VIA Technologies Mini-ITX Mainboard EPIA-MII Manual de usuario

User’s Manual

EPIA-MII

Mini-ITX Mainboard

Version 1.50

August 26, 2004

part of this document may be reproduced, transmitted, transcribed, stored in

a retrieval system, or translated into any language, in any form or by any

means, electronic, mechanical, magnetic,optical, chemical, manual or

otherwise without the prior written permission of VIA Technologies

Incorporated.

Trademarks

Windows CE™, Windows XP™, Windows 2000™, Windows ME™,

Windows 98™ and plug and play™ are registered trademarks of Microsoft

Corporation.

PS/2 is a registered trademark of IBM Corporation.

AwardBIOS is a registered trademark of Phoenix Technologies Ltd.

All trademarks are the property of their respective holders.

Disclaimer

No license is granted, implied or otherwise, under any patent or patent rights

of VIA Technologies. VIA Technologies make no warranties, implied or

otherwise, in regard to this document and to the products described in this

document. The information provided in this document is believed to be

accurate and reliable as of the publication date of this document. However,

VIA Technologies assume no responsibility for any errors in this document,

Furthermore, VIA Technologies assume no reponsibility for the use or

misuse of the information of this document and for any patent infringements

that may arise from the use of this document. The information and product

specifications within this document are subject to change at any time,

without notice and without obligation to notify any person of such change.

iii

FCC-B Radio Frequency Interference Statement

This equipment has been tested and found to comply with the limits for a

class B digital device, pursuant to part 15 of the FCC rules. These limits are

designed to provide reasonable protection against harmful interference when

the equipment is operated in a commercial environment. This equipment

generates, uses and can radiate radio frequency energy and, if not installed

and used in accordance with the instruction manual, may cause harmful

interference to radio communications. Operation of this equipment in a

residential area is likely to cause harmful interference, in which case the user

will be required to correct the interference at his own expense.

Notice 1

The changes or modifications not expressly approved by the party

responsible for compliance could void the user’s authority to operate the

equipment.

Notice 2

Shielded interface cables and A.C. power cord, if any, must be used in order

to comply with the emission limits.

Safety Instructions

1. Always read the safety instructions carefully.

2. Keep this User’s Manual for future reference.

3. Keep this equipment away from humidity.

4. Lay this equipment on a reliable flat surface before setting it up.

5. The openings on the enclosure are for air convection hence protects the

equipment from overheating. DO NOT COVER THE OPENINGS.

6. Make sure the voltage of the power source and adjust properly 110/220V

before connecting the equipment to the power inlet.

7. Place the power cord in such a way that people cannot step on it. Do not

place anything over the power cord.

8. Always unplug the power cord before inserting any add-on card or

module.

9. All cautions and warnings on the equipment should be noted.

10. Never pour any liquid into the opening. Liquid can cause damage or

electrical shock.

11. If any of the following situations arises, get the equipment checked by a

service personnel:

• The power cord or plug is damaged

• Liquid has penetrated into the equipment

• The equipment has been exposed to moisture

• The equipment has not work well or you can not get it work according

to User’s Manual.

• The equipment has dropped and damaged

• If the equipment has obvious sign of breakage

12. DO NOT LEAVE THIS EQUIPMENT IN AN ENVIRONMENT

UNCONDITIONED, STORAGE TEMPERATURE ABOVE 600 C

(1400F), IT MAY DAMAGE THE EQUIPMENT.

CAUTION: Explosion or serious damage may occur if the battery is

incorrectly replaced. Replace only with the same or equivalent type

recommended by the manufacturer.

Box Contents

• 1 x VIA Mainboard

• 1 x Quick Installation Guide

• 1 x Floppy Ribbon Cable

• 1 x ATA-66/100/133 IDE Ribbon Cable

• 1 x I/O Bracket

• 1 x Driver Utilities CD

Table of Contents

Chapter 1: Specifications ........................................1-1

Mainboard Specifications..........................................................1-2

Mainboard Layout .....................................................................1-4

Back Panel Ports ......................................................................1-6

Slots ..........................................................................................1-6

Onboard Connectors and Jumpers...........................................1-7

Chapter 2: Installation..............................................2-1

CPU Installation ........................................................................2-2

Memory Module Installation ......................................................2-4

Connecting the Power Supply...................................................2-6

Back Panel Ports ......................................................................2-7

Connectors..............................................................................2-11

Jumpers ..................................................................................2-19

Slots ........................................................................................2-20

Chapter 3: BIOS Setup .............................................3-1

Entering Setup ..........................................................................3-2

Control Keys .............................................................................3-2

Getting Help ..............................................................................3-3

The Main Menu .........................................................................3-4

Standard CMOS Features ........................................................3-6

Advanced BIOS Features .........................................................3-8

Advanced Chipset Features....................................................3-12

Integrated Peripherals.............................................................3-14

Power Management Setup .....................................................3-18

PnP / PCI Configurations ........................................................3-24

PC Health Status ....................................................................3-27

Frequency / Voltage Control ...................................................3-28

Load Fail-Safe Defaults ..........................................................3-30

Load Optimized Defaults.........................................................3-31

Set Supervisor / User Password .............................................3-32

Save & Exit Setup ...................................................................3-34

Exit Without Saving.................................................................3-35

Chapter 4: Driver Installation ..................................4-1

Driver Utilities............................................................................4-2

CD Content ...............................................................................4-3

1-1

Specifications

The ultra-compact and highly intergrated VIA

EPIA-MII Mini-ITX Mainboard is the smallest

form factor mainboard specification available

today, developed by VIA Technologies, Inc. as part

of the company’s open industry-wide total

connectivity initiative. The mainboard enables the

creation of an exciting new generation of small,

ergonomic, innovative and affordable embedded

systems. Through high level of integration, mini-

ITX only occupy 66% of the size of FlexATX

mainboard form factor. The mainboard comes with

an embedded VIA Processor, boasting ultra low

power consumption and cool, quiet operation.

This chapter includes the following sections:

Mainboard Specifications 1-2

Mainboard Layout 1-4

Back Panel Ports 1-6

Slots 1-6

Connectors / Jumpers 1-7

Chapter

Chapter 1

1-2

Mainboard Specifications

CPU

• VIA C3 / EDEN EBGA Processor (onboard)

• Enhanced Ball Grid Array Package (EBGA)

• Internal L1 128KB and L2 64KB cache memory

Chipset

• VIA CLE266 North Bridge

• VT8235 South Bridge

Memory

• 1 x DDR266 DIMM socket (up to 1 GB)

Expansion Slots

• 1 x PCI

Graphics

• Integrated VIA Castlerock AGP graphics

Audio

• VT1616, six-channel AC’97 Codec

Onboard IEEE 1394 (optional)

• VIA VT6307S IEEE 1394

LAN

• VIA VT6103 10/100 Base-T Ethernet PHY

IDE

• 2 X UltraDMA 66/100/133 Connectors

OnModule CardBus/CF

• RICOH 476II

LVDS (optional)

VIA VT1631 LVDS Transmitter

Specifications

1-3

Back Panel I/O Ports

• 1 x PS2 mouse port

• 1 x PS2 keyboard port

• 1 x VGA port

• 1 x S-Video port

• 1 x RCA port (SPDIF or TV-out)

• 1 x RJ-45 LAN port

• 2 x USB 2.0/1.1 ports

• 1 x 1394 port

• 1 x Cardbus slot & CF slot

• 1 x Serial port

• 3 x Audio jacks: line-out, line-in and mic-in

Onboard I/O Connectors

• 1 x USB 2.0/1.1 connector (USB 2.0 support included in South Bridge)

• 1 x 1394 connector (optional)

• 1 x CD Audio-in connector

• 1 x Front audio connector

• 1 x FIR connector

• 1 x KBMS connector

• 1 x Wake-on-LAN connector

• 3 x Fan connectors (CPU Fan, System Fan, Fan 3)

• 1 x LVDS connector (optional)

• 1 x Serial port connector for second COM port

• 1 x LPT port connector

• 1 x SMBus connector

• 1 x Video feature connector support (optional)

BIOS

• Award BIOS on 2/4Mbit flash memory

Form Factor

• 17 cm X 17 cm Mini-ITX (6 layers)

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