Haier TV-8888-09 Manual de usuario

HAIER

COLOR TELEVISION

SERVICE MANUAL

PART # TV-8888-09

HAIER AMERICA TRADING, LLC

www.haieramerica.com

TABLE OF CONTENTS

Safety Precautions 3

Servicing Precautions 4 – 5

Electrostatically Sensitive (ES)

Devices

General Soldering Guidelines 7

“Small Signal” Discrete transistor 8

Power Output, Transistor Device 8

Diode 8

Fuse and Conventional Resistor 8

Circuit Board Foil Repair 9

Product Functions 10

Alignments & Adjustments 11 – 14

Adjustment Item Explanation 15

Setting Item Explanation 16 – 17

IC reference Data 18 – 19

Troubleshooting 20 – 25

Bulk Diagram 26

Schematic Diagram 27

SAFETY PRECAUTIONS

IMPORTANT SAFETY NOTICE

The parts identified by many electrical and mechanical parts in this chassis have

special safety-related characteristics. in the Schematic Diagram and Replacement

Parts List.

It is essential that these special safety parts be replaced with the same components

as recommended in this manual to prevent X-RADIATION, Shock, Fire, or other

Hazards.

Do not modify the original design without the permission of the manufacturer.

General Guidance

An Isolation Transformer should always be used during the servicing of a receiver

whose chassis is not isolated from the AC power line. Use a transformer of adequate

power rating as this protects the technician from accidents that might result in

personal injury caused by electrical shocks.

It will also protect the receiver and it’s components from being damaged by

accidental shorts of the circuitry that might be inadvertently introduced during the

service operation.

If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with a

specified one.

When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1W), keep

the resistor 0.39 inch away from PCB.

Keep wires away from high voltage or high temperature parts.

Due to the high vacuum and large surface area of the picture tube, extreme care

should be taken in handling the Picture Tube. Do not lift the Picture Tube by its Neck.

X-RAY Radiation

Warning:

The source of X-RAY RADIATION in this TV receiver is the High Voltage Section and

the Picture Tube.

For continued X-RAY RADIATION protection, the replacement tube must be of the

same type as specified in the Replacement Parts List.

Before returning the receiver to the customer, always perform an AC leakage

current check on the exposed metallic parts of the cabinet, such as antennas,

terminals, etc., to make sure that the set is safe to operate without any danger of

electrical shock.

SERVICING PRECAUTIONS

CAUTION: Before servicing receivers covered by this service manual and its

supplements, please read and follow the SAFETY PRECAUTIONS.

NOTE: If unforeseen circumstances create conflict between the following servicing

precautions and any of the safety precautions, always follow the safety precautions.

Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power source before:

a. Removing or reinstalling any component, circuit board module or any other

assembly of the receiver.

b. Disconnecting or reconnecting any receiver electrical plug or other electrical

connection.

c. Connecting a test substitute in parallel with an electrolytic capacitor in the

receiver.

CAUTION: A wrong substituted part or incorrect installation polarity of electrolytic

capacitors may result in an explosion hazard.

d. Discharging the picture tube anode.

2. Test high voltage only by measuring it with an appropriate high voltage meter or

other voltage-measuring device (DVM, FETVOM, etc.) equipped with a suitable high

voltage probe. Do not test high voltage by “drawing an arc”.

3. Discharge the picture tube anode only by

(a) First connecting one end of an insulated clip lead to the degaussing or kine

aquadag grounding system shield at the point where the picture tube socket

ground lead is connected, and then

(b) Touch the other end of the insulated clip lead to the picture tube anode

button, using an insulated handle to avoid personal contact with high voltage.

4. Do not spray chemicals on or near this receiver or any of its assemblies.

5. Unless specified otherwise in this service manual, clean electrical contacts only by

applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick

or comparable nonabrasive applicator; 10% (by volume) Acetone and 90% (by

volume) isopropyl alcohol (90%-99% strength)

CAUTION: This is a flammable mixture. Unless specified otherwise in this service

manual, lubrication of contacts is not required.

6. Do not delete any plug / socket B+ voltage interlocks with which receivers

covered by this service manual might be equipped.

7. Do not apply AC power to this instrument and/or any of its electrical assemblies

unless all solid-state device and heat sinks are correctly installed.

8. Always connect the test receiver ground lead to the receiver chassis ground before

connecting the test receiver positive lead. Always remove the test receiver ground

lead last.

9. Use with this receiver only for the test fixtures specified in this service manual.

CAUTION: Do not connect the test fixture ground strap to any heat sink in this

receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid state) devices can be damaged easily by static electricity.

Such components are usually called Electrostatically Sensitive (ES) Devices.

Examples of typical ES devices are integrated circuits and some field effect

transistors and semiconductor “chip” components.

The following techniques should be used to help reduce the incidence of component

damage caused by static electricity.

1. Immediately before handling any semiconductor component or semiconductor-

equipped assembly, drain off any electrostatic charge on your body by touching a

known earth ground. Alternatively, obtain and wear a commercially available

discharging wrist strap device, which should be removed to prevent potential shock

prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the

assembly on a conductive surface such as aluminum foil, to prevent electrostatic

charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static type folder removal device. Some solder removal devices

not classified as “anti-static” can generate electrical charges sufficient to damage ES

devices.

5. Do not use frond-propelled chemicals. These can generate electrical charges

sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until you are

ready to install it. (Most replacement ES devices are packaged with leads electrically

shorted together by conductive foam, aluminum foil or comparable conductive

material).

7. Immediately before removing the protective material from the leads of a

replacement ES device, touch the protective material to the chassis or circuit

assembly into which the device will be installed.

CAUTION: Ensure no power is applied to the chassis or circuit, and observe all other

safety precautions.

8. Minimize bodily motions when handling an unpackaged replacement ES device.

(Even some normally harmless motions such as mutual brushing of your clothes’

fabric or lifting of your foot from a carpeted floor might generate static electricity

sufficient to damage an ES device.)

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape

that will maintain tip temperature within the range of 500oF to 600oF.

2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40

parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wire bristle (0.5 inch)

brush with a metal handle. Do not use propelled-propelled spay-on cleaners.

5. Use the following unsoldering technique

a. Allow the soldering iron tip to reach normal temperature i.e. 500 oF to 600 oF

b. Heating the component lead until the solder melts.

c. Quickly draw the melted solder with an anti-static, suction-type solder removal

device with solder braid.

Caution: Work quickly to avoid overheating the circuit board printed foil.

6. Use the following unsoldering technique

a. Allow the soldering iron tip to reach normal temperature. (500 oF to 600 oF)

b. First, hold the soldering iron tip and solder the strand against the component lead

until the solder melts.

c. Quickly move the soldering iron tip to the junction of the component lead and the

printed circuit foil, and hold it there only until the solder flows onto and around both

the component lead and the foil.

Caution: Work quickly to avoid overheating the circuit board printed foil.

d. Closely inspect the solder area and remove any excess or splashed solder with a

small wire-bristle brush.

Remove /Replacement

Some chassis circuit boards have slotted holes (oblong) through which the IC leads

are inserted and then bent flat against the circuit foil.

When holes are of slotted type, the following technique should be used to remove

and replace the IC.

When working with boards using the familiar round hole, use the standard technique

as outlined.

Removal

De-solder and straighten each IC lead in one operation by gently prying up on the

lead with the soldering iron tip as the solder melts.

Draw away the melted solder with an anti-static suction-type solder removal device

(or with solder braid) before removing the IC.

Replacement

Carefully insert the replacement IC in the circuit board.

Carefully bend each IC lead against the circuit foil pad and solder it.

Clean the soldered areas with a small wire-bristle brush. (It is unnecessary to

reapply acrylic coating to the areas).

“Small-Signal” Discrete transistor

Removal/Replacement

• Remove the defective transistor by clipping its leads as close as possible to

the component body.

• Bend into a “U” shape the end of each of three leads remaining on the circuit

board.

• Bend into a “U” shape the replacement transistor leads.

• Connect the replacement transistor leads to the corresponding leads

extending from the circuit board and crimp the “U” with long nose pliers to

insure metal to metal contact then solder each connection.

Power Output, Transistor Device

Removal/Replacement

• Heat and remove all solder from around the transistor leads.

• Remove the heat sink mounting screw (if so equipped).

• Carefully remove the transistor from the heat sink of the circuit board.

• Insert new transistor in the circuit board.

• Solder each transistor lead, and clip off excess lead.

• Replace heat sink.

Diode Removal/Replacement

Remove defective diode by clipping its leads as close as possible to diode body.

Bend the two remaining leads perpendicularly to the circuit board.

Observing diode polarity, wrap each lead of the new diode round the corresponding

lead on the circuit board.

Securely crimp each connection and solder it.

Inspect (on the circuit board copper side) the solder joints of the two “original” leads.

If they are not shiny, reheat them and if necessary, apply additional solder.

Fuse and Conventional Resistor

Removal/Replacement

1. Clip each fuse or resistor lead at the top of the circuit board hollow stake.

2. Securely clamp the leads of replacement component around the notch at stake

top.

3. Solder the connections

Caution: Maintain original spacing between the replaced component and adjacent

components and the circuit board to prevent excessive component temperatures.

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit board will weaken the

adhesive that bonds the foil to the circuit board causing the foil to depart from or

“lift-off” the board.

The following guidelines and procedures should be followed whenever this condition

is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the following procedure to

install a jumper wire on the copper pattern side of the circuit board. (Use this

technique only on IC connections).

1. Carefully remove the damaged copper pattern with a sharp knife i.e. as absolutely

necessary).

2. Carefully scratch away the solder resist and acrylic coating (if used) from the end

of the remaining copper pattern.

3. Bend a small “U” in one end of a small gauge jumper wire and carefully crimp it

around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copper pattern and let it

overlap with the previously scraped end of the good copper pattern. Solder the

overlapped area and clip off any excess jumper wire.

At other connections

Use the following technique to repair the defective copper pattern at connections

other than IC Pins. This technique involves the installation of a jumper wire on the

component side of the circuit board.

1. Remove the defective copper pattern with a sharp knife.

Remove at least 1/4 inch of copper, to insure that a hazardous condition will not

exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern break and locate the

nearest component that is directly connected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the nearest component

on one side of the pattern break to the lead of the nearest component on the other

side. Carefully clamp and solder the connections.

Caution: Ensure the insulated jumper wire is dressed so that it does not touch

components or sharp edges.

PRODUCT FUNCTIONS

FUNCTIONS TYPE TN131AUV

IC LA76814 OTHER Type of power plug

Tube PF V-CHIP CCD

√

Color system NTSC

Broadcast system M

No. Of preset channels 181

CATV band width

Blue/black screen

Menu OSD √

OSD language English/French/ Spanish

Manifold PIC modes √

Program preview

Y/C separation circuit

Denoise circuit

Black level extend √

Blue level extend

Auto skin color correction

Adjustment

Dynamic high voltage stabilizing

Dynamic focusing

Double focusing

Dynamic white peak clipping

Color resolution lift

4:2: 2 PIC window positioning

Pull-curtain type on /off display

Artificial intelligence

SVM

A CTI

G LTI

Video signal digitalization

Teletext √

Still frame

Multi PIC Frames

PIP independent tuner

PIP double tuner

PIC out PIC

9 programs preview

100Hz

ZOOM

Stepless zoom in/out

16: 9 mode

Logo configure

Skip √

Supper receiver

Calendar

Memo book/games

Favorite channels

Child lock

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