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FUSES
TO REPLACE THE AC LINE FUSE, REMOVE THE LINE CORD FROM THE
BACK
OF
THE
UNIT. WITH A
SMALL
FLAT BLADE SCREWDRIVER, REMOVE THE SQUARE VOLTAGE
CONFIGURATION BLOCK. THE FUSE IS LOCATED INSIDE. REPLACE THE FUSE AND
THEN REPLACE THE CLOCK INSURING THAT THE WHITE ARROW IS NEXT TO THE
VOLTAGE DESIRED WHEN THE
BLOCK
HAS
BEEN
REINSTALLED.
TO REPLACE THE
DC
FUSE, REMOVE THE TOP PANEL. THE
DC
FUSE
IS
LOCATED
ON
THE REGULATOR BOARD
ON
THE RIGHT SIDE OF THE UNIT FACING THE FRONT
PANEL.
INTEGRATED CIRCUITS
ALL
INTEGRATED CIRCUITS HAVE
BEEN
MADE EASY
BY
THE USE OF SOCKETS FOR
THESE DEVICES.
AN
IC
PULLER
TOOL
IS RECOMMENDED FOR REMOVING THE
IC
CHIPS AND
AN
INSERTION DEVICE IS RECOMMENDED FOR REPLACING THE CHIPS TO
PREVENT BENDING THE PINS. WHEN REPLACING THE CHIPS INSURE THAT
ALL
PINS
ON
THE CHIP ARE MATCHED
UP
WITH THE SOCKET TO INSURE GOOD CONTACT.
RF
AND POWER TRANSISTORS
TO REPLACE
RF
AND POWER TRANSISTORS, A FEW TOOLS WILL BE REQUIRED
AS
THE DEVICES ARE SOLDERED AND BOLTED INTO THE UNIT. TO UNSOLDER THE
DEVICES ALWAYS USE APPROVED DESOLDERING TOOLS SUCH
AS
SOLDER WICK
AND SOLDER SUCKERS.
IN
THE CASE OF
RF
TRANSISTOR, AFTER REMOVING THE
SOLDER, CAREFULLY LIFT THE TABS CLEAR OF THE BOARD BEING CAREFUL NOT TO
DAMAGE THE FOIL
ON
THE PRINTED CIRCUIT BOARD. MAKE A DIAGRAM OF
ALL
COMPONENTS REMOVED TO ENSURE THEIR PROPER REPLACEMENT
IN
THE EXACT
POSITIONS FROM WHICH THEY CAME. WHEN REPLACING COMPONENTS USE DOW
CORNING
340
HEAT SINK COMPOUND OR EQUIVALENT
ON
THE POWER DEVICE FOR
PROPER TRANSFER
OF
HEAT TO THE HEAT SINK. USE GOOD SOLDERING PRACTICES
WHEN RESOLDERING THE DEVICES
BACK
IN
. WHEN SOLDERING
IS
COMPLETE, USE
AN
APPROVED SOLDER FLUX REMOVER TO CLEAN UP THE
AREA
WHERE THE
COMPONENT WAS REPLACED. ALWAYS INSPECT THE POWER DEVICE CAREFULLY
FOR INSULATING HARDWARE WHICH ELECTRICALLY INSULATES SOME OF THE
DEVICES FROM THE CHASSIS GROUND. THESE
WILL
BE FOUND
ON
THE POWER
TRANSISTORS AND REGULATORS
IN
THE POWER SUPPLY. THIS HARDWARE MUST
BE REPLACED FOR THE DEVICE TO WORK PROPERLY.
SMALL COMPONENTS
SMALL COMPONENTS, SUCH
AS
RESISTORS, CAPACITORS AND
SMALL
TRANSISTORS
AND DIODES, SHOULD BE REMOVED VERY CAREFULLY USING GOOD DESOLDERING
TOOLS. ALWAYS OBSERVE THE POLARITY OF DIODES AND ELECTROLYTIC
CAPACITORS AND MAKE A
SMALL
NOTE TO ENSURE THAT THE REPLACEMENT
DEVICE IS INSTALLED PROPERLY. DIODES INSTALLED WRONG MAY CAUSE DAMAGE
TO OTHER COMPONENTS AND ELECTROLYTIC CAPACITORS MAY EXPLODE IF
POLARITY
IS
NOT OBSERVED. WHEN REMOVING
SMALL
COMPONENTS, THE
COMPONENT MAY BE CRUSHED WITH
A PAIR
OF
PLIERS ANO EACH LEAD CAREFULLY
REMOVED. THE IMPORTANT ITEM
IS
NOT TO DAMAGE THE PRINTED CIRCUIT BOARD.
THE DAMAGE MOST LIKELY TO OCCUR
IS
THE LIFTING
OF
FOIL
OR
THE REMOVAL
OF
THE PLATED MATERIAL
ON
A PLATED-THROUGH HOLE
IN
THE BOARD. IF IT IS
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