TECHNISONIC INDUSTRIES LIMITED
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TDFM-600/6000 Maintenance Manual
v
SECTION 1 THEORY OF OPERATION
1.1 INTRODUCTION .................................................................................................................. 1-1
1.1.1 TDFM-600/6000 Series Overview ....................................................................................... 1-1
1.1.2 Transceiver Models TDFM-600/6000 Series Type I .......................................................... 1-3
1.1.3 Transceiver Models TDFM-600/6000 Series Type II ......................................................... 1-4
1.1.3 Programming ...................................................................................................................... 1-5
1.1.4 TDFM-600/6000 Models ...................................................................................................... 1-6
1.1.5 System Overview ................................................................................................................ 1-10
1.2 MODULE A1 – MICROCONTROLLER (MCU) BOARD ....................................................... 1-10
1.2.1 The Power Supply ........................................................................................................... 1-12
The MCU-Input Filter and Protection ............................................................................. 1-13
1.2.2 The MCU Audio Section .................................................................................................. 1-13
1.2.3 The MCU ........................................................................................................................... 1-13
1.2.4 The MCU Rear Connector Interface ............................................................................... 1-13
1.2.5 The MCU Motorola Interface(s) ...................................................................................... 1-13
1.2.6 The MCU Front Panel Interface ...................................................................................... 1-13
1.2.7 The Power Modules ......................................................................................................... 1-13
1.3 MODULE A2 (TYPE I), A3 (TYPE I) INTERFACE BOARD ................................................... 1-14
1.3.1 Interface Board, A2 (Type I) dual module ...................................................................... 1-14
1.3.2 Interface Board, A3 (Type I) single module ................................................................... 1-14
MODULE A2 (TYPE II), A3 (TYPE II) INTERFACE BOARD ................................................ 1-14
1.3.3 Interface Board A2 (Type II), XTS-5000 Dual module ................................................... 1-14
1.3.4 Interface Board A2A (Type II), XTS-3000/5000 Dual hybrid module ........................... 1-14
1.3.5 Interface Board A2B (Type II), XTS-5000/3000 Dual hybrid module ........................... 1-14
1.3.6 Interface Board A3 (Type II), XTS-5000 Single module ................................................ 1-14
1.4 MODULE A4 – FRONT PANEL ASSEMBLY ....................................................................... 1-15
1.4.1 Module A4 - The Front Panel Assembly ......................................................................... 1-16
1.4.2 Module A4 - Front Panel Display Board ........................................................................ 1-17
1.4.3 Module A4 - Front Panel (Keypad) Board ...................................................................... 1-17
1.4.4 Module A4 - Front Panel Interconnect Board ................................................................ 1-17
1.5 MODULE A5 – MOTOROLA RF MODULES ....................................................................... 1-17
SECTION 2 TROUBLESHOOTING AND MODULE REPLACEMENT
2.0 INTRODUCTION .................................................................................................................. 2-1
2.1 ISOLATING PROBLEMS TO MODULES ............................................................................ 2-1
2.2 MODULES REPLACEMENT PROCEDURE (TYPE I) .......................................................... 2-1
2.2.1 Removing the Heatsink ................................................................................................... 2-3
2.2.2 Removing Interface Modules A3 – Interface Module ................................................... 2-4
2.2.3 Removing Interface Module A2 – Interface Module ..................................................... 2-7
2.2.4 Removing Module A1 – MCU ......................................................................................... 2-10
2.3 POST REPAIR TESTING ...................................................................................................... 2-12
