Hitachi S10Mini SV.Link Manual de usuario

First Edition, July 2001, SME-1-116(A)

The contents of this publication may be revised without prior notice.

No part of this publication may be reproduced in any form or by any means without permission

in writing from the publisher.

Printed in Japan.

BI-NR-HS<HE-HE>(FL-MW97)

SAFETY PRECAUTIONS

Be sure to read this manual and all other attached documents carefully before installing, operating

inspecting or conducting maintenance on this unit. Always use this unit properly. Be sure to

carefully read the information about the device, the safety information and precautions before using

this unit. Be sure that the person(s) responsible for maintenance receives and understands this

manual completely.

This manual divides the safety precautions into DANGERs and CAUTIONs.

: Failure to observe these warnings may result in death or serious injury.

: Failure to observe these cautions may result in injury or property damage.

Failuretoobserveany may lead to serious consequences.

All of these DANGERs and CAUTIONs provide very important precautions and should always be

observed.

Additional safety symbols representing a prohibition or a requirement are as follows:

DANGER

CAUTION

: Prohibition. For example, “Do not disassemble” is represented by:

: Requirement. For example, if a ground is required, the following will be shown:

CAUTION

DANGER

iDevise an emergency stop circuit, interlock circuit, and other similar circuits

outside the programmable controller. Disregarding this rule may result in

damage to the equipment or cause an accident if the programmable controller

fails.

iKeep it in mind that this hardware unit operates on a high voltage. If the user

touches a high-voltage terminal inadvertently during connection or disconnection

of this hardware unit or its cable, he or she may suffer from an electric shock.

Also, this hardware unit may be damaged due to a short circuit or noise. Be

sure to switch off the hardware unit before connecting or disconnecting it or its

cable.

iTurn off the power before making connections to the terminal block. Wiring

with the power turned on may incur electrical shock hazards.

CAUTION

iThis hardware unit may fail if the ambient temperature is too high. The

hardware unit may also malfunction due to interference by electromagnetic

waves from adjacent hardware. To dissipate heat and reduce electromagnetic

interference, provide the specified mount of space between the cubicle and this

programmable controller and between the programmable controller and other

ones.

iAfter installing this hardware unit, measure temperatures near the in-cubicle

controller and the mount base during operation, and check whether the

measurements are within the limits. If the specified amount of space cannot be

provided or the measured temperature is too high, use a cooling fan.

iAt an extremely high temperature, this hardware unit may fail. Secure the

mount base to a vertical surface. If the mount base is secured horizontally,

heat does not dissipate efficiently, resulting in an extremely high temperature.

This may further cause the hardware unit to fail or its parts to deteriorate.

iThis hardware unit may be damaged due to static electricity. Ground yourself

before setting switches or connecting or disconnecting cables or connectors with

the hardware unit.

iThis hardware unit may be damaged during its installation or removal unless the

following rules are observed:

・Check that the connector pins are not damaged (bent or broken), are aligned

straight and are free from dust.

・Move the hardware unit along an imaginary vertical surface to the face of the

mount base. If the product is inserted or removed slantwise from the

connector on the mount base, connector pins may be bent.

iTurn off the power before operating the MAIN/SUB selector switch or the CPU

No. selector switch. Operating these switches with the power turned on may

cause the module to fail.

REQUIREMENT

iAn electric shock may lead to a death or burn. Noise may cause the system to

malfunction. Ground the line ground (LG), frame ground (FG), and shield

(SHD) terminals, as described below.

・Electrically insulate the mount base from the cubicle. To assure this, do not

remove the insulating sheet from the mount base.

・Ground the LG and FG terminals separately to prevent mutual interference.

The LG terminal is grounded to prevent intrusion of power line noise, while

FG and SHD terminals are grounded to suppress intrusion of line noise into

external interfaces for remote I/O modules, interface modules, and other

modules.

REQUIREMENT

iExcessive accumulation of heat in the cubicle may cause a fire or hardware

failure. When the temperature in the cubicle reaches 48℃or higher, the

maximum output current of the power supply module is limited. At 55℃, for

instance, it is limited to 5.85 A. Where this is very likely, install a cooling fan in

the cubicle or reduce the number of modules installed therein.

iIf a part in a module is damaged, do not replace the part, but replace the faulty

module in its entirety.

WARRANTY AND SERVICING

Unless a special warranty contract has been arranged, the following warranty is applicable to this

product.

1. Warranty period and scope

Warranty period

The warranty period for this product is for one year after the product has been delivered to the

specified delivery site.

Scope

If a malfunction should occur during the above warranty period while using this product under

normal product specification conditions as described in this manual, please deliver the

malfunctioning part of the product to the dealer or Hitachi Engineering Service Co., Ltd. The

malfunctioning part will be replaced or repaired free of charge. If the malfunctioning part is

shipped, however, the shipment charge and packaging expenses must be paid for by the customer.

This warranty is not applicable if any of the following are true.

iThe malfunction was caused by handling or use of the product in a manner not specified in the

product specifications.

iThe malfunction was caused by a unit other than that which was delivered.

iThe malfunction was caused by modifications or repairs made by a vendor other than the

vendor that delivered the unit.

iThe malfunction was caused by a relay or other consumable which has passed the end of its

service life.

iThe malfunction was caused by a disaster, natural or otherwise, for which the vendor is not

responsible.

The warranty mentioned here means the warranty for the individual product that is delivered.

Therefore, we cannot by held responsible for any losses or lost profits that result from the

operation of this product or from malfunctions of this product. This warranty is valid only in

Japan and is not transferable.

2. Range of services

The price of the delivered product does not include on-site servicing fees by engineers. Extra

fees will by charged for the following:

iInstruction for installation and adjustments, and witnessing trial operations.

iInspections, maintenance and adjustments.

iTechnical instruction, technical training and training schools.

iExaminations and repairs after the warranty period is concluded.

iEven if the warranty is valid, examination of malfunctions that are caused by reasons outside

the above warranty scope.

PREFACE

We greatly appreciate your making use of the CPU option SV.LINK module.

This hardware manual on the option SV.LINK describes how to handle the SV.LINK module. Read

this manual carefully to use the module properly.

* MELSEC is a trademark of MITSUBISHI ELECTRIC CORPORATION.

* Microsoft® Windows® operating system, Microsoft® Windows® 95 operating system and

Microsoft® Windows® 98 operating system are registered trademarks of Microsoft Corporation in

the United States and/or other countries.

CONTENTS

1. BEFORE USE ······················································································································ 1

1.1 CPU mount base ············································································································ 2

1.2 Mounting Optional Modules··························································································· 2

1.3 Ground Wiring ················································································································ 4

2. SPECIFICATIONS··············································································································· 5

2.1 Usage······························································································································· 6

2.2 Specifications ·················································································································· 6

2.2.1 System specifications································································································ 6

2.2.2 Line specifications ···································································································· 7

2.2.3 High-speed I/O communication specifications ························································· 7

3. NAMES AND FUNCTIONS OF EACH PART AND CABLING······································ 9

3.1 Names and Functions of Each Part ················································································· 10

3.2 Cabling ···························································································································· 12

4. USER GUIDE······················································································································· 15

4.1 System Configuration of 10BASE-5··············································································· 16

4.2 10BASE-T System Configuration··················································································· 22

4.3 System Definition Information························································································ 24

4.3.1 Physical address ········································································································ 24

4.3.2 IP address ·················································································································· 24

4.3.3 Subnetwork mask······································································································ 26

4.3.4 Route information ····································································································· 26

4.4 Software Configuration of ET.NET················································································ 27

4.5 SV.LINK System Programs ···························································································· 28

4.5.1 High-speed I/O communication program·································································· 28

4.5.2 UDP program ············································································································ 28

4.5.3 IP program················································································································· 28

4.5.4 Driver ························································································································ 28

4.6 User-created Program······································································································ 29

4.6.1 Ladder program········································································································· 29

4.7 Status and Communication Parameter Areas·································································· 30

4.8 Communication Start Procedure and Communication Delay Time Setup······················ 37

4.8.1 Communication start procedure················································································ 37

iii

4.8.2 Communication delay time setup ·············································································· 38

4.9 Ladder Program Example································································································ 39

4.10 Relationship to CPU Module ·························································································· 41

4.11 Communication Cycle ····································································································· 42

4.12 Limitations······················································································································· 43

5. OPERATION ························································································································ 45

5.1 Start-up Procedure ··········································································································· 46

6. MAINTENANCE ················································································································· 49

6.1 Maintenance Inspection··································································································· 50

6.2 Troubleshooting··············································································································· 51

6.2.1 Procedure··················································································································· 51

6.2.2 Before suspecting a failure ························································································ 52

6.3 Errors and Actions To Be Taken ····················································································· 54

6.3.1 CPU LED display messages ······················································································ 54

6.3.2 Hardware errors········································································································· 55

6.3.3 Communication error codes ······················································································ 58

7. APPENDIX ··························································································································· 61

7.1 SV.LINK State Transitions······························································································ 62

7.2 CPU Memory Map ·········································································································· 63

7.3 Memory Map of SV.LINK Module················································································· 64

7.4 Trouble Investigation Sheet····························································································· 65

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