THine THC63LVDM83D Manual de usuario

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THC63LVDM83D / THC63LVDF(R)84C Evaluation Kit

LVDS Single Link Evaluation Board

Parts Number: THEVAM83D, THEVAF(R)84C

1.General Description

THEVAM83D and, THEVAF(R)84C boards are

designed to support video data transmission

between the host and display. One high-speed lane

can carry up to 24bits data and 3bits of

synchronizing signals at a pixel clock frequency

from 8MHz to 160MHz.

Table 1 Clock Frequency

Type

Parts Number

TTL Clock Freq.

Tx THEVAM83D 8MHz to 160MHz

Rx THEVAF(R)84C 8MHz to 112MHz

2. Features

・Compatible with TIA/EIA-644 LVDS Standard

・7:1 LVDS Transmitter and Receiver

・Single power supply

・Power Down Mode

< THEVAM83D>

･LVDS swing is reducible as 200mV by RS-pin

to reduce EMI and power consumption.

･Input clock triggering edge is selectable by

R/F-pin

< THEVAF84C>･Falling Edge Clock

< THEVAR84C>･Rising Edge Clock

3. Overview

(a) THEVAM83D (Top Side) (b) THEVAF(R)84C (Top Side)

Figure 1 THEVAM83D and THEVAF(R)84C Top Side View

(a) THEVAM83D (Bottom Side) (b)THEVAF(R)84C (Bottom Side)

Figure 2 THEVAM83D and THEVAF(R)84C Bottom Side View

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4. Power Supply Set Up

This chapter shows power supply condition.

Caution: Please check if there is no power-GND short on below red trace before supplying any power.

3.3V Power Supply to Each Board

Each evaluation board require 3.3V power supply. Please use “CON1” connector typically.

3.3V Power Supply

Ground

(a)THEVAM83D (b) THEVAF(R)84C

Figure 3 Power Supply for Evaluation Board

Power Supply from / to Connector

3.3V power supply can be connected to Header1 and CON2 by using W1 and W2solder jumper.

THEVAM83D

W1: Connect the 3.3V power supply with pin#29 and 30 of CON2.

W2: Connect the 3.3V power supply with pin#1, 2 and 3 of Header1.

Figure 4 THEVAM83D Power Supply from / to Each Connector

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THEVAF(R)84C

W1: Connect the 3.3V power supply with pin#1, 2 and 3 of Header1.

W2: Connect the 3.3V power supply with pin#1 and 2 of CON2.

W2 W1

Figure 5 THEVAF(R)84C Power Supply from / to Each Connect

5. Function Setting

Setting pin of each boards are shown in yellow area of figure 6. HEADER is connected to IC’s setting pin.

Each setting pin’s high or low setting can set by connecting HEADER and high level or low level.

(a)THEVAM83D (b) THEVAF(R)84C

Figure 6 Position of Function Setting Pin

High setting

Low setting

Connected with

IC s setting pin

High side

Low side

Figure 7 High / Low Setting Description

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5. Function

This chapter shows function setting of THEVAM83D and THEVAF(R)84C.

Table 2 THEVAM83D Function Setting Description

Silk Symbol Function

RF RF

Input clock triggering edge select input for latching input

data

H: Rising edge L: Falling edge

RS RS

LVDS Swing Mode.

RS LVDS

Swing

Small Swing

Input Support

VCC 350mV N/A

0.6 to 1.4V 350mV RS=V

REF

GND 200mV N/A

REF

: is Input Reference Voltage

PWDN PWDN Power down input.

H: Normal operation L: Power down

Table 3 THEVAF(R)84C Function Setting Description

Silk Symbol Function

PWDN PWDN Power down input.

H: Normal Operation L: Power Down

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6. Schematic

Figure 8 THEVAM83D Schematic

D D

C C

B B

A A

Title

Number RevisionSize

Date: 2015/02/26 Sheet of

File: \\..\THC63LVDM83D.SchDoc Drawn By:

THEVAM83D

1.00

1 1

282836-2(NC)

2GND

VCC

CON1

GND 10uF

GND

VDD3.3

SML-310MT

150Ω

GND

VDD3.3

MPZ1608R471A

10uF

GND

VDD3.3

MPZ1608R471A

10uF

GND

3HEAD(NC)

Header2

3HEAD(NC)

Header3

3HEAD(NC)

Header4

GND

R/F RS PDWN

PCN10-48P-2.54DSA_LEFT(NC)

Header1

VDD3.3

GND

HSYNC

VSYNC

CLKIN

CTRL

VDD3.3

VCC LVDSVCC

GND 29

TC6 30

CLK IN 31

/PDWN 32

PLL GND 33

PLL VCC 34

PLL GND 35

LVDS GND 36

TD+ 37

TD- 38

TCLK+ 39

TCLK- 40

TC+ 41

TC- 42

LVDS GND 43

LVDS VCC 44

TB+ 45

TB- 46

TA+ 47

TA- 48

LVDS GND 49

TD0 50

TA0 51

TA1 52

GND 53

TA3 55

TA4 56

TD1

TA5

TA6

GND

TB0

TB1

TD2

VCC

TD3

TB2

TB3

GND

TB4

TB5

TD4

R/F

TD5

TB6

TC0

GND

TC1

TC2

TC3

TD6

VCC

TC4

TC5

TA2 54

IC1

THC63LVDM83D

VDD3.3

MPZ1608R471A

10uF

GND

PLLVCC

0.01uFC8

0.1uFC5

0.01uFC11

0.1uFC12

GND

VCC

0.01uFC9

0.01uFC10

0.1uFC7

0.1uFC6

LVDSVCC

PLLVCC

GND

HSYNC

VSYNC

CTRL

CLKIN

PDWN

R/F

TD+

TD-

TCLK+

TCLK-

TC+

TC-

TB+

TB-

TA+

TA-

52271-3069(NC)

30 CON2

TD+

TD-

TCLK+

TCLK-

TC+

TC-

TB+

TB-

TA+

TA-

VDD3.3

GND

Solder Jumper

W2 Solder Jumper

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Figure 9 THEVAF(R)84C Schematic

D D

C C

B B

A A

Title

Number RevisionSize

Date: 2015/02/26 Sheet of

File: \\..\THC63LVDF(R)84.SchDoc Drawn By:

THEVAF(R) 84C

1.00

1 1

282836-2(NC)

2GND

VCC

CON1

GND 10uF

GND

VDD3.3

SML-310MT

150Ω

GND

VDD3.3

MPZ1608R471A

Inductor

10uF

GND

VDD3.3

MPZ1608R471A

Inductor

10uF

GND

3HEAD(NC)

Header2

GND

PDWN

VDD3.3

VCC LVDSVCC VDD3.3

MPZ1608R471A

Inductor

10uF

GND

PLLVCC

0.01uFC8

0.1uFC6

0.01uFC11

0.1uFC12

GND

VCC

0.01uFC9

0.01uFC10

0.1uFC7

0.1uFC5

LVDSVCC

PLLVCC

GND

HSYNC

VSYNC

CTRL

CLKOUT

PDWN

RD+

RD-

RCLK+

RCLK-

RC+

RC-

RB+

RB-

RA+

RA-

52271-3069(NC)

CON2

RD+

RD-

RCLK+

RCLK-

RC+

RC-

RB+

RB-

RA+

RA-

VDD3.3

GND

RA1 29

RA2 30

VCC 31

RA3 32

RA4 33

RD1 34

RA5 35

GND 36

RA6 37

RB0 38

RB1 39

VCC 40

RD2 41

RD3 42

RB2 43

GND 44

RB3 45

RB4 46

RB5 47

VCC 48

RD4 49

RD5 50

RB6 51

GND 52

RC0 53

RC2 55

VCC 56

RC3

RD6

RC4

GND

RC5

RC6

RD0

LVDSGND

RA-

RA+

RB-

RB+

LVDSVCC

LVDSGND

RC-

RC+

RCLK-

RCLK+

RD-

RD+

LVDSGND

PLLGND

PLLVCC

PLLGND

/PDWN

CLKOUT

RA0

GND

RC1 54

IC1

THC63LVDF(R) 84C

100Ω

R10

100Ω

R15

100Ω

R23

100Ω

R28

100Ω

R35

PCN10-48P-2.54DSA_RIGHT(NC)

Header1

R2_C

R3_C

G2_C

G3_C

VSYNC_C

DE_C

G9_C

R4_C

R5_C

R6_C

R7_C

R8_C

R9_C

G4_C

G5_C

G6_C

G7_C

G8_C

CLKOUT_C

B4_C

B5_C

B6_C

B7_C

B8_C

B9_C

HSYNC_C

B2_C

B3_C

CTRL_C

GND GND

VDD3.3

VSYNC

HSYNC

CTRL

10ΩR2

10ΩR3

10ΩR4

10ΩR5

10ΩR8

10ΩR11

10ΩR13

10ΩR14

10ΩR16

10ΩR17

10ΩR18

10ΩR19

10ΩR21

10ΩR24

10ΩR26

10ΩR27

10ΩR29

10ΩR30

10ΩR31

10ΩR32

10ΩR33

10ΩR34

10ΩR36

10ΩR38

10ΩR39

10ΩR40

10ΩR41

10ΩR42

CLKOUT 10ΩR43

R2_C

G2_C

VSYNC_C

R4_C

R6_C

R8_C

G4_C

G6_C

G8_C

B4_C

B5_C

B6_C

B7_C

B8_C

B9_C

HSYNC_C

B2_C

B3_C

CTRL_C

R3_C

R5_C

R7_C

R9_C

G3_C

G9_C

G5_C

G7_C

DE_C

CLKOUT_C

Solder Jumper

0Ω(NC) R6

0Ω(NC) R9

0Ω(NC) R12

0Ω(NC)R7

0Ω(NC)R22

0Ω(NC) R25

0Ω(NC) R37

0Ω(NC) R20

Solder Jumper

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7. Bills of Materials

Table 4 THEVAM83D BOM

TYPE Value / Part No. Package SPEC Reference No. Qty.

Capacitor 10uF 2012 16V C1, C2, C3, C4 4

Capacitor 0.1uF 1005 16V C5, C6, C7, C12 4

Capacitor 0.01uF 1005 16V C8, C9, C10, C11 4

Connector 282836-2(NC) 5mm_pitch 2pin CON1 1

Connector 52271-3069(NC) 1mm_pitch 30pin CON2 1

Connector PCN10-48P-2.54DSA_LEFT(NC) 2.54mm_pitch 48pin Header1 1

Header 3HEAD(NC) 2.54mm_pitch --- Header2, Header3, Header4 3

IC THC63LVDM83D TSSOP56 --- IC1 1

Inductor MPZ1608R471A 1608 1.2A L1, L2, L3 3

LED0 SML-310MT 1608 GREEN D1 1

Resistor 150Ω 1005 0.1W R1 1

Table 5 THEVAF(R)84C BOM

TYPE Value / Part No. Package SPEC Reference No. Qty.

Capacitor 10uF 2012 16V C1, C2, C3, C4 4

Capacitor 0.1uF 1005 16V C5, C6, C7, C12 4

Capacitor 0.01uF 1005 16V C8, C9, C10, C11 4

Connector PCN10-48P-2.54DSA_RIGHT(N

C) 2.54mm_pitch 48pin Header1 1

Connector 52271-3069(NC) 1mm_pitch 30pin CON2 1

Connector 282836-2(NC) 5mm_pitch 2pin CON1 1

Header 3HEAD(NC) 2.54mm_pitch --- Header2 1

IC THC63LVDF(R)84C TSSOP56 --- IC1 1

Inductor MPZ1608R471A 1608 1.2A L1, L2, L3 3

LED0 SML-310MT 1608 GREEN D1 1

Resistor 150Ω 1005 0.1W R1 1

Resistor 100Ω 1005 0.1W R10, R15, R23, R28, R35 5

Resistor 10Ω 1005 0.1W

R2, R3, R4, R5, R8, R11, R13, R14,

R16, R17, R18, R19, R21, R24, R26,

R27, R29, R30, R31, R32, R33, R34,

R36, R38, R39, R40, R41, R42, R43

Resistor 0Ω(NC) 1005 1A R6, R7, R9, R12, R20, R22, R25, R37 8

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8. Set items

Table 6 Set Items

TYPE Part No.

DC Connector 282836-2

FFC Connector for LVDS Link 52271-3069

FFC 30pin 1mm pitch for LVDS Link 98267-0475

Pin Header ---

It's possible to mount these parts on this board and use.

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9. Notices and Requests

Please kindly read, understand and accept this “Notes and Requests” before using this product.

For the Material:

1. The product specifications described in this material are subject to change without prior notice.

2. The circuit diagrams described in this material are examples of the application which may not always

apply to design of respective customers. THine Electronics, Inc. (“THine”) is not responsible for

possible errors and omissions in this material. Please note if the errors or omissions should be found in

this material, THine may not be able to correct them immediately.

3. This material contains THine’s copyright, know-how or other proprietary. Copying or disclosing of the

contents of this material to any third party without THine’s prior permission is strictly prohibited.

For the Product:

1. This product is solely designed for evaluation purpose, and other purposes including mass production

and distribution are not intended.

2. This product has been solely manufactured for electric design engineers but not for end-users.

3. This product is not radiation-tolerant product.

4. This product is presumed to be used for general electric device, not for applications which require

extremely high-reliability/safety (including medical device concerned with critical care, aerospace

device, or nuclear power control device). Also, when using this product for any device concerned with

control and/or safety of transportation mean, traffic signal device, or other various types of safety

device, such use must be after applying appropriate measures to the product.

5. This product has been designed with the utmost care to accomplish the purpose of evaluation of IC

products manufactured by THine Electronics, Inc., however, THine MAKES NO WARRANTIES OR

REPRESENTATIONS WITH REGARD TO ANY PERFORMANCE OR FUNCTION OF THIS

PRODUCT IN ANY CIRCUMSTANCE.

6. This product has been manufactured with the utmost care in quality control and product reliability,

however, there may be faults or defects with a low but fixed probability, as inevitable phenomenon

concerned with semiconductor manufacturing processes. Therefore, Customers are encouraged to have

sufficiently redundant or error-preventive design applied to the use of the product so as not to have

THine’s product cause any social or public damage. Replacement of the product is only available in

case of obvious defects of mount devices at the point of unpacking the product. Neither replacement

nor failure analysis of the product is available in any other case of defects with the product and/or the

product’s components.

7. Customers are asked, if required, to judge by themselves on whether this product falls under the

category of strategic goods under the Foreign Exchange and Foreign Trade Control Law.

8. Please Note that if infringement of any third party’s industrial ownership should occur by using this

product, THine will be exempted from any responsibility unless it directly relates to the production

process or functions of the product.

9. Developing, designing and manufacturing of Customers’ own products, equipments or system by using

of this product is strictly prohibited in any way.

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