HP ELITE X3 Manual
HP Elite x3
Maintenance and Service Guide
IMPORTANT! This document is intended for HP
authorized service providers only.
© Copyright 2016 HP Development Company,
L.P.
Bluetooth is a trademark owned by its
proprietor and used by HP Inc. under license.
Adreno, Fluence, Qualcomm, and Snapdragon
are trademarks of Qualcomm Incorporated,
registered in the United States and other
countries, used with permission. Windows is a
trademark of the Microsoft group of
companies. SD Logo is a trademark of its
proprietor.
The information contained herein is subject to
change without notice. The only warranties for
HP products and services are set forth in
the express warranty statements
accompanying such products and services.
Nothing herein should be construed as
constituting an additional warranty. HP shall
not be liable for technical or editorial errors or
omissions contained herein.
Second Edition: November 2016
First Edition: August 2016
Document Part Number: 855138-002
Product notice
This guide describes features that are common
to most products. Some features may not be
available on your device.
Not all features are available in all editions or
versions of Windows. Systems may require
upgraded and/or separately purchased
hardware, drivers, software or BIOS update to
take full advantage of Windows functionality.
See http://www.microsoft.com.
To access the latest user guides or manuals for
your product, go to http://www.hp.com/
support, and select your country. Select Find
your product, and then follow the on–screen
instructions.
Software terms
By installing, copying, downloading, or
otherwise using any software product
preinstalled on this device, you agree to be
bound by the terms of the HP End User License
Agreement (EULA). If you do not accept these
license terms, your sole remedy is to return the
entire unused product (hardware and software)
within 14 days for a refund subject to the
refund policy of your place of purchase.
For any further information or to request a full
refund of the device, please contact your local
point of sale (the seller).
Table of contents
1 Product description ....................................................................................................................................... 1
2 External component identication .................................................................................................................. 3
Front ....................................................................................................................................................................... 3
Back ........................................................................................................................................................................ 6
Labels ..................................................................................................................................................................... 8
3 Illustrated parts catalog ................................................................................................................................ 9
Major components ................................................................................................................................................. 9
Miscellaneous parts ............................................................................................................................................. 11
4 Removal and replacement preliminary requirements ..................................................................................... 12
Tools required ...................................................................................................................................................... 12
Service considerations ......................................................................................................................................... 12
Plastic parts ....................................................................................................................................... 13
Cables and connectors ...................................................................................................................... 13
Grounding guidelines ........................................................................................................................................... 13
Electrostatic discharge damage ........................................................................................................ 13
Packaging and transporting guidelines .......................................................................... 15
Workstation guidelines ................................................................................ 15
5 Removal and replacement procedures ........................................................................................................... 17
Component replacement procedures .................................................................................................................. 17
Card reader tray ................................................................................................................................................... 17
End cap ................................................................................................................................................................. 18
Display panel assembly ....................................................................................................................................... 19
Chassis and battery removal ............................................................................................................................... 27
Rear camera ......................................................................................................................................................... 30
System board ....................................................................................................................................................... 32
Front camera ........................................................................................................................................................ 34
Iris camera ........................................................................................................................................................... 35
Antenna board ..................................................................................................................................................... 36
Back cover ............................................................................................................................................................ 37
6 Specications .............................................................................................................................................. 38
iii
7 Power adapter requirements ........................................................................................................................ 39
Requirements for all countries ............................................................................................................................ 39
Requirements for specic countries and regions ................................................................................................ 39
8 Recycling .................................................................................................................................................... 41
Index ............................................................................................................................................................. 42
iv
1 Product description
Category Description
Product Name HP Elite x3
Processor and chipset Qualcomm® MSM 8996 SnapdragonTM 820 Quad Core Processor
Graphics AdrenoTM 530 GPU (integrated in the MSM 8996 processor)
Panel 5.96 inch (15.14 cm), WQHD 2560x1440 AMOLED, 16:9 aspect ratio, 494 PPI, Gorilla Glass4 with
anti-smudge coating. Viewing Angle: 85’/85’/85’/85’. Brightness: typical 350 nits (cd/m2)
Supports passive pen and multi-touch
Memory 4 GB LPDDR4 memory, integrated onto system board, dual channel x32 Package on Package
(PoP) 32 Gbit
Storage eMMC 5.1
64 GB eMMC, integrated onto system board
Your device has read/write support for SDXC microSD cards up to 2 TB
Audio and video Three internal microphones
One external microphone from audio-out (headphone)/audio-in (microphone) combo jack
Stereo speakers, one speaker sharing with earpiece, speaker rated power is 0.6 W per channel,
short-term maximum power is 1.2 W
Snapdragon Audio+ audio support, B&O Branding
Qualcomm FluenceTM Pro technology
16.0 MP full-frame high-denition (HD) rear-facing camera, with single LED ash, and low light
capabilities. (Phase detection auto focus support planned for future Over The Air (OTA) upgrade)
8.0 MP full-frame HD front-facing camera, with low light capabilities
2.4 MP IRIS scan (Iris Recognition)
Sensors Accelerometer + Gyroscope
Ambient light sensor (ALS) + Proxy combo
Pressure
e-Compass
Near Field Communication (NFC)
Sensor Hub (SSC on MSM 8996 processor)
Hall eect sensor
Wireless networking Integrated WLAN option:
802.11 ac/a/b/g/n, dual band 2x2 Multiple-Input and Multiple-Output (MIMO) with dual antenna
Miracast/Wi-Fi Direct mirroring
Bluetooth 4.0+ LE and security
Near eld communication (NFC):
NXP (NQ210)
1
Category Description
WWAN:
●EMEA+ APC+Chile–2G: 850/900/1800/1900 MHz, 3G: B5/8/2/1/4, 4G: FDD
B1/3/5/7/8/19/20/26/28, TDD B38/39/40/41 (roaming bands B2/4/17/12/29 are desired
but no tests and performance conformance are required), 2DL CA: B3+B20, B3+B7, B20+B7,
B7+B28, B1+B3, B3+B5, B3+B8, B1+B5, B3+B28, TDD Intra CA; Frequency Ranges: LB
703-960 MHz, MB 1710-2170 MHz; HB 2300-2400 MHz, 2496-2690 MHz
●Americas (excluding Chile)–2G: 850/900/1800/1900MHz, 3G: B5/8/2/1/4, 4G: FDD
B2/4/5/7/12/17/29/30 (roaming bands B1/3/20 are desired but no tests and performance
conformance are required), 2DL CA: B2+B29, B4+B29, B2+B17, B4+B17, B2+B12, B4+B12,
B4+B7; Frequency Ranges: LB 699-960 MHz; MB 1710-2170 MHz; HB 2496-2690 MHz
Select products support two SIM cards
External expansion MicroSD card slot expandable up to 2 TB, plus security feature
Ports ●Audio: 3.5 mm both 3- and 4-pole audio-out (headphone)/audio-in (microphone) combo
jack for headset
●USB Type-C power connector and charging port
●Dual Nano SIM card or Nano SIM+ microSD card via 3-in-2 card tray
●Video out via USB Type-C power connector and charging port, DisplayPort Alternate Mode
●POGO pin connector
Docking HP Elite x3 Desk Dock
HP Elite x3 Lap Dock
Power requirements Battery
Non-removable, 3.85 V, Pack capacity is 15.98 Wh Long Life Battery (LLB).
Battery capacity is typical 4,150 mAh Lithium-Polymer, 1S1P
Adapter
USB charging, via USB Type-C power connector and charging port (not available for Taiwan)
Wall adaptor: 5 V/2 A 10 W
Wireless charging, WPC(Qi)/PMA dual mode
Full range (110-240 V)
Power cord
USB Type C to USB A cable (1.0 m)
Operating system Preinstalled:
●Windows® 10 Mobile - Dual SIM
●Windows 10 Mobile - Single SIM
●Operating system OTA upgrade for 2 years after purchase
Serviceability End user replaceable parts:
●AC adapter
2 Chapter 1 Product description
2 External component identication
Front
Front 3
Component Description
(1) Power light ●Red: The battery is near depletion and is being charged.
This light will remain on until the battery is charged
enough for the device to be functional.
●Green: AC power is connected and the battery is fully
charged.
(2) Ambient light sensor Detects the light in the surrounding area and then adjusts the
brightness of the display.
To set automatic brightness adjustment:
▲Swipe down from the top of the screen, tap All
settings, tap System, tap Display, and then follow the on-
screen instructions.
(3) Earpiece Produces sound for phone calls.
(4) Audio-out (headphone)/Audio-in (microphone)
combo jack
Connects optional powered stereo speakers, headphones,
earbuds, a headset, or a television audio cable. Also connects an
optional headset microphone. This jack does not support
optional microphone-only devices.
WARNING! To reduce the risk of personal injury, adjust the
volume before using headphones, earbuds, or a headset. For
additional safety information, see the Regulatory, Safety and
Environmental Notices.
To access this guide:
▲
Swipe up from the middle of the Start screen, tap
HP Device Hub, and then tap User Guide. Select your
language if prompted to do so, and then tap Regulatory,
Safety and Environmental Notices.
IMPORTANT: You must be connected to the Internet to access
the latest version of the document.
NOTE: When a device is connected to the jack, the external
speakers are disabled.
(5) Camera Records video and captures photographs.
To use your camera:
▲
Tap on the Start screen.
(6) Iris camera Allows iris recognition to unlock your device, instead of a PIN.
(7) Power button ●When the device is o, press the button for about 5
seconds until the device vibrates to turn on the device.
●When the device is on, press the button briey to turn o
and lock the screen.
●When the screen is o, press the button to display the lock
screen.
●When the device is on, press and hold the button until the
slide down to power o message appears. Release the
button, and then swipe down to turn o the device.
NOTE: The device will power on when connected to a power
source.
4 Chapter 2 External component identication
Component Description
(8) Volume up button Increases speaker volume incrementally while you hold down
the button. The volume status bar appears when you press this
button.
(9) Volume down button Decreases speaker volume incrementally while you hold down
the button. The volume status bar appears when you press this
button.
(10) Internal microphone Transmits sound for phone calls and records sound for other
applications on your device.
(11) Speaker Produces sound.
(12) USB Type-C power connector and charging port Connects to the AC adapter to provide power to the device,
connects to the desk dock, or connects to any USB device with a
Type-C connector.
NOTE: Adapters (purchased separately) may be required.
(13) Nano SIM/microSD memory card reader Supports a nano subscriber identity module (SIM) card and a
microSD memory card in a dual-compartment tray. Select
products support two SIM cards.
Place your ngernail in the small recess on the bottom of the
card tray and pull the tray out to remove it from the device.
NOTE: Your device has read/write support for microSD
memory cards up to 2 TB.
Front 5
Back
Component Description
(1) WWAN antennas* Send and receive wireless signals to communicate with wireless
wide area networks (WWANs).
(2) WLAN antennas* Send and receive wireless signals to communicate with wireless
local area networks (WLANs).
(3) Secondary microphones Record sound.
(4) Flash and ashlight Provides light for photographs and videos, and can operate as a
ashlight.
To access the ashlight:
▲Swipe down from the top of the screen, tap Expand, and
then tap Flashlight.
Tap Flashlight again to turn o the ashlight.
(5) Fingerprint reader Allows a ngerprint recognition to unlock your device instead of
a PIN.
NOTE: The ngerprint reader may require additional software.
For more information, go to http://www.hp.com/support.
6 Chapter 2 External component identication
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