejun

Add the module JG587A and JG589A

Este manual sirve para los siguientes modelos

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