Texas Instruments SN74LVC2G241 Manual de usuario

2 6 1Y

1OE

5 3 2Y

2OE

Product

Folder

Sample &

Buy

Technical

Documents

Tools &

Software

Support &

Community

SN74LVC2G241

SCES210O –APRIL 1999–REVISED DECEMBER 2015

SN74LVC2G241 Dual Buffer and Driver With 3-State Outputs

1 Features 3 Description

This dual buffer and line driver is designed for 1.65-V

1• Available in the Texas Instruments to 5.5-V VCC operation.

NanoFree™ Package The SN74LVC2G241 device is designed specifically

• Supports 5-V VCC Operation to improve both the performance and density of 3-

• Inputs Accept Voltages to 5.5 V state memory-address drivers, clock drivers, and bus-

• Max tpd of 4.1 ns at 3.3 V oriented receivers and transmitters.

• Low Power Consumption, 10-µA Maximum ICC NanoFree package technology is a major

• ±24-mA Output Drive at 3.3 V breakthrough in IC packaging concepts, using the die

as the package.

• Typical VOLP (Output Ground Bounce)

<0.8 V at VCC = 3.3 V, TA= 25°C The SN74LVC2G241 device is organized as two 1-bit

• Typical VOHV (Output VOH Undershoot) line drivers with separate output-enable (1OE, 2OE)

>2 V at VCC = 3.3 V, TA= 25°C inputs. When 1OE is low and 2OE is high, the device

passes data from the A inputs to the Y outputs. When

• Ioff Supports Live Insertion, Partial-Power-Down 1OE is high and 2OE is low, the outputs are in the

Mode, and Back-Drive Protection high-impedance state.

• Can Be Used as a Down Translator to Translate To ensure the high-impedance state during power up

Inputs From a Max of 5.5 V Down or power down, OE should be tied to VCC through a

to the VCC Level pullup resistor, and OE should be tied to GND

• Latch-Up Performance Exceeds 100 mA Per through a pulldown resistor; the minimum value of the

JESD 78, Class II resistor is determined by the current-sinking or the

• ESD Protection Exceeds JESD 22 current-sourcing capability of the driver.

– 2000-V Human-Body Model (A114-A) This device is fully specified for partial-power-down

applications using Ioff. The Ioff circuitry disables the

– 200-V Machine Model (A115-A) outputs, preventing damaging current backflow

– 1000-V Charged-Device Model (C101) through the device when it is powered down.

2 Applications Device Information(1)

• AV Receivers PART NUMBER PACKAGE BODY SIZE (NOM)

• Blu-ray Players and Home Theaters SN74LVC2G241DCT SM8 (8) 2.95 mm × 2.80 mm

• DVD Recorders and Players SN74LVC2G241DCU VSOOP (8) 2.30 mm × 2.00 mm

SN74LVC2G241YZP DSBGA (8) 1.91 mm × 0.91 mm

• Desktop or Notebook PCs

• Digital Radio or Internet Radio Players (1) For all available packages, see the orderable addendum at

the end of the data sheet.

• Digital Video Cameras (DVC)

• Embedded PCs Logic Diagram (Positive Logic)

• GPS: Personal Navigation Devices

• Mobile Internet Devices

• Network Projector Front-Ends

• Portable Media Players

• Pro Audio Mixers

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

SN74LVC2G241

SCES210O –APRIL 1999–REVISED DECEMBER 2015

www.ti.com

Table of Contents

8.2 Functional Block Diagram......................................... 9

1 Features.................................................................. 18.3 Feature Description................................................... 9

2 Applications ........................................................... 18.4 Device Functional Modes.......................................... 9

3 Description............................................................. 19 Application and Implementation ........................ 10

4 Revision History..................................................... 29.1 Application Information............................................ 10

5 Pin Configuration and Functions......................... 39.2 Typical Application ................................................. 10

6 Specifications......................................................... 410 Power Supply Recommendations ..................... 11

6.1 Absolute Maximum Ratings ..................................... 411 Layout................................................................... 11

6.2 ESD Ratings.............................................................. 411.1 Layout Guidelines ................................................. 11

6.3 Recommended Operating Conditions ...................... 411.2 Layout Example .................................................... 11

6.4 Thermal Information.................................................. 512 Device and Documentation Support................. 12

6.5 Electrical Characteristics........................................... 512.1 Documentation Support ........................................ 12

6.6 Switching Characteristics, TA= –40°C to 85°C ........ 612.2 Community Resources.......................................... 12

6.7 Switching Characteristics, TA= –40°C to 125°C ...... 612.3 Trademarks........................................................... 12

6.8 Operating Characteristics.......................................... 712.4 Electrostatic Discharge Caution............................ 12

6.9 Typical Characteristic................................................ 712.5 Glossary................................................................ 12

7 Parameter Measurement Information .................. 813 Mechanical, Packaging, and Orderable

8 Detailed Description.............................................. 9Information........................................................... 12

8.1 Overview................................................................... 9

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision N (November 2013) to Revision O Page

• Added Applications section, Device Information table, ESD Ratings table, Thermal Information table, Typical

Characteristics,Feature Description section, Device Functional Modes,Application and Implementation section,

Power Supply Recommendations section, Layout section, Device and Documentation Support section, and

Mechanical, Packaging, and Orderable Information section.................................................................................................. 1

Changes from Revision M (February 2007) to Revision N Page

• Updated document to new TI data sheet format.................................................................................................................... 1

• Removed Ordering Information table. .................................................................................................................................... 1

• Updated Features................................................................................................................................................................... 1

• Updated operating temperature range. .................................................................................................................................. 4

Product Folder Links: SN74LVC2G241

GND 5

42A

361Y2Y

272OE1A

8VCC

1OE

1VCC

1OE

1A 2OE

3 6

2Y 1Y

GND 2A

3 6 1Y2Y

1VCC

1OE

GND 42A

272OE1A

SN74LVC2G241

www.ti.com

SCES210O –APRIL 1999–REVISED DECEMBER 2015

5 Pin Configuration and Functions

DCT Package DCU Package

8-Pin SM8 8-Pin VSSOP

Top View Top View

YZP Package

8-Pin DSBGA

Bottom View

Pin Functions(1)(2)

PIN I/O DESCRIPTION

NAME NO.

1A 2 I Input

1OE 1 I Output enable (Active low)

1Y 6 O Output

2A 5 I Input

2Y 3 O Output

2OE 7 I Output enable (Active high)

GND 4 — Ground

VCC 8 — Power pin

(1) N.C. – No internal connection

(2) See Mechanical, Packaging, and Orderable Information for dimensions

Product Folder Links: SN74LVC2G241

SN74LVC2G241

SCES210O –APRIL 1999–REVISED DECEMBER 2015

www.ti.com

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN MAX UNIT

VCC Supply voltage –0.5 6.5 V

VIInput voltage(2) –0.5 6.5 V

VOVoltage applied to any output in the high-impedance or power-off state(2) –0.5 6.5 V

VOVoltage applied to any output in the high or low state(2)(3) –0.5 VCC + 0.5 V

IIK Input clamp current VI< 0 –50 mA

IOK Output clamp current VO< 0 –50 mA

IOContinuous output current ±50 mA

Continuous current through VCC or GND ±100 mA

TJMaximum junction temperature 150 °C

Tstg Storage temperature –65 150 °C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.

(3) The value of VCC is provided in the Recommended Operating Conditions table.

6.2 ESD Ratings VALUE UNIT

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±2000

Electrostatic

V(ESD) V

Charged-device model (CDM), per JEDEC specification JESD22-C101, all

discharge ±1000

pins(2)

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions(1)

MIN MAX UNIT

Operating 1.65 5.5

VCC Supply voltage V

Data retention only 1.5

VCC = 1.65 V to 1.95 V 0.65 × VCC

VCC = 2.3 V to 2.7 V 1.7

VIH High-level input voltage V

VCC = 3 V to 3.6 V 2

VCC = 4.5 V to 5.5 V 0.7 × VCC

VCC = 1.65 V to 1.95 V 0.35 × VCC

VCC = 2.3 V to 2.7 V 0.7

VIL Low-level input voltage V

VCC = 3 V to 3.6 V 0.8

VCC = 4.5 V to 5.5 V 0.3 × VCC

VIInput voltage 0 5.5 V

High or low state 0 VCC

VOOutput voltage V

3-state 0 5.5

VCC = 1.65 V –4

VCC = 2.3 V –8

IOH High-level output current –16 mA

VCC = 3 V –24

VCC = 4.5 V –32

(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report

Implications of Slow or Floating CMOS Inputs,SCBA004.

Product Folder Links: SN74LVC2G241

SN74LVC2G241

www.ti.com

SCES210O –APRIL 1999–REVISED DECEMBER 2015

Recommended Operating Conditions(1) (continued)

MIN MAX UNIT

VCC = 1.65 V 4

VCC = 2.3 V 8

IOL Low-level output current 16 mA

VCC = 3 V 24

VCC = 4.5 V 32

VCC = 1.8 V ± 0.15 V, 2.5 V ± 0.2 V 20

Δt/Δv Input transition rise or fall rate VCC = 3.3 V ± 0.3 V 10 ns/V

VCC = 5 V ± 0.5 V 5

TAOperating free-air temperature –40 85 °C

6.4 Thermal Information SN74LVC2G241

DCT DCU YZP

THERMAL METRIC(1) UNIT

(SM8) (VSSOP) (DSBGA)

8 PINS 8 PINS 8 PINS

RθJA Junction-to-ambient thermal resistance 220 227 102 °C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6.5 Electrical Characteristics

over recommended operating free-air temperature range, TA= –40ºC to 125°C (unless otherwise noted)

PARAMETER TEST CONDITIONS VCC TAMIN TYP(1) MAX UNIT

IOH = –100 µA 1.65 V to 5.5 V VCC – 0.1

IOH = –4 mA 1.65 V 1.2

IOH = –8 mA 2.3 V 1.9

VOH V

IOH = –16 mA 2.4

3 V

IOH = –24 mA 2.3

IOH = –32 mA 4.5 V 3.8

IOL = 100 µA 1.65 V to 5.5 V 0.1

IOL = 4 mA 1.65 V 0.45

IOL = 8 mA 2.3 V 0.3

IOL = 16 mA 0.4

3 V

VOL V

IOL = 24 mA 0.55

TA= –40ºC to

85°C

IOL = 32 mA 4.5 V 0.55

TA= –40ºC to

125°C

A or control

IIVI= 5.5 V or GND 0 to 5.5 V ±5 µA

inputs

Ioff VIor VO= 5.5 V 0 ±10 µA

IOZ VO= 0 to 5.5 V 3.6 V 10 µA

ICC VI= 5.5 V or GND, IO= 0 1.65 V to 5.5 V 10 µA

One input at VCC – 0.6 V,

ΔICC 3 V to 5.5 V 500 µA

Other inputs at VCC or GND

TA= –40ºC to

CiVI= VCC or GND 3.3 V 3.5 pF

85°C

TA= –40ºC to

CoVO= VCC or GND 3.3 V 6.5 pF

85°C

(1) All typical values are at VCC = 3.3 V, TA= 25°C.

Product Folder Links: SN74LVC2G241

SN74LVC2G241

SCES210O –APRIL 1999–REVISED DECEMBER 2015

www.ti.com

6.6 Switching Characteristics, TA= –40°C to 85°C

over recommended operating free-air temperature range (unless otherwise noted) (see Figure 2)

FROM TO

PARAMETER VCC MIN MAX UNIT

(INPUT) (OUTPUT)

VCC = 1.8 V ± 0.15 V 3.3 8.8

VCC = 2.5 V ± 0.2 V 1.5 4.8

tpd A Y ns

VCC = 3.3 V ± 0.3 V 1.4 4.3

VCC = 5 V ± 0.5 V 1 3.7

VCC = 1.8 V ± 0.15 V 4 9.9

VCC = 2.5 V ± 0.2 V 1.9 5.6

ten OE Y ns

VCC = 3.3 V ± 0.3 V 1.2 4.7

VCC = 5 V ± 0.5 V 1.2 3.8

VCC = 1.8 V ± 0.15 V 1.5 11.6

VCC = 2.5 V ± 0.2 V 1 5.8

tdis OE Y ns

VCC = 3.3 V ± 0.3 V 1.4 1.4

VCC = 5 V ± 0.5 V 1 3.4

VCC = 1.8 V ± 0.15 V 3.2 8.8

VCC = 2.5 V ± 0.2 V 1.5 4.7

ten OE Y ns

VCC = 3.3 V ± 0.3 V 1.6 4.1

VCC = 5 V ± 0.5 V 1.1 3.3

VCC = 1.8 V ± 0.15 V 1.7 12.5

VCC = 2.5 V ± 0.2 V 1 5.2

tdis OE Y ns

VCC = 3.3 V ± 0.3 V 1 4.2

VCC = 5 V ± 0.5 V 1 3.3

6.7 Switching Characteristics, TA= –40°C to 125°C

over recommended operating free-air temperature range (unless otherwise noted) (see Figure 2)

FROM TO

PARAMETER VCC MIN MAX UNIT

(INPUT) (OUTPUT)

VCC = 1.8 V ± 0.15 V 3.3 9.8

VCC = 2.5 V ± 0.2 V 1.5 5.8

tpd A Y ns

VCC = 3.3 V ± 0.3 V 1.4 5.3

VCC = 5 V ± 0.5 V 1 4.2

VCC = 1.8 V ± 0.15 V 4 10.9

VCC = 2.5 V ± 0.2 V 1.9 6.6

ten OE Y ns

VCC = 3.3 V ± 0.3 V 1.2 5.7

VCC = 5 V ± 0.5 V 1.2 4.3

VCC = 1.8 V ± 0.15 V 1.5 12.6

VCC = 2.5 V ± 0.2 V 1 6.8

tdis OE Y ns

VCC = 3.3 V ± 0.3 V 1.4 5.4

VCC = 5 V ± 0.5 V 1 4.4

VCC = 1.8 V ± 0.15 V 3.2 9.8

VCC = 2.5 V ± 0.2 V 1.5 5.7

ten OE Y ns

VCC = 3.3 V ± 0.3 V 1.6 5.1

VCC = 5 V ± 0.5 V 1.1 3.8

VCC = 1.8 V ± 0.15 V 1.7 13.5

VCC = 2.5 V ± 0.2 V 1 6.2

tdis OE Y ns

VCC = 3.3 V ± 0.3 V 1 5.2

VCC = 5 V ± 0.5 V 1 4.3

Product Folder Links: SN74LVC2G241

0.5

1.5

2.5

3.5

0 1 2 3 4 5 6

Propagation Delay (tPD)

Supply Voltage [VCC] (V)

Typ. Char.

C001

SN74LVC2G241

www.ti.com

SCES210O –APRIL 1999–REVISED DECEMBER 2015

6.8 Operating Characteristics

TA= 25°C PARAMETER TEST CONDITIONS VCC TYP UNIT

VCC = 1.8 V 19

VCC = 2.5 V 19

Outputs enabled pF

VCC = 3.3 V 20

Power dissipation VCC = 5 V 22

Cpd capacitance f = 10 MHz VCC = 1.8 V 2

per buffer/driver VCC = 2.5 V 2

Outputs disabled pF

VCC = 3.3 V 2

VCC = 5 V 3

6.9 Typical Characteristic

Figure 1. tpd vs Vcc Over Full Temperature Range

Product Folder Links: SN74LVC2G241

tsu

From Output

Under Test

(see Note A)

LOAD CIRCUIT

VLOAD

Open

GND

Data Input

Timing Input

0 V

Input

0 V

Input

Output

Waveform 1

S1 at V

(see Note B)

LOAD

Output

Waveform 2

S1 at GND

(see Note B)

VOL

VOH

0 V

»0 V

Output

TEST S1

t /t

PLH PHL Open

Output

Control

VMVM

1.8 V 0.15 V±

2.5 V 0.2 V±

3.3 V 0.3 V±

5 V 0.5 V±

1 kW

500 W

VCC RL

2 × VCC

6 V

2 × VCC

VLOAD CL

30 pF

50 pF

0.15 V

0.3 V

3 V

VCC/2

1.5 V

VCC/2

£2 ns

£2.5 ns

INPUTS

t /t

r f

VCC

VLOAD

t /t

PLZ PZL

GND

t /t

PHZ PZH

VOLTAGE WAVEFORMS

ENABLE AND DISABLE TIMES

LOW- AND HIGH-LEVEL ENABLING

VOLTAGE WAVEFORMS

PROPAGATION DELAY TIMES

INVERTING AND NONINVERTING OUTPUTS

NOTES: A. C includes probe and jig capacitance.

B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.

Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.

C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, Z = 50 .

D. The outputs are measured one at a time, with one transition per measurement.

E. t and t are the same as t .

F. t and t are the same as t .

G. t and t are the same as t .

H. All parameters and waveforms are not applicable to all devices.

PLZ PHZ dis

PZL PZH en

PLH PHL pd

£ W

VOLTAGE WAVEFORMS

PULSE DURATION

VOLTAGE WAVEFORMS

SETUP AND HOLD TIMES

V /2

LOAD

tPZL tPLZ

tPHZ

tPZH

V – V

OH D

V + V

OL D

VMVM

VOL

VOH

VOL

tPLH tPHL

tPLH

tPHL

SN74LVC2G241

SCES210O –APRIL 1999–REVISED DECEMBER 2015

www.ti.com

7 Parameter Measurement Information

Figure 2. Load Circuit and Voltage Waveforms

Product Folder Links: SN74LVC2G241

2 6 1Y

1OE

5 3 2Y

2OE

SN74LVC2G241

www.ti.com

SCES210O –APRIL 1999–REVISED DECEMBER 2015

8 Detailed Description

8.1 Overview

The SN74LVC2G241 device is designed specifically to improve both the performance and density of 3-state

memory-address drivers, clock drivers, and bus-oriented receivers and transmitters. The SN74LVC2G241 device

is organized as two 1-bit line drivers with separate output-enable (1OE, 2OE) inputs. When 1OE is low and 2OE

is high, the device passes data from the A inputs to the Y outputs. When 1OE is high and 2OE is low, the

outputs are in the high-impedance state.

The SN74LVC2G241 is also an effective redriver, with a maximum output current drive of 32 mA.

8.2 Functional Block Diagram

Figure 3. Logic Diagram (Positive Logic)

8.3 Feature Description

To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup

resistor, and OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is

determined by the current-sinking or the current-sourcing capability of the driver.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,

preventing damaging current backflow through the device when it is powered down.

8.4 Device Functional Modes

Table 1 and Table 2 list the functional modes of the SN74LVC2G241.

Table 1. Gate 1 Functional Table

INPUTS OUTPUT

1OE 1A

L H H

L L L

H X Z

Table 2. Gate 2 Functional Table

INPUTS OUTPUT

2OE 2A

H H H

H L L

L X Z

Product Folder Links: SN74LVC2G241

SN74LVC2G241

(One driver)

Physical Push

Button Microprocessor

VCC

SN74LVC2G241

SCES210O –APRIL 1999–REVISED DECEMBER 2015

www.ti.com

9 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component

specification, and TI does not warrant its accuracy or completeness. TI’s customers are

responsible for determining suitability of components for their purposes. Customers should

validate and test their design implementation to confirm system functionality.

9.1 Application Information

Typical Application shows a simple application where a physical push button is connected to the

SN74LVC2G241. The push button is in a physical location far enough away from the processor that the input

signal is weak and needs to be redriven. The SN74LVC2G241 acts as a redriver, providing a strong input signal

to the processor with as little as 1 ns of propagation delay.

9.2 Typical Application

Figure 4. SN74LVC2G241 Application

9.2.1 Design Requirements

This device uses CMOS technology and has balanced output drive. Take care to avoid bus contention because it

can drive currents that would exceed maximum limits. The high drive also creates fast edges into light loads, so

routing and load conditions must be considered to prevent ringing.

9.2.2 Detailed Design Procedure

1. Recommended Input Conditions

– Rise time and fall time specs. See (Δt/ΔV) in Recommended Operating Conditions.

– Specified high and low levels. See (VIH and VIL)inRecommended Operating Conditions.

– Inputs are overvoltage tolerant allowing them to go as high as (VImax) in Recommended Operating

Conditions at any valid VCC.

2. Recommend Output Conditions

– Load currents must not exceed (IOmax) per output and must not exceed (Continuous current through VCC

or GND) total current for the part. These limits are located in Absolute Maximum Ratings.

– Outputs must not be pulled above VCC during normal operation or 5.5 V in high-z state.

Product Folder Links: SN74LVC2G241

Tabla de contenidos

Otros manuales de Herramientas eléctricas de Texas Instruments

Texas Instruments

Texas Instruments CC430F6137 Manual de usuario

Manuales populares de Herramientas eléctricas de otras marcas

AEG

AEG OMNI-JS Manual de usuario

SIP

SIP 01533 Manual de usuario

Ribimex

Ribimex PRS499 Manual de usuario

3M Fiber Optic Connector Crimp Tool Manual de usuario

Ryobi

Ryobi P524 Manual de usuario

ROJEK

ROJEK FSN 300A Manual de usuario

Kemper

Kemper 1740PRO Manual de usuario

WABCO

WABCO OptiTire Manual de usuario

EINHELL

EINHELL TE-MS 18/210 Li Manual de usuario

Orgapack

Orgapack OR-T 85 Guía rápida

TOUGHCUT

TOUGHCUT Diamond 400 Manual de usuario

Yaros

Yaros PB-3603 Manual de usuario

Fein

Fein BSS 2.0 E Guía de configuración

Baileigh Industrial

Baileigh Industrial SS-2725 Manual de usuario

Milwaukee

Milwaukee 2674-20 Manual de usuario

Fein

Fein BLs 1.6 Manual de usuario

Princess

Princess Electric Multi Sharpener Manual de usuario

FOREDOM

FOREDOM K.1050 Manual