TQ STKLS10 A Series Manual de usuario

TQMLS10xxA

User's Manual

TQMLS10xxA UM 0105

21.03.2022

TABLE OF CONTENTS

1. ABOUT THIS MANUAL................................................................................................................................................................................1

1.1 Copyright and license expenses.............................................................................................................................................................1

1.2 Registered trademarks...............................................................................................................................................................................1

1.3 Disclaimer......................................................................................................................................................................................................1

1.4 Imprint............................................................................................................................................................................................................1

1.5 Tips on safety................................................................................................................................................................................................2

1.6 Symbols and typographic conventions ...............................................................................................................................................2

1.7 Handling and ESD tips...............................................................................................................................................................................2

1.8 Naming of signals........................................................................................................................................................................................3

1.9 Further applicable documents / presumed knowledge .................................................................................................................3

2. BRIEF DESCRIPTION ....................................................................................................................................................................................4

3. OVERVIEW......................................................................................................................................................................................................5

3.1 Block diagram...............................................................................................................................................................................................5

3.2 System components...................................................................................................................................................................................5

4. ELECTRONICS................................................................................................................................................................................................6

4.1 LS10xxA..........................................................................................................................................................................................................6

4.1.1 LS10xxA variants, block diagrams..........................................................................................................................................................6

4.1.2 LS10xxA variants, details...........................................................................................................................................................................8

4.2 Reset Configuration Word RCW..............................................................................................................................................................9

4.3 RCW source selection.................................................................................................................................................................................9

4.4 Clock supply..................................................................................................................................................................................................9

4.5 Power Modes................................................................................................................................................................................................9

4.6 JTAG.............................................................................................................................................................................................................. 10

4.7 Power supply............................................................................................................................................................................................. 11

4.7.1 Input voltage ............................................................................................................................................................................................. 11

4.7.2 Feedback voltages................................................................................................................................................................................... 11

4.7.3 Power-up sequencing............................................................................................................................................................................. 11

4.7.4 Voltage monitoring ................................................................................................................................................................................. 11

4.7.5 Power consumption................................................................................................................................................................................ 12

4.8 Reset structure .......................................................................................................................................................................................... 13

4.9 Memory....................................................................................................................................................................................................... 14

4.9.1 DDR4 SDRAM............................................................................................................................................................................................. 14

4.9.2 SPI NOR flash.............................................................................................................................................................................................. 14

4.9.3 EEPROM, 24LC256.................................................................................................................................................................................... 14

4.9.4 eMMC........................................................................................................................................................................................................... 14

4.10 Temperature sensor with EEPROM, SE97B....................................................................................................................................... 15

4.10.1 Temperature sensor, SE97B .................................................................................................................................................................. 15

4.10.2 EEPROM, SE97B......................................................................................................................................................................................... 15

4.11 RTC................................................................................................................................................................................................................ 16

4.12 UART............................................................................................................................................................................................................. 16

4.13 I2C bus .......................................................................................................................................................................................................... 17

4.14 TQMLS10xxA interfaces.......................................................................................................................................................................... 17

4.14.1 Pin multiplexing ....................................................................................................................................................................................... 17

4.14.2 Pinout TQMLS10xxA connectors......................................................................................................................................................... 18

4.14.3 Assembly..................................................................................................................................................................................................... 22

5. MECHANICS................................................................................................................................................................................................ 23

5.1 Dimensions TQMLS1043A ..................................................................................................................................................................... 23

5.2 Dimensions TQMLS1046A / TQMLS1088A ....................................................................................................................................... 24

5.3 TQMLS10xxA connectors....................................................................................................................................................................... 25

5.4 Adaptation to the environment .......................................................................................................................................................... 26

5.5 Protection against external effects..................................................................................................................................................... 26

5.6 Thermal management............................................................................................................................................................................ 26

5.7 Structural requirements......................................................................................................................................................................... 26

5.8 Notes of treatment................................................................................................................................................................................... 26

6. SOFTWARE.................................................................................................................................................................................................. 26

7. SAFETY REQUIREMENTS AND PROTECTIVE REGULATIONS......................................................................................................... 27

7.1 EMC............................................................................................................................................................................................................... 27

7.2 ESD................................................................................................................................................................................................................ 27

7.3 Operational safety and personal security......................................................................................................................................... 27

7.4 Climatic and operational conditions.................................................................................................................................................. 27

7.5 Reliability and service life....................................................................................................................................................................... 27

8. ENVIRONMENT PROTECTION................................................................................................................................................................ 28

8.1 RoHS ............................................................................................................................................................................................................. 28

8.2 WEEE®.......................................................................................................................................................................................................... 28

8.3 REACH®........................................................................................................................................................................................................ 28

8.4 EuP ................................................................................................................................................................................................................ 28

8.5 Battery.......................................................................................................................................................................................................... 28

8.6 Packaging ................................................................................................................................................................................................... 28

8.7 Other entries.............................................................................................................................................................................................. 28

9. APPENDIX ................................................................................................................................................................................................... 29

9.1 Acronyms and definitions...................................................................................................................................................................... 29

9.2 References.................................................................................................................................................................................................. 31

TABLE DIRECTORY

Table 1: Terms and Conventions ............................................................................................................................................................................2

Table 2: LS10xxA variants..........................................................................................................................................................................................8

Table 3: RCW source selection.................................................................................................................................................................................9

Table 4: TQMLS10xxA power consumption @ 5 V.......................................................................................................................................... 12

Table 5: RESET options............................................................................................................................................................................................ 13

Table 6: SDHC_EXT_SEL options.......................................................................................................................................................................... 14

Table 7: I2C addresses.............................................................................................................................................................................................. 17

Table 8: Pinout connector X1................................................................................................................................................................................ 18

Table 9: Pinout connector X2................................................................................................................................................................................ 19

Table 10: Pinout connector X3................................................................................................................................................................................ 20

Table 11: Pinout connector X4................................................................................................................................................................................ 21

Table 12: Labels on TQMLS10xxA.......................................................................................................................................................................... 22

Table 13: Connector assembled on TQMLS10xxA............................................................................................................................................ 25

Table 14: Carrier board mating connectors........................................................................................................................................................ 25

Table 15: Climate and operational conditions................................................................................................................................................... 27

Table 16: Acronyms.................................................................................................................................................................................................... 29

Table 17: Further applicable documents............................................................................................................................................................. 31

FIGURE DIRECTORY

Figure 1: Block diagram TQMLS10xxA (simplified).............................................................................................................................................5

Figure 2: Block diagram LS1043A (Quad Cortex®-A53).....................................................................................................................................6

Figure 3: Block diagram LS1046A (Quad Cortex®-A72).....................................................................................................................................7

Figure 4: Block diagram LS1088A (Octal Cortex®-A53) .....................................................................................................................................7

Figure 5: Block diagram RCW source selection....................................................................................................................................................9

Figure 6: Block diagram JTAG interface............................................................................................................................................................... 10

Figure 7: Wiring of JTAG_TRST# and PORESET# ............................................................................................................................................... 10

Figure 8: Wiring of JTAG chain with CPU and CPLD........................................................................................................................................ 10

Figure 9: Block diagram feedback voltages ....................................................................................................................................................... 11

Figure 10: Block diagram Reset structure ............................................................................................................................................................. 13

Figure 11: Block diagram 24LC256 EEPROM interface...................................................................................................................................... 14

Figure 12: Block diagram SE97B temperature sensor ....................................................................................................................................... 15

Figure 13: Memory Map SE97B EEPROM............................................................................................................................................................... 15

Figure 14: Block diagram RTC interface................................................................................................................................................................. 16

Figure 15: Block diagram RTC buffering interface.............................................................................................................................................. 16

Figure 16: Block diagram I2C bus 1 structure on TQMLS10xxA ...................................................................................................................... 17

Figure 17: TQMLS10xxA assembly, top.................................................................................................................................................................. 22

Figure 18: TQMLS10xxA assembly, bottom.......................................................................................................................................................... 22

Figure 19: TQMLS1043A dimensions, side view.................................................................................................................................................. 23

Figure 20: TQMLS1043A dimensions, top view................................................................................................................................................... 23

Figure 21: TQMLS1043A dimensions, top view

through

TQMLS1043A ..................................................................................................... 23

Figure 22: TQMLS1046A / TQMLS1088A dimensions, side view.................................................................................................................... 24

Figure 23: TQMLS1046A / TQMLS1088A dimensions, top view..................................................................................................................... 24

Figure 24: TQMLS1046A / TQMLS1088A dimensions, top view

through

TQMLS1046A / TQMLS1088A.......................................... 24

REVISION HISTORY

Rev. Date Name Pos. Modification

0100 12.08.2019 Petz First issue

0101 07.10.2019 Petz

All

1.9

Table 2

Table 4

4.7.2

4.9.1

4.12

10, 21

7.5

(5)

Hyperlinks updated, Links to TQMLS10xxA-specific BSPs added

Link to PTXdist documentation removed, Link to Yocto documentation added

Clarified and corrected

Values added

Reworked, Figure 9 added

Information added

Chapter added

Footnotes added

Updated

Link to LS1043A Errata added

0102 29.11.2019 Petz

All

Table 5

4.14.2

Links updated

Clarified

Chapters 4.14.2 to 4.14.5 merged

0103 02.11.2020 Petz

All

Table 17

Non-functional changes, links updated

Cortex®-core naming corrected and description extended

Link to LS1043A Errata removed

0104 18.11.2021 Kreuzer Table 3

4.14.2

eMMC boot with all TQMLS10xxA variants possible

Added references to CPU variants

0105 21.03.2022 Kreuzer Table 2 Max. frequency corrected for LS1046A

ABOUT THIS MANUAL

1.1

This User's Manual may not be copied, reproduced, translated, changed or distributed, completely or partially in electronic,

machine readable, or in any other form without the written consent of TQ-Systems GmbH.

The drivers and utilities for the components used as well as the BIOS are subject to the copyrights of the respective

manufacturers. The licence conditions of the respective manufacturer are to be adhered to.

Bootloader-licence expenses are paid by TQ-Systems GmbH and are included in the price.

Licence expenses for the operating system and applications are not taken into consideration and must be calculated / declared

separately.

1.2

Registered trademarks

TQ-Systems GmbH aims to adhere to copyrights of all graphics and texts used in all publications, and strives to use original

or license-free graphics and texts.

All brand names and trademarks mentioned in this User's Manual, including those protected by a third party, unless specified

otherwise in writing, are subjected to the specifications of the current copyright laws and the proprietary laws of the present

registered proprietor without any limitation. One should conclude that brand and trademarks are rightly protected by a third

party.

1.3

Disclaimer

TQ-Systems GmbH does not guarantee that the information in this User's Manual is up-to-date, correct, complete or of good

quality. Nor does TQ-Systems GmbH assume guarantee for further usage of the information. Liability claims against TQ-Systems

GmbH, referring to material or non-material related damages caused, due to usage or non-usage of the information given in this

User's Manual, or due to usage of erroneous or incomplete information, are exempted, as long as there is no proven intentional

or negligent fault of TQ-Systems GmbH.

TQ-Systems GmbH explicitly reserves the rights to change or add to the contents of this User's Manual or parts of it without

special notification.

Important Notice:

Before using the Starterkit MBLS10xxA or parts of the schematics of the MBLS10xxA, you must evaluate it and determine if it is

suitable for your intended application. You assume all risks and liability associated with such use. TQ-Systems GmbH makes no

other warranties including, but not limited to, any implied warranty of merchantability or fitness for a particular purpose. Except

where prohibited by law, TQ-Systems GmbH will not be liable for any indirect, special, incidental or consequential loss or damage

arising from the usage of the Starterkit MBLS10xxA or schematics used, regardless of the legal theory asserted.

1.4

Imprint

TQ-Systems GmbH

Gut Delling, Mühlstraße 2

D-82229 Seefeld

Tel: +49 8153 9308–0

Fax: +49 8153 9308–4223

E-Mail: Info@TQ-Group

Web: TQ-Group

1.5

Tips on safety

Improper or incorrect handling of the product can substantially reduce its life span.

1.6

Symbols and typographic conventions

Table 1: Terms and Conventions

Symbol Meaning

This symbol represents the handling of electrostatic-sensitive modules and / or components. These

components are often damaged / destroyed by the transmission of a voltage higher than about 50 V.

A human body usually only experiences electrostatic discharges above approximately 3,000 V.

This symbol indicates the possible use of voltages higher than 24 V.

Please note the relevant statutory regulations in this regard.

Non-compliance with these regulations can lead to serious damage to your health and also cause

damage / destruction of the component.

This symbol indicates a possible source of danger. Acting against the procedure described can lead to

possible damage to your health and / or cause damage / destruction of the material used.

This symbol represents important details or aspects for working with TQ-products.

Command

A font with fixed-width is used to denote commands, contents, file names, or menu items.

1.7

Handling and ESD tips

General handling of your TQ-products

The TQ-product may only be used and serviced by certified personnel who have taken note of the

information, the safety regulations in this document and all related rules and regulations.

A general rule is: do not touch the TQ-product during operation. This is especially important when

switching on, changing jumper settings or connecting other devices without ensuring beforehand

that the power supply of the system has been switched off.

Violation of this guideline may result in damage / destruction of the TQMLS10xxA and be dangerous

to your health.

Improper handling of your TQ-product would render the guarantee invalid.

Proper ESD handling

The electronic components of your TQ-product are sensitive to electrostatic discharge (ESD).

Always wear antistatic clothing, use ESD-safe tools, packing materials etc., and operate your TQ-

product in an ESD-safe environment. Especially when you switch modules on, change jumper settings,

or connect other devices.

1.8

Naming of signals

A hash mark (#) at the end of the signal name indicates a low-active signal.

Example: RESET#

If a signal can switch between two functions and if this is noted in the name of the signal, the low-active function is marked with

a hash mark and shown at the end.

Example: C / D#

If a signal has multiple functions, the individual functions are separated by slashes when they are important for the wiring.

The identification of the individual functions follows the above conventions.

Example: WE2# / OE#

1.9

Further applicable documents / presumed knowledge

•

Specifications and manual of the modules used:

These documents describe the service, functionality and special characteristics of the module used (incl. BIOS).

•

Specifications of the components used:

The manufacturer's specifications of the components used, for example CompactFlash cards, are to be taken note of.

They contain, if applicable, additional information that must be taken note of for safe and reliable operation.

These documents are stored at TQ-Systems GmbH.

•

Chip errata:

It is the user's responsibility to make sure all errata published by the manufacturer of each component are taken note of.

The manufacturer’s advice should be followed.

•

Software behaviour:

No warranty can be given, nor responsibility taken for any unexpected software behaviour due to deficient components.

•

General expertise:

Expertise in electrical engineering / computer engineering is required for the installation and the use of the device.

The following documents are required to fully comprehend the following contents:

•MBLS10xxA circuit diagram

•MBLS10xxA User's Manual

•LS10xxA Data Sheets

•LS10xxA Reference Manuals

•U-Boot documentation: www.denx.de/wiki/U-Boot/Documentation

•Yocto documentation: www.yoctoproject.org/docs/

•TQ-Support Wiki: Support-Wiki TQMLS10xxA

BRIEF DESCRIPTION

This User's Manual describes the hardware of the TQMLS10xxA,

Rev. 02xx

and refers to some software settings. A certain

TQMLS10xxA derivative does not necessarily provide all features described in this User's Manual. This User's Manual does also

not replace the NXP CPU Reference Manuals. The information provided in this User's Manual is only valid in connection with the

tailored boot loader, which is preinstalled on the TQMLS10xxA, and the BSP provided by TQ-Systems GmbH. See also chapter 6.

The TQMLS10xxA is a universal Minimodule based on the NXP Layerscape CPUs LS1043A / LS1046A / LS1088A. These Layerscape

CPUs feature Dual Cortex®-A53 or Cortex®-A72 cores, Quad Cortex®-A53 or Cortex®-A72 cores, or octal Cortex®-A53 cores, with

QorIQ technology. The TQMLS10xxA extends the TQ-Systems GmbH product range and offers an outstanding computing

performance. A suitable CPU derivative (LS1043A / LS1046A / LS1088A) can be selected for each requirement. All essential CPU

pins are routed to the TQMLS10xxA connectors. There are therefore no restrictions for customers using the TQMLS10xxA with

respect to an integrated customised design. Furthermore all components required for the CPU to function like DDR4 SDRAM,

eMMC, power supply and power management are integrated on the TQMLS10xxA. The main TQMLS10xxA characteristics are:

•CPU derivatives LS1043A (LS1023A), LS1046A (LS1026A), LS1088A

•DDR4 SDRAM with ECC

•eMMC and QSPI NOR flash

•Single supply voltage 5 V

•On-board RTC / EEPROM / temperature sensor

The MBLS10xxA also serves as carrier board and reference platform for the TQMLS10xxA.

OVERVIEW

3.1

Block diagram

TQMLS10xxA connector

Muxing

QSPI NOR Flash

eMMC Flash

Layerscape CPU

LS1043A (LS1023A)

LS1046A (LS1026A)

LS1088A

DDR4

DDR4 (ECC)

Voltage

Monitoring

Temp. Sensor

RTC

EEPROM

Power

Supply

Board Controller

(Housekeeping)

CPLD

TQMLS10xxA connector

Figure 1: Block diagram TQMLS10xxA (simplified)

3.2

System components

The TQMLS10xxA provides the following key functions and characteristics:

•Layerscape CPUs LS1043A (LS1023A), LS1046A (LS1026A), LS1088A

•Oscillators

•Reset structure

•Power supply and power-sequencing

•Voltage supervision

•Housekeeping µController

•Temperature sensor

•RTC

•EEPROM

•DDR4 SDRAM with ECC

•QSPI NOR flash

•eMMC

•Four connectors (420 pins)

All essential CPU pins are routed to the TQMLS10xxA connectors. There are therefore no restrictions for customers using the

TQMLS10xxA with respect to an integrated customised design.

All TQMLS10xxA versions are fully pin-compatible and therefore interchangeable. The functionality of the different TQMLS10xxA

is mainly determined by the features provided by the respective CPU.

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