Ebyte E28-2G4M12S Manual de usuario

E28-2G4M12S User Manual

SX1280 2.4GHz SMD Wireless Module

Chengdu Ebyte Electronic Technology Co., Ltd. E28-2G4M12S User Manual 
Copyright ©2012–2018，Chengdu Ebyte Electronic  Technology Co.,Ltd.                                                                                                                                1 
 
目录 
Overview................................................................................................................................................................................................2 
1 Brief introduction ......................................................................................................................................................................2 
2 Features .......................................................................................................................................................................................2 
3 Application .................................................................................................................................................................................2 
Specification and parameter ................................................................................................................................................................3 
1 Limit parameter .........................................................................................................................................................................3 
2 Operating parameter .................................................................................................................................................................3 
Size and pin definit ion ..........................................................................................................................................................................4 
Basic operation.......................................................................................................................................................................................5 
1 Hardware design ................................................................................................................................................................5 
2 So ftware ed iting ........................................................................................................................................................................5 
Basic application .........................................................................................................................................................................6 
1 Basic circuit diagram................................................................................................................................................................6 
FA Q..........................................................................................................................................................................................................6 
1 Communicat ion range is too short .........................................................................................................................................6 
2 Module is easy to damage........................................................................................................................................................7 
3 BER(Bit Error Rate) is high ....................................................................................................................................................7 
Production guidance..............................................................................................................................................................................7 
1 Reflow soldering temperature.................................................................................................................................................7 
2 Reflow soldering curve ............................................................................................................................................................8 
E28 Series ...............................................................................................................................................................................................8 
Antenna guidance..................................................................................................................................................................................9 
1 Antenna recommendation ........................................................................................................................................................9 
2 Antenna selection ......................................................................................................................................................................9 
Revision history ..................................................................................................................................................................................... 10 
About us .................................................................................................................................................................................................. 10 
 
 

Chengdu Ebyte Electronic Technology Co., Ltd. E28-2G4M12S User Manual

1. Overview

1.1 Brief introduction

E28-2G4M12S is a 2.4GHz bluetooth module designed by Chengdu Ebyte,with long distance and ultra -low power

consumption. E28-2G4M12S is small-sized SMD module(pin spacing 1.27mm),built-in PCB antenna and IPEX antenna.

High precision 52MHz crystal is used.

Based on the original imported RF chip SX1278 from SEMTECH,Th e

IC SX1280 features multiple physical layers and various modulating

methods such as LoRa, FLRC and GFSK, the special modulating methods

and processing ways enable longer operating range under LoRa and FLRC

modulating methods, and the GFSK method covers BLE protocol. The

outstanding ultra-low power consumption and the DC-DC and Time-of-

Flight on chip make the chip much more capable for smart home, security

system, tracking and locating, wireless distance measuring, wearable

electronics, smart bracelet and health management & etc. SX1280 supports RSSI,users need to conduct a secondary

development based on their own demands ;SX1280 also integrates time of flight for ranging functions.

Since the module is a pure RF transceiver module, you need to use the MCU driver or a dedicated SPI debug tool.

1.2 Features

Communication distance tested is up to 3km；

Maximum transmission power of 18mW, software multi-level adjustable；

Compatible with BLE protocol；

Support the global license-free ISM 2.4GHz band；

Support air date rate of 0.476kbps ～2Mbps；

Support multiple modulation methods, (GFSK Mode ，FLRC Mode，LoRa Mode)；

Large capacity FIFO, supports 256Byte data buffer；

Support 1.8V~3.6V power supply, power supply over 3.3V can guarantee the best performance；

Industrial grade standard design, support -40 ~ 85 °C for working over a long time；

IPEX and PCB antenna optional, good for secondary development and integration ；

The air data rate is adjustable, the maximu m air data rate is up to 1.3 Mbps in FLRC mode；

Excellent anti-blocking properties；

Ranging, with Time-of-flight function.

1.3 Application

Home security alarm and remote keyless entry；

Smart home and industrial sensors；

Wireless alarm security system；

Building automation solutions；

Wireless industrial-grade remote control；

Health care products；

Advanced Meter Reading Architecture(AMI)；

Automotive industry applications.

Chengdu Ebyte Electronic Technology Co., Ltd. E28-2G4M12S User Manual

2.Specification and parameter

2.1 Limit parameter

Main parameter

Performance

Remark

Min.

Max.

Power supply（V）

3.6

Voltage over 3.6V will cause permanent

damage to module

Blocking power（dBm）

Chances of burn is slim when modules are

used in short distance

Operatingtemperature（℃）

-40

2.2 Operating parameter

Main parameter

Performance

Remark

Min.

Typ.

Max.

Operatingvoltage（V）

1.8

3.3

3.6

≥3.3 V ensures output power

Communication level（V）

3.3

For 5V TTL,it may be at risk of burning down

Operatingtemperature（℃）

-40

Industrial design

Operatingfrequency（MHz）

2400

2430

2500

Support ISM band

Power

consumpti

TX current（mA）

Instant powerconsumption

RX current（mA）

Sleep current （μA）

2.0

Software is shut down

MaxTx power（dBm）

12.5

Receiving sensitivity（dBm）

-126

-128

-130

air data rate:595kbps

Air data rate

LoRa24（bps）

0.476k

202K

Programming

FLRC（bps）

130k

1.3M

Programming

FSK（bps）

125k

Programming

Main parameter

Description

Remark

Distance for reference

3000m

Test condition：clear and open area, antenna gain: 5dBi，

antenna height: 2.5m，air data rate: 595kbps

FIFO

256Byte

Maxlength transmitted each time

Crystalfrequency

52MHz

Modulation

LoRaTM (recommended)

GFSK Mode ，FLRC Mode，LoRaMode

Package

SMD

Connector

1.27mm

IPEX/PCB

Communication interface

SPI

0-10Mbps

Size

25* 14*0.8 mm

Antenna

Stamp hole

50 ohm impedance

Chengdu Ebyte Electronic Technology Co., Ltd. E28-2G4M12S User Manual

3.Size and pin definition

Pin No

Pin item

Pin direction

Pin application

VCC

Power supply: 1.8~3.6V (Ceramic filter capacitor is advised to add)

GND

Ground, connecting to power supply reference ground

MISO_TX

Output

SPI data output pin,can be used as UART transmitting pin

MOSI_RX

Input

SPI data input pin,can be used as UART receiving pin

SCK_RTSN

Input

SPI clock input pin,can be used as UART request transmitting pin

NSS_CTS

Input

Module chip selection pin, used to start a SPI communication; and can be used as

UART clearing transmitting pin(refer to SX1280 Datasheet)

GND

Ground, connecting to power supply reference ground

GND

Ground, connecting to power supply reference ground

NRESET

Input

Chip reset initiation input pin, valid under low level, built -in 50k pull-up resistor

BUSY

Output

Status indication (refer to SX1280 Datasheet)

DIO1

Input / Output

Configurable IO port（Please find more on SX1280 datasheet）

DIO2

Input / Output

Configurable IO port（Please find more on SX1280 datasheet）

DIO3

Input / Output

Configurable IO port（Please find more on SX1280 datasheet）

GND

Ground, connecting to power supply reference ground

Chengdu Ebyte Electronic Technology Co., Ltd. E28-2G4M12S User Manual

4.Basic operation

4.1Hardware design

It is recommended to use a DC stabilized power supply. The power supply ripple factor is as small as possible, and

the module needs to be reliably grounded.；

Please pay attention to the correct connection of the positive and negative poles of the power supply. Reverse

connection may cause permanent damage to the module；

Please check the power supply to ensure it is within the recommended voltage otherwise when it exceeds the

maximu m value the module will be permanently damaged；

Please check the stability of the power supply, the voltage can not be fluctuated frequently ；

When designing the power supply circuit for the module, it is often recommended to reserve more than 30% of the

margin, so the whole machine is beneficial for long-term stable operation.；

The module should be as far away as possible from the power supply, transformers, high -frequency wiring and other

parts with large electromagnetic interference.；

High-frequency digital routing, high-frequency analog routing, and power routing must be avoided under the module.

If it is necessary to pass through the module, assume that the module is soldered to the Top Layer, and the copper is

spread on the Top Layer of the module contact part(well grounded), it must be close to the digital part of the module

and routed in the Bottom Layer；

Assuming the module is soldered or placed over the Top Layer, it is wrong to randomly route over the Bottom Layer

or other layers, which will affect the module's spurs and receiving sensitivity to varying degrees ；

It is assumed that there are devices with large electromagnetic interference around the module that will greatly affe ct

the performance. It is recommended to keep them away from the module according to the strength of the interference.

If necessary, appropriate isolation and shielding can be done；

Assume that there are traces with large electromagnetic interference (high -frequency digital, high-frequency analog,

power traces) around the module that will greatly affect the performance of the module. It is recommended to stay

away from the module according to the strength of the interference.If necessary, appropriate isolation and shielding

can be done.

If the communication line uses a 5V level, a 1k-5.1k resistor must be connected in series (not recommended, there is

still a risk of damage)；

Try to stay away from some physical layers such as TTL protocol at 2.4GHz , for example: USB3.0；

The mounting structure of antenna has a great influence on the performance of the module. It is necessary to ensure

that the antenna is exposed, preferably vertically upward. When the module is mounted inside the case, use a good

antenna extension cable to extend the antenna to the outside；

The antenna must not be installed inside the metal case, which will cause the transmission distance to be greatly

weakened.

4.2 Software editing

This module is based on SX1280,same drive way as SX1280,user can refer to SX1280 datasheet.

DIO is general I/O port，see more in SX1280 datasheet.

GDO 2 is generally configurated as IRQ function, IRQ pin can also be disconnected. The SPI query mode can be used

Chengdu Ebyte Electronic Technology Co., Ltd. E28-2G4M12S User Manual

to obtain the interrupt status. However, it is recommended to use the external interrupt of the MCU.

After SX1280 restores IDLE mode or configures sleep mode, it is recommended that the power configuration table

be reinitialized.

5.Basic application

5.1 Basic circuit diagram

6.FAQ

6.1 Communication range is too short

The communication distance will be affected when obstacle exists.

Data lose rate will be affected by temperature, humidity and co-channel interference.

The ground will absorb and reflect wireless radio wave, so the performance will be poor when testing near groun d.

Sea water has great ability in absorbing wireless radio wave, so performance will be poor when testing near the sea.

The signal will be affected when the antenna is near metal object or put in a metal case.

Chengdu Ebyte Electronic Technology Co., Ltd. E28-2G4M12S User Manual

Power register was set incorrectly, air data rate is set as too high (the higher the air data rate, the shorter the

distance).

The power supply low voltage under room temperature is lower than 2.5V, the lower the voltage, the lower the

transmitting power.

Due to antenna quality or poor matching between antenna and module.

6.2 Module is easy to damage

Please check the power supply source, ensure it is 2.0V~3.6V, voltage higher than 3.6V will damage the module.

Please check the stability of power source, the voltage cannot fluctuate too much.

Please make sure antistatic measure are taken when installing and using, high frequency devices have electrostatic

susceptibility.

Please ensure the humidity is within limited range, some parts are sensitive to humidity.

Please avoid using modules under too high or too low temperature.

6.3 BER(Bit Error Rate) is high

There are co-channel signal interference nearby, please be away from interference sources or modify frequency and

channel to avoid interference;

Poor power supply may cause messy code. Make sure that the power supply is reliable.

The extension line and feeder quality are poor or too long, so the bit error rate is high;

7.Production guidance

7.1 Reflow soldering temperature

Profile Feature

Curve characteristics

Sn-PbAssembly

Pb-Free Assembly

Solder Paste

Solder paste

Sn63/Pb37

Sn96.5/Ag3/Cu0.5

Preheat Temperature min （Tsmin）

Min preheating temp.

100℃

150℃

Preheat temperature max (Tsmax)

Mx preheating temp.

150℃

200℃

Preheat Time (Tsmin to Tsmax)(ts)

Preheating time

60-120 sec

Average ramp-up rate(Tsmax to Tp)

Average ramp-up rate

3℃/second max

Liquidous Temperature (TL)

Liquid phase temp.

183℃

217℃

Time（tL）Maintained Above（TL）

Time below liquid phase line

60-90 sec

30-90 sec

Peak temperature（Tp）

Peak temp.

220-235℃

230-250℃

Aveageramp-down rate（Tp to Tsmax）

Aveageramp-down rate

6℃/second max

Time 25℃ to peak temperature

Time to peak temperature

for 25℃

max 6 minutes

max 8 minutes

Chengdu Ebyte Electronic Technology Co., Ltd. E28-2G4M12S User Manual

7.2 Reflow soldering curve

8.E28 Series

Model No.

Frequency

(Hz)

Tx power

(dBm)

Testdistance

(km)

Package

Size

Antenna

E28-2G4M20S

SX1280

2.4G

SMD

15 * 26.5

IPEX/PCB

E28-2G4M12S

SX1280

2.4G

12.5

SMD

25*14

IPEX/PCB

E28-2G4T12S

SX1280

2.4G

12.5

SMD

17.5* 28.7

IPEX/PCB

Chengdu Ebyte Electronic Technology Co., Ltd. E28-2G4M12S User Manual

9.Antenna guidance

9.1 Antenna recommendation

The antenna is an important role in the communication process. A good antenna can largely improve the

communication system. Therefore, we recommend some antennas for wireless modules with excellent performance and

reasonable price.

Model No.

Type

Frequency

Interface

Gain

dBi

Height

Cable

Function feature

TX2400-NP-5010

FCB antenna

2.4G

SMA-J

50*10mm

FPC soft antenna

TX2400-XP-150

Sucker

2.4G

SMA-J

3.5

15cm

150cm

Sucker antenna, High

gain

TX2400-JK-20

Rubber

2.4G

SMA-J

200mm

Flexible

&omnidirectional

TX2400-JK-11

Rubber

2.4G

SMA-J

2.5

110mm

Flexible

&omnidirectional

TX2400-JZ-3

Rubber

2.4G

SMA-J

30mm

Short straight

&omnidirectional

9.2 Antenna selection

PCB (default) IPEX

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