Aries Embedded MSMP1EVK Manual de usuario
MSMP1EVK
MSMP1EVK
Version: 1.0
Created on: Jul 13, 2022
Created by: Diana Korchmar
Page 1 of 44
©ARIES Embedded GmbH. The information contained in this document is strictly confiden-
tial. This document may not be copied, reproduced, translated, changed or distributed
without the written approval of ARIES Embedded GmbH
MSMP1EVK
CONTENTS:
1 About this manual 3
1.1 Imprint ................................................ 3
1.2 Disclaimer ............................................... 3
1.3 Copyright ............................................... 4
1.4 Registered Trademarks ........................................ 4
1.5 Care and Maintenance ........................................ 4
1.6 Change Log .............................................. 4
2 Overview 5
2.1 MSMP1EVK ............................................. 5
2.2 Feature Set .............................................. 6
2.3 Order Codes ............................................. 6
2.4 Block Diagram ............................................ 7
2.5 Dimensions .............................................. 8
2.6 Part Overview ............................................ 9
2.7 Handling Recommendations ..................................... 9
3 Resources 10
3.1 Components .............................................. 10
3.1.1 Ethernet ............................................ 10
3.1.2 CAN .............................................. 10
3.1.3 UART ............................................. 11
3.1.4 RESET and WAKE UP Button ............................... 12
3.1.5 JTAG ............................................. 12
3.1.6 User LEDs .......................................... 13
3.1.7 USB Host ........................................... 13
3.1.8 USB OTG ........................................... 13
3.1.9 LCD Interface ........................................ 14
3.1.10 SD/MMC Card ........................................ 15
3.1.11 Image Sensor Interface .................................... 16
3.1.12 GPIO/EBI .......................................... 16
3.1.13 Security Box Module ..................................... 19
3.1.14 GPIO/ANAIN2-IOs ..................................... 19
3.1.15 ADC-Signals ......................................... 20
3.1.16 MxM Edge Connector .................................... 20
3.2 Schematics .............................................. 27
3.2.1 MSMP1 Adapter to MA5D4EVK .............................. 27
3.2.2 Baseboard MA5D4EVK ................................... 33
CONTENTS: Page 2 of 44
MSMP1EVK
CHAPTER
ONE
ABOUT THIS MANUAL
1.1 Imprint
Adress:
ARIES Embedded GmbH
Schöngeisinger Str. 84
D-82256 Fürstenfedbruck
Germany
Phone:
+49 (0) 8141/36 367-0
Fax:
+49 (0) 8141/36 367-67
1.2 Disclaimer
ARIES Embedded does not guarantee that the information in this document is up-to-date, correct, complete
or of good quality. Liability claims against ARIES Embedded, referring to material or non-material related
damages caused, due to usage or non-usage of the information given in this document, or due to usage of
erroneous or incomplete information, are exempted, as long as there is no proven intentional or negligent
fault of ARIES Embedded. ARIES Embedded explicitly reserves the rights to change or add to the contents
of this Preliminary User’s Manual or parts of it without notification.
Chapter 1. About this manual Page 3 of 44
MSMP1EVK
1.3 Copyright
This document may not be copied, reproduced, translated, changed or distributed, completely or partially
in any form without the written approval of ARIES Embedded GmbH.
1.4 Registered Trademarks
The contents of this document may be subject of intellectual property rights (including but not limited to
copyright, trademark, or patent rights). Any such rights that are not expressly licensed or already owned
by a third party are reserved by ARIES Embedded GmbH.
1.5 Care and Maintenance
•Keep the device dry. Precipitation, humidity, and all types of liquids or moisture can contain minerals
that will corrode electronic circuits. If your device does get wet, allow it to dry completely.
•Do not use or store the device in dusty, dirty areas. Its moving parts and electronic components can
be damaged.
•Do not store the device in hot areas. High temperatures can shorten the life of electronic devices,
damage batteries, and warp or melt certain plastics.
•Do not store the device in cold areas. When the device returns to its normal temperature, moisture
can form inside the device and damage electronic circuit boards.
•Do not attempt to open the device.
•Do not drop, knock, or shake the device. Rough handling can break internal circuit boards and fine
mechanics.
•Do not use harsh chemicals, cleaning solvents, or strong detergents to clean the device.
•Do not paint the device. Paint can clog the moving parts and prevent proper operation.
•Unauthorized modifications or attachments could damage the device and may violate regulations gov-
erning radio devices.
1.6 Change Log
Revision Date Revised Comment
1.0 10.08.2022 dk Initial creation
Chapter 1. About this manual Page 4 of 44
MSMP1EVK
CHAPTER
TWO
OVERVIEW
2.1 MSMP1EVK
The MSMP1EVK supports a quick start-up of CPU projects and can easily be used as a fast-prototype
platform.
The MSMP1EVK contains the Open Standard Module compliant System-In-Package based on ST Micro-
electronics STMP1 Family architecture offering high-performance single/dual CortexA7 cores in combination
with a CortexM4 core.
Chapter 2. Overview Page 5 of 44
MSMP1EVK
2.2 Feature Set
•MSMP1 SiP
–STM32MP157
–Single/Dual Cortex-A7, up to 800MHz
–Cortex-M4, up to 209MHz
–512MB LPDDR3 RAM
–4GB eMMC
–-25. . . +85°C
•Ethernet 10/100MBit on RJ45
•Camera Port
•LCD Interface
•Dual UART on DSUB9
•Dual CAN on DSUB9
•USB Host
•USB Host/OTG
•microSD card slot
•JTAG
•size 165mm x 135mm
2.3 Order Codes
MSMP157EVK-AAE
•MSMP1 SiP
–STM32MP157
–Cortex-M4, up to 209MHz
–512MB LPDDR3 RAM
–4GB eMMC
–-25. . . +85°C
Please contact ARIES Embedded for more information about the availability of other standard products of
MSMP1EVK or custom configurations.
Chapter 2. Overview Page 6 of 44
MSMP1EVK
2.4 Block Diagram
Chapter 2. Overview Page 7 of 44
MSMP1EVK
2.5 Dimensions
Chapter 2. Overview Page 8 of 44
MSMP1EVK
2.6 Part Overview
2.7 Handling Recommendations
To avoid mechanical damage to the components populated on MSMP1 it is strongly recommended not to
apply mechanical force on the Ball Grid Array (BGA) components. The BGA components are marked as
shaded in the figure below:
Chapter 2. Overview Page 9 of 44
MSMP1EVK
CHAPTER
THREE
RESOURCES
3.1 Components
3.1.1 Ethernet
MSMP1EVK offers 10/100 MBit Ethernet Channel on connector X3. For best flexibility the Ethernet-PHY
KSZ8081 (Micrel) is populated on the MSMP1EVK baseboard.
Connector X3:
Function MSMP1EVK Pin MPU
Pin
Function MSMP1 SiP
Pads
PB17/FEC0 MDIO 174 AB2 ETH_MDIO T15
PB16/FEC0 MDC 173 AB3 ETH_MDC T16
PB0/FEC0 TXCK 189 V4 ETH_RGMII_RX_CLK R15
PB8/FEC0 RX0 181 AB6 ETH_RGMII_RXD0 K15
PB9/FEC0 RX1 182 AA6 ETH_RGMII_RXD1 L15
PB6/FEC0 RXDV 183 Y9 ETH_RGMII_RX_CTL M15
PB7/FEC0 RXER 184 W1 ETH_GMII_RX_ER L16
PB12/FEC0 TX0 177 AA1 ETH_RGMII_TXD0 H15
PB13/FEC0 TX1 178 AA2 ETH_RGMII_TXD1 G15
PB2/FEC0 TXEN 187 Y5 ETH_RGMII_TX_CTL K16
3.3V NRST – – – –
3.1.2 CAN
Please note that the CAN interface can only be functional in case one or two of the optional CAN interfaces
on the MA5D4 System on Module are populated.The CAN interfaces 1 and 2 are available on connectors
X4 and X5.
Chapter 3. Resources Page 10 of 44
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