TQ TQMLX2160A Manual de usuario

TQMLX2160A

User’s Manual

TQMLX2160A UM 0100

28.02.2022

TABLE OF CONTENTS

1. ABOUT THIS MANUAL................................................................................................................................................................................1

1.1 Copyright and license expenses.............................................................................................................................................................1

1.2 Registered trademarks...............................................................................................................................................................................1

1.3 Disclaimer......................................................................................................................................................................................................1

1.4 Imprint............................................................................................................................................................................................................1

1.5 Tips on safety................................................................................................................................................................................................2

1.6 Symbols and typographic conventions ...............................................................................................................................................2

1.7 Handling and ESD tips...............................................................................................................................................................................2

1.8 Naming of signals........................................................................................................................................................................................3

1.9 Further applicable documents / presumed knowledge .................................................................................................................3

2. BRIEF DESCRIPTION ....................................................................................................................................................................................4

3. OVERVIEW......................................................................................................................................................................................................5

3.1 Block diagram...............................................................................................................................................................................................5

3.2 System components...................................................................................................................................................................................5

4. ELECTRONICS................................................................................................................................................................................................6

4.1 Processor variants .......................................................................................................................................................................................6

4.2 Reset structure .............................................................................................................................................................................................7

4.2.1 TQMLX_RST# ................................................................................................................................................................................................7

4.2.2 HRESET# .........................................................................................................................................................................................................7

4.2.3 RESET_REQ#..................................................................................................................................................................................................7

4.2.4 LX_CPU_RESET_OUT#................................................................................................................................................................................7

4.2.5 JTAG_TRST# ..................................................................................................................................................................................................7

4.3 Boot source ...................................................................................................................................................................................................8

4.4 DDR4 SDRAM................................................................................................................................................................................................8

4.5 NOR flash, eMMC / SD card ......................................................................................................................................................................8

4.6 EEPROMs........................................................................................................................................................................................................9

4.6.1 EEPROM, 24LC64 .........................................................................................................................................................................................9

4.6.2 Temperature sensor with EEPROM, SE97B..........................................................................................................................................9

4.6.2.1 Temperature sensor, SE97B .....................................................................................................................................................................9

4.6.2.2 EEPROM, SE97B......................................................................................................................................................................................... 10

4.7 RTC................................................................................................................................................................................................................ 10

4.8 Secure Element ......................................................................................................................................................................................... 11

4.9 Interfaces .................................................................................................................................................................................................... 12

4.9.1 SerDes.......................................................................................................................................................................................................... 12

4.9.2 I2C bus.......................................................................................................................................................................................................... 13

4.9.3 UART............................................................................................................................................................................................................. 14

4.9.4 USB................................................................................................................................................................................................................ 14

4.9.5 RGMII............................................................................................................................................................................................................ 14

4.9.6 JTAG.............................................................................................................................................................................................................. 14

4.10 Power supply............................................................................................................................................................................................. 15

4.10.1 Input voltage ............................................................................................................................................................................................. 15

4.10.2 Voltage monitoring ................................................................................................................................................................................. 15

4.10.3 Power consumption................................................................................................................................................................................ 15

4.11 TQMLX2160A connectivity.................................................................................................................................................................... 15

4.11.1 Interface impedances ............................................................................................................................................................................. 15

4.11.2 SerDes track length.................................................................................................................................................................................. 16

4.11.3 Pin multiplexing ....................................................................................................................................................................................... 17

4.11.4 Pinout TQMLX2160A connectors........................................................................................................................................................ 18

5. MECHANICS................................................................................................................................................................................................ 23

5.1 TQMLX2160A assembly.......................................................................................................................................................................... 23

5.2 TQMLX2160A weight, dimensions...................................................................................................................................................... 24

5.3 TQMLX2160A connectors...................................................................................................................................................................... 26

5.4 Protection against external effects..................................................................................................................................................... 26

5.5 Thermal management............................................................................................................................................................................ 27

5.6 Structural requirements......................................................................................................................................................................... 27

5.7 Notes of treatment................................................................................................................................................................................... 27

6. SOFTWARE.................................................................................................................................................................................................. 27

7. SAFETY REQUIREMENTS AND PROTECTIVE REGULATIONS......................................................................................................... 28

7.1 EMC............................................................................................................................................................................................................... 28

7.2 ESD................................................................................................................................................................................................................ 28

7.3 Operational safety and personal security......................................................................................................................................... 28

7.4 Climatic and operational conditions.................................................................................................................................................. 28

7.5 Reliability and service life....................................................................................................................................................................... 28

8. ENVIRONMENT PROTECTION................................................................................................................................................................ 29

8.1 RoHS ............................................................................................................................................................................................................. 29

8.2 WEEE®.......................................................................................................................................................................................................... 29

8.3 REACH®........................................................................................................................................................................................................ 29

8.4 EuP ................................................................................................................................................................................................................ 29

8.5 Battery.......................................................................................................................................................................................................... 29

8.6 Packaging ................................................................................................................................................................................................... 29

8.7 Other entries.............................................................................................................................................................................................. 29

9. APPENDIX ................................................................................................................................................................................................... 30

9.1 Acronyms and definitions...................................................................................................................................................................... 30

9.2 References.................................................................................................................................................................................................. 31

TABLE DIRECTORY

Table 1: Terms and Conventions ............................................................................................................................................................................2

Table 2: Boot source selection.................................................................................................................................................................................8

Table 3: eMMC_SEL0/1 signals................................................................................................................................................................................8

Table 4: eMMC Modes................................................................................................................................................................................................9

Table 5: TQMLX2160A-specific data in the EEPROM ..................................................................................................................................... 10

Table 6: SerDes Block 1 muxing options........................................................................................................................................................... 12

Table 7: SerDes Block 2 muxing options........................................................................................................................................................... 12

Table 8: SerDes Block 3 muxing options........................................................................................................................................................... 12

Table 9: I2C addresses.............................................................................................................................................................................................. 13

Table 10: TQMLX2160A power consumption @ 5 V......................................................................................................................................... 15

Table 11: TQMLX2160A interface impedances.................................................................................................................................................. 15

Table 12: SerDes track length and estimated insertion loss.......................................................................................................................... 16

Table 13: Pinout connector X1................................................................................................................................................................................ 18

Table 14: Pinout connector X2................................................................................................................................................................................ 19

Table 15: Pinout connector X3................................................................................................................................................................................ 21

Table 16: Labels on TQMLX2160A ......................................................................................................................................................................... 23

Table 17: TQMLX2160A side view dimensions.................................................................................................................................................. 24

Table 18: Connector assembled on TQMLX2160A........................................................................................................................................... 26

Table 19: Carrier board mating connectors........................................................................................................................................................ 26

Table 20: Climate and operational conditions................................................................................................................................................... 28

Table 21: Acronyms.................................................................................................................................................................................................... 30

Table 22: Further applicable documents............................................................................................................................................................. 31

FIGURE DIRECTORY

Figure 1: Block diagram TQMLX2160A (simplified)............................................................................................................................................5

Figure 2: Block diagram LX2160A ............................................................................................................................................................................6

Figure 3: Block diagram LX2120A ............................................................................................................................................................................6

Figure 4: Block diagram LX2080A ............................................................................................................................................................................6

Figure 5: Block diagram Reset structure ................................................................................................................................................................7

Figure 6: Block diagram NOR flash interface ........................................................................................................................................................8

Figure 7: Block diagram I2C1 EEPROM interface .................................................................................................................................................9

Figure 8: Block diagram RTC interface................................................................................................................................................................. 10

Figure 9: Block diagram SEC interface................................................................................................................................................................. 11

Figure 10: Block diagram I2C bus 1 structure on TQMLX2160A ..................................................................................................................... 13

Figure 11: Block diagram JTAG interface............................................................................................................................................................... 14

Figure 12: TQMLX2160A assembly, top................................................................................................................................................................. 23

Figure 13: TQMLX2160A assembly, bottom......................................................................................................................................................... 23

Figure 14: TQMLX2160A dimensions, side view................................................................................................................................................. 24

Figure 15: TQMLX2160A dimensions, top view .................................................................................................................................................. 25

Figure 16: TQMLX2160A dimensions, top view through TQMLX2160A...................................................................................................... 25

REVISION HISTORY

Rev. Date Name Pos. Modification

0100 28.02.2022 Kreuzer First edition

ABOUT THIS MANUAL

1.1

This User’s Manual may not be copied, reproduced, translated, changed or distributed, completely or partially in electronic,

machine readable, or in any other form without the written consent of TQ-Systems GmbH.

The drivers and utilities for the components used as well as the BIOS are subject to the copyrights of the respective

manufacturers. The licence conditions of the respective manufacturer are to be adhered to.

Bootloader-licence expenses are paid by TQ-Systems GmbH and are included in the price.

Licence expenses for the operating system and applications are not taken into consideration and must be calculated / declared

separately.

1.2

Registered trademarks

TQ-Systems GmbH aims to adhere to copyrights of all graphics and texts used in all publications, and strives to use original

or license-free graphics and texts.

All brand names and trademarks mentioned in this User’s Manual, including those protected by a third party, unless specified

otherwise in writing, are subjected to the specifications of the current copyright laws and the proprietary laws of the present

registered proprietor without any limitation. One should conclude that brand and trademarks are rightly protected by a third

party.

1.3

Disclaimer

TQ-Systems GmbH does not guarantee that the information in this User’s Manual is up-to-date, correct, complete or of good

quality. Nor does TQ-Systems GmbH assume guarantee for further usage of the information. Liability claims against TQ-Systems

GmbH, referring to material or non-material related damages caused, due to usage or non-usage of the information given in this

User’s Manual, or due to usage of erroneous or incomplete information, are exempted, as long as there is no proven intentional

or negligent fault of TQ-Systems GmbH.

TQ-Systems GmbH explicitly reserves the rights to change or add to the contents of this User’s Manual or parts of it without

special notification.

Important Notice:

Before using the Starterkit MBLX2160A or parts of the schematics of the MBLX2160A, you must evaluate it and determine if it is

suitable for your intended application. You assume all risks and liability associated with such use. TQ-Systems GmbH makes no

other warranties including, but not limited to, any implied warranty of merchantability or fitness for a particular purpose. Except

where prohibited by law, TQ-Systems GmbH will not be liable for any indirect, special, incidental or consequential loss or damage

arising from the usage of the Starterkit MBLX2160A or schematics used, regardless of the legal theory asserted.

1.4

Imprint

TQ-Systems GmbH

Gut Delling, Mühlstraße 2

D-82229 Seefeld

Tel: +49 8153 9308–0

Fax: +49 8153 9308–4223

E-Mail: Info@TQ-Group

Web: TQ-Group

1.5

Tips on safety

Improper or incorrect handling of the product can substantially reduce its life span.

1.6

Symbols and typographic conventions

Table 1: Terms and Conventions

Symbol Meaning

This symbol represents the handling of electrostatic-sensitive modules and / or components. These

components are often damaged / destroyed by the transmission of a voltage higher than about 50 V.

A human body usually only experiences electrostatic discharges above approximately 3,000 V.

This symbol indicates the possible use of voltages higher than 24 V.

Please note the relevant statutory regulations in this regard.

Non-compliance with these regulations can lead to serious damage to your health and also cause

damage / destruction of the component.

This symbol indicates a possible source of danger. Acting against the procedure described can lead to

possible damage to your health and / or cause damage / destruction of the material used.

This symbol represents important details or aspects for working with TQ-products.

Command

A font with fixed-width is used to denote commands, contents, file names, or menu items.

1.7

Handling and ESD tips

General handling of your TQ-products

The TQ-product may only be used and serviced by certified personnel who have taken note of the

information, the safety regulations in this document and all related rules and regulations.

A general rule is: do not touch the TQ-product during operation. This is especially important when

switching on, changing jumper settings or connecting other devices without ensuring beforehand

that the power supply of the system has been switched off.

Violation of this guideline may result in damage / destruction of the TQMLX2160A and be dangerous

to your health.

Improper handling of your TQ-product would render the guarantee invalid.

Proper ESD handling

The electronic components of your TQ-product are sensitive to electrostatic discharge (ESD).

Always wear antistatic clothing, use ESD-safe tools, packing materials etc., and operate your TQ-

product in an ESD-safe environment. Especially when you switch modules on, change jumper settings,

or connect other devices.

1.8

Naming of signals

A hash mark (#) at the end of the signal name indicates a low-active signal.

Example: RESET#

If a signal can switch between two functions and if this is noted in the name of the signal, the low-active function is marked with

a hash mark and shown at the end.

Example: C / D#

If a signal has multiple functions, the individual functions are separated by slashes when they are important for the wiring.

The identification of the individual functions follows the above conventions.

Example: WE2# / OE#

1.9

Further applicable documents / presumed knowledge

•

Specifications and manual of the modules used:

These documents describe the service, functionality and special characteristics of the module used (incl. BIOS).

•

Specifications of the components used:

The manufacturer’s specifications of the components used, for example CompactFlash cards, are to be taken note of.

They contain, if applicable, additional information that must be taken note of for safe and reliable operation.

These documents are stored at TQ-Systems GmbH.

•

Chip errata:

It is the user’s responsibility to make sure all errata published by the manufacturer of each component are taken note of.

The manufacturer’s advice should be followed.

•

Software behaviour:

No warranty can be given, nor responsibility taken for any unexpected software behaviour due to deficient components.

•

General expertise:

Expertise in electrical engineering / computer engineering is required for the installation and the use of the device.

The following documents are required to fully comprehend the following contents:

•MBLX2160A circuit diagram

•MBLX2160A User’s Manual

•LX2160A documentation

•U-Boot documentation: www.denx.de/wiki/U-Boot/Documentation

•Yocto documentation: www.yoctoproject.org/docs/

•TQ-Support Wiki: Support-Wiki TQMLX2160A

BRIEF DESCRIPTION

This User’s Manual describes the hardware of the TQMLX2160A,

Rev. 01xx

and refers to some software settings.

A certain TQMLX2160A derivative does not necessarily provide all features described in this User’s Manual.

This User’s Manual does also not replace the LX2160A documentation (1), (2). The information provided in this User’s Manual is

only valid in connection with the tailored boot loader, which is preinstalled on the TQMLX2160A, and the BSP provided by TQ-

Systems. See also chapter 6.

The TQMLX2160A is a universal Minimodule based on the ARM®NXP CPUs LX2080A, LX2120A or LX2160A.

These CPUs have up to 16 Cortex®-A72 cores with QorIQ technology. The TQMLX2160A extends the TQ-Systems GmbH product

range and offers an outstanding computing performance. A suitable CPU derivative can be selected for each requirement.

All essential CPU pins are routed to the TQMLX2160A connectors. There are therefore no restrictions using the TQMLX2160A with

respect to an integrated design. Furthermore all components required for the CPU to function like DDR4 SDRAM, eMMC, power

supply and power management are integrated on the TQMLX2160A.

The main TQMLX2160A characteristics are:

•LX CPUs with 8 / 12 / 16 cores

•Size 126 mm x 78 mm

•Up to 64 Gbyte DDR4 SDRAM with ECC

•Up to 64 Gbyte eMMC NAND flash

•Up to 512 Mbyte QSPI / Octal-NOR flash

•64 Kbit EEPROM

•Voltage supervision

•Real-Time-Clock

•Secure Element

•Temperature sensor

•All essential CPU pins are routed to the TQMLX2160A connectors

•Single 5 V power supply

The MBLX2160A serves as carrier board and reference platform for the TQMLX2160A.

OVERVIEW

3.1

Block diagram

Temp. Sensor

RTC

EEPROM

System

Controller

Muxing

Layerscape CPU

LX2160A

LX2120A

LX2080A

Module Connector

DDR4

DDR4 #1 64 bit + ECC

DDR4

DDR4 #2 64 bit + ECC

NOR Flash #1

NOR Flash #2

eMMC

Voltage

Monitoring Power

Supply

CPLD

Temp. Sensor

EEPROM

Clock

Module Connector

Secure Element

Figure 1: Block diagram TQMLX2160A (simplified)

3.2

System components

The TQMLX2160A provides the following key functions and characteristics:

•LX2160A / LX2120A / LX2080A CPU with up to 16 cores

•DDR4 SDRAM at two controllers

•eMMC NAND flash 5.1

•2x QSPI NOR flash

•EEPROM (optional)

•Real-Time clock (optional)

•Secure Element chip (optional)

•Oscillators

•Temperature sensor

•Housekeeping via system controller / CPLD

oVoltage supervision

oPower sequencing

oTemperature supervision

oError log

All essential CPU pins are routed to the TQMLX2160A connectors. There are therefore no restrictions for customers using the

TQMLX2160A with respect to an integrated customised design.

All TQMLX2160A versions are fully pin-compatible and therefore interchangeable.

The functionality of the different TQMLX2160A is mainly determined by the features provided by the respective CPU.

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