Ehong EH-MC10 Manual de usuario

Shanghai Ehong Technologies Inc

EH-MC10

Bluetooth® technology low energy

module

•

Bluetooth® radio

- Fully embedded Bluetooth® v4.0 single mode

- TX power +6 dbm,-92.5dbm RX sensitivity

- 128-bit encryption security

- Range up to 100m

- Integrated chip antenna or U.FL port

- Multipoint capability(2devices at master)

•

Support profiles

- BLE (Master and slave)

- The generic attribute profile (GATT)

- Health care, Sports and fitness, Proximity

sensing profiles

- Alerts and timer profiles

•

User interface

- Send AT command over UART

-Firmware upgrade over the air (OTA)

-Transmit data: 300kbps transmission speed

(UART)

- I2C interface(Master )

-SPI

-PWM(4 channel)

•

General

I/O

10 general purpose I/Os

3 analogue I/O

(10bit ADC)

•

FCC and Bluetooth® qualified

•

Single voltage supply: 3.3V typical

•

Small form factor: 17.70 x 11.95x 2.2mm

•

Operating temperature range: -30 °C to 80 °C

Version 2.0

July 21 2014

Bluetooth Low Energy Module

Shanghai Ehong Technologies Co., Ltd

1. Contents

1. Description..................................................................................................................................................3

2. Applications................................................................................................................................................4

3. EH-MC10 Product numbering..................................................................................................................4

4. Electrical Characteristics .........................................................................................................................4

4.1. Recommended Operation Conditions.................................................................................................4

4.2.Absolute Maximum Rating...................................................................................................................5

4.3. Input/Output Terminal Characteristics ................................................................................................5

4.4. Power Consumption.............................................................................................................................6

5. Pinout and Terminal Description.............................................................................................................7

5.1. Pin Configuration..................................................................................................................................7

6. Physical Interfaces ....................................................................................................................................9

6.1. Power Supply........................................................................................................................................9

6.2. PIO.........................................................................................................................................................9

6.3. AIO.........................................................................................................................................................9

6.4. PWM......................................................................................................................................................9

6.5. UART...................................................................................................................................................10

6.6. I2C Master...........................................................................................................................................10

6.7. SPI Master..........................................................................................................................................10

6.8. SPI Debug...........................................................................................................................................11

7. Reference Design.....................................................................................................................................11

8. Layout and Soldering Considerations.................................................................................................11

8.1. Soldering Recommendations ............................................................................................................11

8.2. Layout Guidelines...............................................................................................................................12

9. Mechanical and PCB Footprint Characteristics .................................................................................13

10. Reflow Profile........................................................................................................................................14

11. Contact Information.............................................................................................................................15

Bluetooth Low Energy Module

Shanghai Ehong Technologies Co., Ltd

2. Table of Tables

TABLE 1: RECOMMENDED OPERATION CONDITIONS...............................................................................................4

TABLE 2：ABSOLUTE MAXIMUM RATING................................................................................................................5

TABLE 3: DIGITAL I/O CHARACTERISTICS...............................................................................................................5

TABLE 4: AIO CHARACTERISTICS...........................................................................................................................5

TABLE 5ESDPROTECTION ...................................................................................................................................6

TABLE 6: CURRENT CONSUMPTION........................................................................................................................6

TABLE 7：PINTERMINAL DESCRIPTION.................................................................................................................8

TABLE 8: POSSIBLE UART SETTINGS..................................................................................................................10

3. Table of Figures

FIGURE 1：PINOUT OF EH-MC10 ........................................................................................................................7

-FIGURE 2：POWER SUPPLY PCB DESIGN ....................................................................................................9

FIGURE 3：CONNECTION TO HOST DEVICE ........................................................................................................10

FIGURE 4：REFERENCE DESIGN.........................................................................................................................11

FIGURE 5: CLEARANCE AREA OF ANTENNA...........................................................................................................12

FIGURE 6：PHYSICAL DIMENSIONS AND RECOMMENDED FOOTPRINT (UNIT:MM,DEVIATION:0.02MM)...............13

FIGURE 7: RECOMMENDED REFLOW PROFILE .....................................................................................................14

1. Description

EH-MC10 Bluetooth® low energy single mode module is a single mode device targeted for

low power sensors and accessories.

Bluetooth Low Energy Module

Shanghai Ehong Technologies Co., Ltd

The module offers all Bluetooth® low energy features: radio, stack, profiles and application

space for customer applications, so no external processor is needed. The module also provides

flexible hardware interfaces to connect sensors, simple user interfaces or even

displays directly to the module.

The module can be powered directly with a standard 3V coin cell batteries or pair of AAA

batteries. In lowest power sleep mode it consumes only 600nA and will wake up in few hundred

microseconds.

After buying Bluetooth® module, we provide free technical support APP of iOS system or APP

Android system.

2. Applications

Sports and fitness

Healthcare

Home entertainment

Office and mobile accessories

Automotive

Commercial

Watches

Human interface devices

3. EH-MC10 Product numbering

EH-MC10X

A. EH ------------- Company Name(EHong)

B. MC10 ------------ Module Name

C. X ------------ A = Antenna B =U.FL

4. Electrical Characteristics

4.1. Recommended Operation Conditions

Table 1: Recommended Operation Conditions

Operating Condition

Min

Typical

Max

Unit

Operating Temperature Range -30 -- +80 °C

Bluetooth Low Energy Module

Shanghai Ehong Technologies Co., Ltd

Battery (VDD_BAT) operation 1.8 -- +3.6 V

I/O Supply Voltage (VDD_PIO) 1.2 -- +3.6 V

AIO input 0 - +1.3 V

Frequency range 2402 2480 MHz

Table 2：Absolute Maximum Rating

4.2. Absolute Maximum Rating

* Short-term operation up to a maximum of 10% of product lifetime is permissible without damage, but output

regulation and other specifications are not guaranteed in excess of 4.2V.

4.3. Input/Output Terminal Characteristics

Table 3: Digital I/O Characteristics

Input Voltage Levels

Min

Typical

Max

Unit

input logic level low

-0.4

0.4

VIH input logic level high 0.7 x VDD - VDD + 0.4 V

Tr/Tf- - 25 ns

Output Voltage Levels

Min

Typical

Max

Unit

output logic level low, l

= 4.0mA

0.4

output logic level high, l

= -4.0mA

0.75 x VDD

Input and Tri-state Current

Min

Typical

Max

Unit

With strong pull-up

-150

-40

-10

μA

With strong pull-down

150

μA

With weak pull-up

-5.0

-1.0

-0.33

μA

With weak pull-down

0.33

+1.0

5.0

μA

Input Capacitance

1.0

5.0

Table 4: AIO Characteristics

Rating Min Max Unit

Storage Temperature -40 +85 °C

Battery (VBAT) operation* 1.8 3.6 V

I/O supply voltage

-0.4

+3.6

Other Terminal Voltages except RF Vss-0.4

VBAT+0

.4 V

Bluetooth Low Energy Module

Shanghai Ehong Technologies Co., Ltd

Input Voltage Levels

Min

Typical

Max

Unit

AIO 0 - 1.3 V

Table 5 ESD Protection

Condition

Class

Max Rating

Human Body Model Contact Discharge per JEDEC

EIA/JESD22-A114

2000V (all

pins)

Machine Model Contact Discharge per JEDEC EIA/JESD22-

A115

200V

200V (all

pins)

Charged Device Model Contact Discharge per JEDEC

EIA/JESD22-C101

III

500V (all

pins)

4.4. Power Consumption

The current consumption are measured at the VBAT

Table 6: Current Consumption

Mode Description

Total typical current

at 3.3V (average)

Dormant

All functions are shutdown. To wake up toggle

the WAKE pin

<600nA

Hibernate

All functions are shutdown except for the sleep

clock. The module can wake up on a timer on

the sleep clock.

<1.5uA

Deep sleep

VDD=3.3V 1ms wake up time

<5uA

Idea

VDD=3.3V <1us wake up time

1mA

RF RX /TX active

(0dBm)

VDD=3.3V VDD_PIO=3.3V

~16mA @3V peak

Bluetooth Low Energy Module

Shanghai Ehong Technologies Co., Ltd

5. Pinout and Terminal Description

5.1. Pin Configuration

Figure 1：Pinout of EH-MC10

Symbol

PAD Type Description

GND

Ground Ground

AIO2

Bidirectional analogue

10bit Analogue

programmable I/O line

AIO1

Bidirectional analogue

10bit Analogue

programmable I/O line

AIO0

Bidirectional analogue

10bit Analogue

programmable I/O line

UART_TX

CMOS output, tristate, with weak

internal pull-up

UART data output

UART_RX

CMOS input with weak internal pull-

down

UART data input

PIO3

Bi-directional with programmable

strength internal pull-up/down

Programmable

input/output line

PWM or LED Controls

PIO4

Bi-directional with programmable

strength internal pull-up/down

Programmable

input/output line

PWM or LED Controls

PIO5/SPI_CLK

Bi-directional with programmable

strength internal pull-up/down

Programmable

input/output line

Or debug SPI_CLK select

by SPI_PIO_SEL

GND

Ground

Bluetooth Low Energy Module

Shanghai Ehong Technologies Co., Ltd

I2C_SDA

Bi-directional tristate with weak

internal pull-up

I2C data input/output or

SPI serial flash data

output(SF_OUT)

I2C_SCL

Input with weak internal pull-up

I2C clock or SPI serial

flash clock output

(SF_CLK)

PIO2

Bi-directional with programmable

strength internal pull-up/down

Programmable

input/output line

PIO6/SPI_CSB

14 Bi-directional with programmable

strength internal pull-up/down

Programmable

input/output line

Or debug chip select,

selected by SPI_PIO_SEL

PIO7/SPI_MOSI

15 Bi-directional with programmable

strength internal pull-up/down

Programmable

input/output line

Or debug SPI_MOSI,

selected by SPI_PIO_SEL

VCC_PIO

Powered PIO power supply

PIO8/SPI_MISO

17 Bi-directional with programmable

strength internal pull-up/down

Programmable

input/output line

Or debug SPI_MISO,

selected by SPI_PIO_SEL

PIO9

18 Bi-directional with programmable

strength internal pull-up/down

Programmable

input/output line

PWM or LED Controls

GND

Ground Ground

PIO10

20 Bi-directional with programmable

strength internal pull-up/down

Programmable

input/output line

PWM or LED Controls

PIO11

Bi-directional with programmable

strength internal pull-up/down

Programmable

input/output line

SPI_PIO_S

Input with strong internal pull-down Selects SPI debug on (8:5)

NP NP

VBAT

Power supply

Button cell battery or DC

1.8V to 3.6V

GND

Ground Ground

NP NP

WAKE_UP

27 Input has no internal pull-up or pull-

down use external pull-down

Set high to wake the

module from hibernate.

Use an external pull-down

for this pin.

GND

Ground Ground

Table 7：PIN Terminal Description

Bluetooth Low Energy Module

Shanghai Ehong Technologies Co., Ltd

6. Physical Interfaces

6.1. Power Supply

- The module power supply 3v coin cell batteries or DC 3.3v

- Power supply pin connection capacitor to chip and pin as far as possible close

- Capacitor decouples power to the chip

- Capacitor prevents noise coupling back to power plane.

Figure 2：Power Supply PCB Design

6.2. PIO

10 PIOs are provided (4 are multiplexed with SPI debug interface). They are powered

from VDD_PIO.

PIO lines are software-configurable as weak pull-up, weak pull-down, strong pull-up or

strong pull-down.

Note:

At reset all PIO lines are inputs with weak pull-downs.

Any of the PIO lines can be configured as interrupt request lines or as wake-up lines from sleep

modes.

6.3. AIO

3 AIOs are provided. They can be connected to internal 10 bits ADC. Their functions

depend on software. They can be used to read or output a voltage between 0V to 1.3V.

Each of them can be used as a digital output with special firmware.

6.4. PWM

4 PIOs (PIO3, PIO4, PIO9, and PIO10) can be driven by internal PWM module. The

PWM module also works while the module is sleep. So it can be used as a LED flasher.

These functions are controlled by special firmware.

Bluetooth Low Energy Module

Shanghai Ehong Technologies Co., Ltd

6.5. UART

This is a standard UART interface for communicating with other serial devices. The

UART interface provides a simple mechanism for communicating with other serial

devices using the RS232 protocol.

Table 8: Possible UART Settings

Figure 3：Connection To Host device

6.6. I2C Master

The module can act as an I2C master when configured by software. Any two PIOs can

be configured as I2C_SCL and I2C_SDA.

6.7. SPI Master

The module can act as an SPI master (mode 0) when configured by software. Any four

PIOs can be configured as SPI_CLK, SPI_CS#, SPI_DIN and SPI_DOUT. The clock

rate of the software SPI is around 470kHz.

Parameter

Possible Values

Baud Rate Minimum

1200 baud (≤2%Error)

9600 baud (≤1%Error)

Maximum

2M baud (≤1%Error)

Flow Control

RTS/CTS or None

Parity

None, Odd or Even

Number of Stop Bits

1 or 2

Bits per Byte 8

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