AXIOMTEK CEM860 Manual de usuario

4 9418D860000E

Version A1 November 2011

Printed in Taiwan

Quick Start

The basic procedures required to power on CEM860:

(1). Require DC +12V power at minimum 4.5A. Make sure the power is

OFF before connecting the CEM860.

(2). Check to ensure the onboard switch SW1 is set to default (OFF

position).

(3). Firmly install DDR3 memory module(s) into connector(s) SDIMM1(and

SDIMM2) until fully seated.

(4). Attach heatspreader to the CEM860, refer to section Installing

Heatspreader.

(5). Install the CEM860 onto COM ExpressTM baseboard, for example,

CEB94006 baseboard.

(6). Properly install all necessary peripheral devices such as hard disk,

monitor, keyboard and etc. to the baseboard.

(7). Firmly attach power supply to the baseboard’s power connector.

(8). Turn on the system power.

CEM860 Quick Installation Guide

9418D860000E 1

Version A1 November 2011

Printed in Taiwan

Checklist

9CEM860 Board x1 9Product Information CD x1

9Quick Installation Guide x1

Note: Please contact your local vendors if any damaged or missing items. DO

NOT apply power to the board if there is any damaged component.

Please refer to the product information CD for the complete user’s

manual, drivers and utilities. User’s manual and related documents are

in Acrobat PDF format.

Board Layout

Top Side

CEM860 2nd Generation Intel®CoreTM Processor COM ExpressTM Type 6 Basic Module

2 9418D860000E

Version A1 November 2011

Printed in Taiwan

Bottom Side

Connectors

Switch Setting

SW1

Connector Description

SDIMM1 DDR3 SO-DIMM

Connector

SDIMM2 DDR3 SO-DIMM

Connector

SS3 COM ExpressTM Connector

SS4 COM ExpressTM Connector

Description Setting

Disable auto power on

(Default) OFF position

Enable auto power on ON position

SS3

SS4

9418D860000E 3

Version A1 November 2011

Printed in Taiwan

Installing Heatspreader

1. There is a protective plastic covering on the thermal pads. This must be

removed before the heatspreader can be mounted.

2. Each heatspreader is designed for a specific CEM module. The thermal

pads on the heatspreader are designed to make contact with the

necessary components on the CEM module. When mounting the

heatspreader you must make sure that the thermal pads on the

heatspreader make complete contact (no space between thermal pad

and component) with the corresponding components on the CEM

module. This is especially critical for CEM modules that have higher

CPU speeds (for example 1.0GHz or more) to ensure that the

heatspreader acts as a proper thermal interface for cooling solutions.

3. This CPU module has five assembly holes for installing heat spreader

plate. Use the five screws (M2.5x15L) to secure the heat spreader plate

to the CEM860. Be careful not to over-tighten the screws.

4. If you need additional information for thermal solution, please refer to

below image to design your system’s cooling.

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