EMC VNXe Manual de usuario
EMC® VNXe®
Replacing an input/output module in a disk
processor enclosure
302-000-207
REV 02
July, 2015
This document describes how to replace a faulted input/output (I/O) module in a DPE (disk
processor enclosure).
The I/O module resides on the SP printed circuit board (CPU board). To replace a faulted
I/O module, you must remove the SP assembly from the enclosure, and then remove its
cover to gain access to CPU board components.
You access an I/O module from the rear of the enclosure.
NOTICE
Always replace an I/O module with one that is the exact same type. Verify the type by
reading the label on the I/O module handle.
NOTICE
This procedure involves storage processor (SP) reboots coordinated to ensure that at least
one SP is running at all times. During an SP reboot, data will be unavailable to front- or
back-end connections that are not duplicated on the peer SP.
lBefore you start..........................................................................................................2
lHandling I/O modules................................................................................................2
lReplacing the faulted hardware component............................................................... 5
lReturning a faulted part........................................................................................... 12
Before you start
Before you begin this procedure, ensure that you have received the new part and have
correctly identify its intended location in the system. Refer to your Unisphere online help
(Servicing your system > Adding or replacing faulted hardware components > Replace a
faulted hardware component) for instructions on how to identify failures, order new parts
and handle hardware components.
NOTICE
This procedure involves storage processor (SP) reboots coordinated to ensure that at
least one SP is running at all times. During an SP reboot, data will be unavailable to front-
or back-end connections that are not duplicated on the peer SP.
Handling I/O modules
You must handle I/O modules in the same way that you handle other replaceable units.
This section describes the precautions that you must take and the general procedures
that you must follow when removing, installing, and storing any replaceable unit.
Avoiding electrostatic discharge (ESD) damage
When replacing or installing hardware units, you can inadvertently damage the sensitive
electronic circuits in the equipment by simply touching them. Electrostatic charge that
has accumulated on your body discharges through the circuits. If the air in the work area
is very dry, running a humidifier in the work area will help decrease the risk of ESD
damage. Follow the procedures below to prevent damage to the equipment.
Read and understand the following instructions:
lProvide enough room to work on the equipment.
lClear the work site of any unnecessary materials or materials that naturally build up
electrostatic charge, such as foam packaging, foam cups, cellophane wrappers, and
similar items.
lDo not remove replacement or upgrade units from their antistatic packaging until you
are ready to install them.
lBefore you begin service, gather together the ESD kit and all other materials you will
need.
lOnce servicing begins, avoid moving away from the work site; otherwise, you may
build up an electrostatic charge.
lUse ESD anti-static gloves or an ESD wristband (with strap).
If using an ESD wristband with a strap:
nAttach the clip of the ESD wristband to the ESD bracket or bare metal on a
cabinet/rack or enclosure.
nWrap the ESD wristband around your wrist with the metal button against your
skin.
nIf a tester is available, test the wristband.
lIf an emergency arises and the ESD kit is not available, follow the procedures in
Emergency procedures (without an ESD kit) on page 3.
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Emergency procedures (without an ESD kit)
In an emergency when an ESD kit is not available, use the following procedures to reduce
the possibility of an electrostatic discharge by ensuring that your body and the
subassembly are at the same electrostatic potential.
NOTICE
These procedures are not a substitute for the use of an ESD kit. Follow them only in the
event of an emergency.
lBefore touching any unit, touch a bare (unpainted) metal surface of the cabinet/rack
or enclosure.
lBefore removing any unit from its antistatic bag, place one hand firmly on a bare
metal surface of the cabinet/rack or enclosure, and at the same time, pick up the unit
while it is still sealed in the antistatic bag. Once you have done this, do not move
around the room or touch other furnishings, personnel, or surfaces until you have
installed the unit.
lWhen you remove a unit from the antistatic bag, avoid touching any electronic
components and circuits on it.
lIf you must move around the room or touch other surfaces before installing a unit,
first place the unit back in the antistatic bag. When you are ready again to install the
unit, repeat these procedures.
Hardware acclimation times
Systems and components must acclimate to the operating environment before applying
power. This requires the unpackaged system or component to reside in the operating
environment for up to 16 hours in order to thermally stabilize and prevent condensation.
Table 1 Hardware acclimation times (systems and components)
If the last 24 hours of the
TRANSIT/STORAGE
environment was this:
…and the OPERATING
environment is this:
…then let the system or
component acclimate in
the new environment
this many hours:
Temperature Humidity
Nominal
68-72°F (20-22°C)
Nominal
40-55% RH
Nominal 68-72°F (20-22°C)
40-55% RH
0-1 hour
Cold
<68°F (20°C)
Dry
<30% RH
<86°F (30°C) 4 hours
Cold
<68°F (20°C)
Damp
≥30% RH
<86°F (30°C) 4 hours
Hot
>72°F (22°C)
Dry
<30% RH
<86°F (30°C) 4 hours
Hot
>72°F (22°C)
Humid
30-45% RH
<86°F (30°C) 4 hours
Humid
45-60% RH
<86°F (30°C) 8 hours
Replacing an input/output module in a disk processor enclosure
Emergency procedures (without an ESD kit) 3
Table 1 Hardware acclimation times (systems and components) (continued)
If the last 24 hours of the
TRANSIT/STORAGE
environment was this:
…and the OPERATING
environment is this:
…then let the system or
component acclimate in
the new environment
this many hours:
Humid
≥60% RH
<86°F (30°C) 16 hours
Unknown <86°F (30°C) 16 hours
NOTICE
lIf there are signs of condensation after the recommended acclimation time has
passed, allow an additional eight (8) hours to stabilize.
lSystems and components must not experience changes in temperature and humidity
that are likely to cause condensation to form on or in that system or component. Do
not exceed the shipping and storage temperature gradient of 45°F/hr (25°C/hr).
lDo NOT apply power to the system for at least the number of hours specified in Table
1 on page 3. If the last 24 hours of the transit/storage environment is unknown, then
you must allow the system or component 16 hours to stabilize in the new
environment.
Removing, installing, or storing replaceable units
Use the following precautions when removing, handling, or storing replaceable units:
CAUTION
Some replaceable units have the majority of their weight in the rear of the component.
Ensure that the back end of the replaceable unit is supported while installing or
removing it. Dropping a replaceable unit could result in personal injury or damage to the
equipment.
NOTICE
lFor a module that must be installed into a slot in an enclosure, examine the rear
connectors on the module for any damage before attempting its installation.
lA sudden jar, drop, or even a moderate vibration can permanently damage some
sensitive replaceable units.
lDo not remove a faulted replaceable unit until you have the replacement available.
lWhen handling replaceable units, avoid electrostatic discharge (ESD) by wearing ESD
anti-static gloves or an ESD wristband with a strap. For additional information, see:
Avoiding electrostatic discharge (ESD) damage on page 2.
lHandle a replaceable unit gently. A sudden jar, drop, or vibration can permanently
damage some replaceable units.
lAvoid touching any exposed electronic components and circuits on the replaceable
unit.
lNever use excessive force to remove or install a replaceable unit. Take time to read
the instructions carefully.
4EMC VNXe
lStore a replaceable unit in the antistatic bag and the specially designed shipping
container in which you received it. Use the antistatic bag and special shipping
container when you need to return the replaceable unit.
lReplaceable units must acclimate to the operating environment before applying
power. This requires the unpackaged component to reside in the operating
environment for up to 16 hours in order to thermally stabilize and prevent
condensation. Refer to Hardware acclimation times on page 3 to ensure the
replaceable unit has thermally stabilized to the operating environment.
NOTICE
Your storage system is designed to be powered on continuously. Most components are
hot swappable; that is, you can replace or install these components while the storage
system is running. However, the system requires that:
lFront bezels should always be attached to ensure EMI compliance. Make sure you
reattach the bezel after replacing a component.
lEach slot should contain a component or filler panel to ensure proper air flow
throughout the system.
Unpacking a part
Procedure
1. Wear ESD gloves or attach an ESD wristband to your wrist and the enclosure in which
you are installing the part.
2. Unpack the part and place it on a static-free surface.
3. If the part is a replacement for a faulted part, save the packing material to return the
faulted part.
Replacing the faulted hardware component
Take the following actions to remove the faulted hardware part and install the
replacement hardware part into the system.
Summary of tasks for replacing an I/O module
To replace a faulted I/O module you must complete the tasks below in the order listed.
This document provides instructions for completing each task.
1. Prepare the SP with the faulted I/O module for service.
2. Remove the SP assembly.
3. Remove the top cover from the SP assembly.
4. Remove the faulted I/O module.
5. Unpack the replacement I/O module.
6. Install the replacement I/O module.
7. Replace the top cover on the SP assembly.
8. Reinstall the SP assembly.
9. Reboot the SP.
10. Verify that the system recognizes the replacement I/O module.
Replacing an input/output module in a disk processor enclosure
Unpacking a part 5
11. Return the faulted I/O module.
Note
The I/O modules in your DPE may differ from those shown in the illustrations in this
document.
Preparing the storage processor (SP) for service
To protect your VNXe system from accidental data loss during this maintenance activity,
you must prepare the SP for service. You prepare an SP for service by putting it in Service
mode.
NOTICE
Both SPs must NOT be in Service mode at the same time.
Procedure
1. Open Unisphere™ and select Settings, then Service System.
2. Log in with your service password.
3. In the System Components column, select the storage processor with the part you are
replacing (SP A or SP B).
4. Under Service Actions, select Enter Service Mode, then Execute service action.
5. In the Service Confirmation dialog box click OK.
Putting an SP into Service mode takes about 10 minutes to complete.
6. Wait until the SP fault LED is flashing alternating amber and blue before continuing to
the next task.
The storage processor fault LED will flash alternating amber and blue while the SP
remains in Service mode and is receiving active power (Figure 1 on page 6).
Figure 1 SP fault LED
046-004-901_03
HDMI
Removing an SP assembly
Before you begin
Locate the faulted SP assembly with the flashing alternating amber and blue Fault LED.
Figure 2 Location of SP assembly fault LED
046-004-901_03
HDMI
6EMC VNXe
NOTICE
DO NOT REMOVE an SP assembly while the "Unsafe to remove SP" LED shown below is lit.
Refer to Figure 3 on page 7 while performing the procedure that follows.
Procedure
1. Disconnect the network and all other cables from the back of the SP assembly; label
the cables with the port numbers from which you removed them.
NOTICE
Do not remove any cables from the other SP assembly.
CAUTION
The SP assembly comes completely out of the enclosure. In addition to holding the
latches, be prepared to support the SP assembly to avoid dropping it.
2. Squeeze the orange levers on the latches on the sides of the SP assembly to release
the latches, and then pull the latches outward.
3. Pull out the latches until they are fully extended and the SP assembly is released from
the enclosure.
4. Use the latches to slide the SP assembly about half-way out of the enclosure.
5. Use both hands to support the SP assembly and pull it fully out of the enclosure.
6. Place the SP assembly on a clean, flat static-free work surface.
Figure 3 Removing an SP assembly
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21
7. Wait for all LED indicators on the removed SP to turn OFF before continuing.
This will occur in about 60 seconds.
Replacing an input/output module in a disk processor enclosure
Removing an SP assembly 7
Removing the SP top cover
Refer to Figure 4 on page 8 while performing the procedure that follows.
Procedure
1. Press the blue button on the cover.
2. Push the cover straight back 1/4 inch.
3. Lift the cover up.
Figure 4 Removing the SP top cover
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1 32
Removing the I/O module
Refer to Figure 5 on page 9 while performing the procedure that follows.
Procedure
1. Lift the blue latch carefully until it ejects the I/O module from the connector.
2. Lift the module out and away from the SP assembly and place it on a static free
surface.
8EMC VNXe
Figure 5 Removing the I/O module
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21
Installing the I/O module
Refer to Figure 6 on page 10 while performing the procedure that follows.
Procedure
1. Angle the I/O module slightly so it fits into the canister and align it with the blue and
gray alignment pins.
NOTICE
Do not attempt to seat the module into the CPU connector while you are holding the
module at an angle. Doing so will damage the connections. The module should be flat
before you attempt to seat it in the connector.
2. With the I/O module aligned and parallel to the CPU board, press the blue latch down
to fully seat the module in the connector.
Replacing an input/output module in a disk processor enclosure
Installing the I/O module 9
Figure 6 Installing the I/O module
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1
Replacing the SP top cover
Refer to Figure 7 on page 10 while performing the procedure that follows.
Procedure
1. Align the cover tabs with the notches in the canister.
2. Slide it forward 1/4 inch until the tab secures the cover.
Figure 7 Replacing the SP top cover
CL5234
31 2
Installing an SP assembly
Refer to Figure 8 on page 11 while performing the procedure that follows.
Procedure
1. Pull out the latches on each side of the SP assembly and make sure they stay in the
open position.
2. Align the SP assembly with the enclosure opening and push it straight into the
enclosure.
The latches begin to close when they contact the enclosure edges.
10 EMC VNXe
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