Supermicro SYS-F629P3-RTB Manual del propietario
Information for Lot 9 of ErP (Ecodesign)
This addendum addresses European Union (EU) Ecodesign requirements for servers and storage
products. All data and ratings within this addendum are in reference only to the Supermicro product(s) in
the manual. The below information conforms to requirements laid down in Annex II of the Commission
Regulation 2019/424.
3(1)(a): See Section 1.1 of the system manual for the product type.
3(1)(b): See the title page and preface of the system manual for the trademark and
manufacturer’s address.
3(1)(c): See the title page of the system manual for product model number(s).
3(1)(d): See the serial number on the physical system to determine the year of manufacture.
3(1)(e-j): PSU Efficiency and Power Factor Value (Table) (From 80 Plus report)
PSU Model #: PWS-706P-1R
Watts: 2200W
PSU Efficiency
Power
Factor
% of Rated Load
10 % 20 % 50 % 100 %
50 %
Single Output (AC-DC)
93.3%
96.07%
96.26%
94.37 %
0.99
System (EUT) Efficiency in Idle State Power (Table)
Representative
Configurations
Measured Idle State
Power (W)
Calculated Idle Power
Allowance per Node (W)
High-End Performance
Configuration
406.1
472.44
Typical Configuration
361.9
448.94
Low-End Performance
Configuration
332.6
196.16
System (EUT) Efficiency in Active State Power (Table)
Representative
Configurations
Active State
Efficiency Score
(Effserver)
Minimum Active State
Efficiency for 2-Socket
Server
High-End Performance
Configuration
39
Typical Configuration
39.1
8
Low-End Performance
Configuration
18.9
3(1)(k): The operating condition class is A2.
Dry bulb temp °C
Humidity range, non-condensing
Operatin
g
condition
l
Allowable
range
Recom
mende
d range
Allowable range
Recommended
range
Maxdew
point (°C)
Maximum
rate of
change
(°
C/hr)
A1
15- 32
18-27
–
12 °C Dew Point (DP) and
8 %
relative humidity (RH) to
17 °C DP and 80 % RH
–
9 °C DP to
15 °C DP and
60 % RH
17
5/20
A2
10-35
18-27
–
12 °C DP and 8 % RH to
21 °
C DP and 80 % RH
Same as A1
21
5/20
A3
5-40
18-27
–
12 °C DP and 8 % RH to
24 °
C DP and 85 % RH
Same as A1
24
5/20
A4
5-45
18-27
–
12 °C DP and 8 % RH to
24 °
C DP and 90 % RH
Same as A1
24
5/20
3(1)(l): The idle state power at the higher boundary temperature of the operating conditions
class is 406.1W.
3(1)(m): The active state efficiency and performance is 39.
3(1)(n): There are two methods by which a user can securely delete data from this system. The
user performing secure data deletion should be an IT professional.
The first is with a Unified Extensible Firmware Interface (UEFI) shell utility. This utility
works on X10/X11/H11/H12/M11 motherboard series with onboard SATA/NVMe
devices. Any user may access and download this utility through following link:
https://www.supermicro.com/about/policies/disclaimer.cfm?url=/wftp/utility/Lot9_Sec
ure_Data_Deletion_Utility/
Download the shell utility package and extract it to a USB flash drive, then plug the drive
into the server for which secure data deletion is necessary. Then turn the system on.
Navigate to the BIOS setup menu, then place the server system into the UEFI shell
environment. Follow the instructions in the README file to invoke the utility and
complete the deletion.
The second method is through the secure data deletion tool provided by the original
manufacturer of the hard drive. This should be used in a scenario where the shell utility
is not applicable. Each manufacturer should have the tool available on their website. If
needed, please look on the hard drive label for the name of the manufacturer and
model information.
3(1)(o): List of recommended combinations of FatTwin servers with chassis: N/A.
3(1)(p) List of all current SKUs within this product family: SYS-F629P3-RTB.
3(3)(a): There is no use of cobalt in batteries in this product.
The indicative weight range of neodymium in the HDD is 0.0 if manufactured by Western
Digital, and is between 5-25 grams if manufactured by Seagate.
3(3)(b): Please see the disassembly instructions on the next pages.
Illustrated System Disassembly Instructions
Please note:
All the illustrations in the below disassembly instructions are for demonstration only.
Components shown here may not match exactly with the components in your system.
CAUTION: Always power off the system and unplug the power cord(s) first
before disassembling the system!
1. Data Storage Devices
Type and number of fastenings:
One (1) latch.
Tools required:
None.
Procedure:
Release the hard drive tab. Remove the hard drive out of the chassis.
Data storage drives in the carrier:
2. Memory
Type and number of fastenings:
Two (2) latches per memory module.
Tools required:
None.
Procedure:
Press both release tabs on the ends of the memory module to unlock it. Once the
module is loosened, remove it from the memory slot.
3. Processor
Type and number of fastenings:
Four (4) T30 Torx screws.
Tools required:
Screwdriver with T30 Torx bit.
Procedure:
Remove the screws in the sequence of 4, then 3, then 2, then 1, as marked in the
illustration below. After removing the screws, lift the processor heatsink module off the processor
socket. Unsnap corners A and B, then C and D of the latch. Push the latch out from the bottom.
4. Motherboard
Type and number of fastenings:
Twelve (12) Phillips screws for SYS-F619P2/3-FT.
Tools required:
Screwdriver with PH2 bit.
Procedure:
Remove all Phillips screws. Lift the motherboard from its base.
5. Expansion Card/Graphics Card
Type and number of fastenings:
One (1) Phillips screw.
Tools required:
Screwdriver with PH2 bit.
Procedure:
Remove the Phillips screw. Open the rear window latch and carefully remove the
expansion card from the riser card slot, lifting it up and away from the system.
6. Power Supply Module
Type and number of fastenings:
One (1) latch per module.
Tools required:
None.
Procedure:
Unplug the power cord from the power supply. Push the release tab on the back of
the power supply module to the side and pull the module straight out.
7. Chassis Cover
Type and number of fastenings:
One (1) Phillips screw.
Tools required:
Screwdriver with PH2 bit.
Procedure:
Remove the screw securing the cover of the node.
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