Texas Instruments FDC1004QEVM Manual de usuario

FDC1004QEVM User Guide

User's Guide

Literature Number: SNAU178

April 2015

Contents

1 Introduction......................................................................................................................... 4

2 Setup.................................................................................................................................. 4

2.1 FDC1004QEVM .......................................................................................................... 4

2.2 Input/Output Connector Description ................................................................................... 5

2.3 HW Setup ................................................................................................................. 6

2.4 SW Setup ................................................................................................................. 6

2.5 Operation.................................................................................................................. 6

3 Board Layout....................................................................................................................... 6

4 Schematic........................................................................................................................... 8

Revision History.......................................................................................................................... 10

2Table of Contents SNAU178–April 2015

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List of Figures

1 FDC1004QEVM : Sections................................................................................................. 5

2 Top Layer Routing........................................................................................................... 6

3 Bottom Layer Routing....................................................................................................... 7

4 FDC1004QEVM Schematic ................................................................................................ 8

List of Tables

1 Ordering....................................................................................................................... 4

2 J1, J2 Pin Out ................................................................................................................ 5

3 J4 Pin Out..................................................................................................................... 5

4 J5 Pin Out..................................................................................................................... 6

5 Bill of Materials............................................................................................................... 9

SNAU178–April 2015 List of Figures

User's Guide

SNAU178–April 2015

FDC1004QEVM User's Guide

1 Introduction

The FDC1004QEVM evaluation kit is a plug and play system to test and evaluate the FDC1004Q, AEC-

Q100 qualified, 4-channel capacitive to digital converter. The EVM is a breakable PCB which consists of 3

sections. The first section is a USB to I2C converter based on MSP430F5528 micro-controller, the second

section contains the FDC1004Q and the third section is a touchless sensor (to demonstrate the sensitivity

of the FDC1004Q) . The third section can be removed and replace with customized sensors to evaluate

the capabilities of the FDC1004Q in various applications. The FDC1004QEVM can be used with the

FDC1004EVM GUI. The software is able to configure the FDC1004Q’s registers, display on four graphs

(one for each measurement) the capacitive values and export data in CSV format.

The EVM contains one FDC1004Q (See Table 1).

Table 1. Ordering

DEVICE IC Package

U1 FDC1004QDGS VSSOP 10pin

2 Setup

This section provides a general description about FDC1004QEVM, its I/O connectors and how to properly

setup the evaluation module.

2.1 FDC1004QEVM

The FDC1004QEVM is divided in three sections:

1. USB to I2C section: this has the purpose to interface the communication of FDC1004Q to a USB port.

2. FDC1004Q section: this section embeds FDC1004Q capacitive to digital converter.

3. Sensor section: this section contains a capacitive sensor that can be used for human proximity.

The EVM has precut lines on the borders of each section that allow for a flexible and specific system

design. As an example of the flexibility of this design, the sensor can be replaced with a customer sensor,

or the MCU section can be separated to allow for a remote placement of the FDC1004Q.

4FDC1004QEVM User's Guide SNAU178–April 2015

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FDC1004USB to I2C SENSOR

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Setup

Figure 1. FDC1004QEVM : Sections

2.2 Input/Output Connector Description

J1, J2: 4x1 Header: the I/O ports of sections between the USB to I2C and the FDC1004Q sections. This

provides the I2C communication channel and the power connections between these two sections should

the EVM be separated into sections. A simple 4 wire cable can be used to interface the sections.

Table 2. J1, J2 Pin Out

Pin Pin Description

J1.1 J2.1 GND

J1.2 J2.2 VDD

J1.3 J2.3 SCL

J1.4 J2.4 SDA

J3: USB interface to connect the EVM to a PC; it also provides power to the EVM.

J4: 10x1 Headers. This is not populated by default. It provides an easy method to change sensors or to

remotely place the sensor away from the FDC1004Q. This connector with its counterpart, J5, allows the

communication of the two modules through a 10-wire cable.

Table 3. J4 Pin Out

Pin Description

J4.1 GND

J4.2 SHLD1

J4.3 CIN1

J4.4 CIN2

J4.5 SHLD1

J4.6 SHLD2

J4.7 CIN3

J4.8 CIN4

J4.9 SHLD2

J4.10 GND

J5: 10x1 Header, for the electrical connection between the FDC1004 and the sensor section.

SNAU178–April 2015 FDC1004QEVM User's Guide

Setup

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Table 4. J5 Pin Out

Pin Description

J5.1 Not Connected

J5.2 SHLD1

J5.3 CIN1

J5.4 Not Connected

J5.5 SHLD1

J5.6 Not Connected

J5.7 Not Connected

J5.8 Not Connected

J5.9 Not Connected

J5.10 Not Connected

2.3 HW Setup

The power supply of FDC1004Q is provided by the LDO (U4), which is sourced from the USB 5.0V. The

I2C communication with FDC1004Q is fully managed by the MSP430F5528IRGC microcontroller (U3).

The FDC1004Q has a fixed I2C address.

2.4 SW Setup

Ensure that the FDC1004QEVM GUI and the drivers have been installed on the host computer. Plug the

EVM into an available USB port on the host.

2.5 Operation

Plug the EVM into the host computer. The host computer should automatically detect the device as an

EVM. Launch the GUI and configure the desired data acquisition mode for FDC1004Q. Then, it should

automatically start measuring on the configured sensors.

3 Board Layout

Figure 2 and Figure 3 show the board layout of the FDC1004QEVM.

Sensor layout has been designed to demonstrate human proximity sensing with a single sensor. A shield

layer below the sensor and a shield ring around the sensor is designed to significantly reduce parasitic

capacitance interference from directions not intended to sense the target. The intended sensing area for

this EVM is towards the top side of the sensor. For more information about shielding, refer to the

application note Capacitive Sensing: The Ins and Outs of Active Shielding (SNOA926).

Figure 2. Top Layer Routing

6FDC1004QEVM User's Guide SNAU178–April 2015

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Board Layout

Figure 3. Bottom Layer Routing

SNAU178–April 2015 FDC1004QEVM User's Guide

FID2

FID1

FID3

SV601125

PCB Number:

PCB Rev:

LOGO

PCB

Texas Instruments

1300pF

C11

GND

VDD

0.47µF

C17

GND

1300pF

C19

GND

SDA

SCL

VBUS

VUSB

1300pF

GND

220pF

C10

GND

PUR

33k

2200pF

GND

VDD

5.6V

D21

MMSZ5232B-7-F

VBUS

GND

1300pF

GND

1OUT 5

CBYP 4

ON/OFF

GND

LP2985AIM5-3.3/NOPB

GND

0.01µF

2.2µF

C15

VDD

GND

48037-2200

GND GND

IO1

IO2

GND

3IO3 4

IO4 5

VCC 6

1300pF

GND

33k

R40

33k

R20

GND

PUR

GND

VDD

SCL

SDA

VBUS

GND

VDD

SCL

SDA

SBWTCK

SBWTDIO

SCL

SDA

VDD

GND

0.1µF

GND

CIN1

CIN2

CIN3

CIN4

SHLD1

SHLD2

SHLD1

CIN1

CIN2

CIN3

CIN4

GND

TSW-104-07-G-S

51pF

CS1

51pF

CS2

GND

SHLD2

SHLD1

GND

SHLD1

CIN1

SHLD1

4.99k

R10

4.99k

R11

1µF

C20

GND

LOGO

PCB

Texas Instruments

GND

100pF

COFF

P6.0/CB0/A0 1

P6.1/CB1/A1 2

P6.2/CB2/A2 3

P6.3/CB3/A3 4

P6.4/CB4/A4 5

P6.5/CB5/A5 6

P6.6/CB6/A6 7

P6.7/CB7/A7 8

P5.0/A8/VREF+/VEREF+

P5.1/A9/VREF-/VEREF-

AVCC1

P5.4/XIN

P5.5/XOUT

AVSS1 14

DVCC1

15 DVSS1 16

VCORE

P1.0/TA0CLK/ACLK

P1.1/TA0.0

P1.2/TA0.1

P1.3/TA0.2

P1.4/TA0.3

P1.5/TA0.4

P1.6/TA1CLK/CBOUT

P1.7/TA1.0

P2.0/TA1.1 26

P2.1/TA1.2 27

P2.2/TA2CLK/SMCLK 28

P2.3/TA2.0 29

P2.4/TA2.1 30

P2.5/TA2.2 31

P2.6/RTCCLK/DMAE0 32

P2.7/UCB0STE/UCA0CLK 33

P3.0/UCB0SIMO/UCB0SDA

P3.1/UCB0SOMI/UCB0SCL

P3.2/UCB0CLK/UCA0STE

P3.3/UCA0TXD/UCA0SIMO

P3.4/UCA0RXD/UCA0SOMI

DVSS2 39

DVCC2

P4.0/PM_UCB1STE/PM_UCA1CLK 41

P4.1/PM_UCB1SIMO/PM_UCB1SDA 42

P4.2/PM_UCB1SOMI/PM_UCB1SCL 43

P4.3/PM_UCB1CLK/PM_UCA1STE 44

P4.4/PM_UCA1TXD/PM_UCA1SIMO 45

P4.5/PM_UCA1RXD/PM_UCA1SOMI 46

P4.6/PM_NONE 47

P4.7/PM_NONE 48

VSSU 49

PU.0/DP

PUR

PU.1/DM

VBUS

VUSB

V18

AVSS2 56

P5.2/XT2IN

P5.3/XT2OUT

TEST/SBWTCK 59

PJ.0/TDO 60

PJ.1/TDI/TCLK 61

PJ.2/TMS 62

PJ.3/TCK 63

RST/NMI/SBWTDIO 64

QFN PAD 65

MSP430F5528IRGC

GND

1.0k

18pF

24.000MHz

Green

10µF

VLS201610ET-100M

Super Red

CIN1

PROXIMITY

SHLD1

SENSOR

SHLD1 1

CIN1

CIN2

CIN3

CIN4

SHLD2 6

GND 7

VDD

8SCL 9

SDA 10

FDC1004QDGS

Schematic

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4 Schematic

Figure 4. FDC1004QEVM Schematic

8FDC1004QEVM User's Guide SNAU178–April 2015

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Schematic

Table 5. Bill of Materials

Qty Designator Description Footprint Manufacturer Part

Number

1 C1 CAP, CERM, 0.1uF, 6.3V, +/-10%, X5R, 0402 402 C1005X5R0J104K050BA

1 C2 CAP CER 10UF 10V 10% X5R 0603 603 C1608X5R1A106K080AC

4 C3, C5, CAP CER 0.1UF 16V 5% X7R 0402 402 0402YC132KAT2A

C11, C19

1 C4 CAP, CERM, 0.01uF, 25V, +/-5%, C0G/NP0, 0603 603 C1608C0G1E103J080AA

1 C6 CAP CER 220PF 50V 1% NP0 0402 402 0402YC132KAT2A

1 C7 CAP, CERM, 2200pF, 50V, +/-10%, X7R, 0603 603 C0603X222K5RACTU

2 C8, C9 CAP CER 18PF 100V 5% NP0 0603 603 GRM1885C2A300JA01D

1 C10 CAP, CERM, 220pF, 50V, +/-1%, C0G/NP0, 0603 603 06035A221FAT2A

1 C15 CAP, CERM, 2.2uF, 10V, +/-10%, X5R, 0603 603 C0603C225K8PACTU

1 C17 CAP, CERM, 0.47uF, 10V, +/-10%, X7R, 0603 603 C0603C474K8RACTU

1 C20 CAP, CERM, 1uF, 6.3V, +/-20%, X5R, 0402 402 C1005X5R0J105M050BB

0 COFF CAP, CERM, 100pF, 50V, +/-5%, C0G/NP0, 0402 402 GRM1535C1H101JDD5D

0 CS1, CS2 CAP, CERM, 51pF, 50V, +/-5%, C0G/NP0, 0402 402 GRM1555C1H510JA01D

1 D1 LED SMARTLED GREEN 570NM 0603 603 LG L29K-G2J1-24-Z

1 D2 LED 660NM SUPER RED DIFF 0603SMD 603 SML-LX0603SRW-TR

1 D21 Diode, Zener, 5.6V, 500mW, SOD-123 SOD-123 MMSZ5232B-7-F

0 J1, J2 Header, TH, 100mil, 4x1, Gold plated, 230 mil above TSW-104-07-G-S TSW-104-07-G-S

insulator

1 J3 Connector, USB Type A, 4POS R/A, SMD CONN_USB_04803722 480372200

0 J4 Receptacle, 50mil 10x1, R/A, TH CONN_851-43-010-20- 851-43-010-20-001000

001000

0 J5 Header, 50mil, 10x1, R/A, TH CONN_850-80-010-20- 850-80-010-20-001101

001101

1 L1 INDUCTOR POWER 10UH .45A SMD VLS201610E VLS201610ET-100M

1 R5 RES, 33k ohm, 5%, 0.063W, 0402 402 CRCW040233K0JNED

2 R6, R7 RES 1K OHM 1/10W 5% 0402 SMD 402 CRCW040233R0JNED

2 R8, R9 RES, 33 ohm, 5%, 0.063W, 0402 402 CRCW040233R0JNED

2 R10, R11 RES, 4.99k ohm, 1%, 0.063W, 0402 402 CRCW04024K99FKED

1 R20 RES,1M ohm, 5%, 0.063W, 0402 402 RC0402JR-071ML

1 R40 RES 1.5K OHM 1/16W 5% 0402 SMD 402 CRCW04021K50JNED

1 U1 Q Grade 4-Channel Capacitance-to-Digital Converter DGS0010A FDC1004QDGS

for Capacitive Sensing Solutions, DGS0010A

1 U2 4-CHANNEL ESD-PROTECTION ARRAY FOR DRY0006A TPD4E004DRY

HIGH-SPEED DATA INTERFACES, DRY006A

1 U3 Mixed Signal MicroController, RGC0064B RGC0064B MSP430F5528IRGCT

1 U4 Micropower 150 mA Low-Noise Ultra Low-Dropout MF05A_N LP2985AIM5-3.3/NOPB

Regulator, 5-pin SOT-23, Pb-Free

1 Y1 CRYSTAL 24.000MHZ 18PF SMD ABMM ABMM-24.000MHZ-B2-T

SNAU178–April 2015 FDC1004QEVM User's Guide

Revision History

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Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

DATE REVISION NOTES

April 2015 * Initial release.

10 Revision History SNAU178–April 2015

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