Supermicro SuperServer SYS-221BT-HNC8R Instrucciones de instalación

Abstract

This document provides clear guidance for end-of-life recyclers on how to identify

and disassemble reportable materials in compliance with the Waste Electrical and

Electronic Equipment (WEEE) directive.

WEEE DISASSEMBLY INSTRUCTIONS

SUPERMICRO SYS-221BT-HNC8R ENCLOSURE

 
 
 
Table of Contents
Product Views............................................................................................................................................1
Reportable Materials on SYS-221BT-HNC8R.............................................................................................3
Disassemble Instructions ..........................................................................................................................4
3 Step-by-Step Disassembly Instructions ..............................................................................................7
Removing Cable and Chassis Top Cover ...........................................................................................7
Removing Hard Disk Drive ................................................................................................................8
Removing Power Supply ...................................................................................................................9
Removing Power Distributor...........................................................................................................10 
Removing Backplane.......................................................................................................................11 
Removing Fan ..................................................................................................................................11 
Removing AIOM Card......................................................................................................................12 
Removing Air shroud, Riser and Riser Bracket...............................................................................12 
Removing Processor........................................................................................................................13 
Removing DIMM..............................................................................................................................15 
Removing M.2..................................................................................................................................15 
Removing Motherboard..................................................................................................................15 
 
 

1. Product Views

Front view

Rear view

Product construct view

Backplane

FAN

Hard Disk Drive/

Solid State Drive

Node A, C

Node B, D

Node construct view

Power Supply

2. Reportable Materials on SYS-221BT-HNC8R

According to Article 8(2) and Annex VII of WEEE directive 2012/19/EU, Below materials and components

should be selectively treated.

Description

Notes

No.

Quantity

Printed Circuit Boards (PCB) or

Printed Circuit Assemblies (PCA)

With a surface greater than 10 sq cm

(Depending on the product

configuration)

2.4, 3.5, 4.2, 5.1, 7.2, 8.2,

9.2,10.1, 11.1, 12.1

Batteries

All types, including standard alkaline

and lithium coin or button-style

batteries

12.2

Mercury-containing components

For example, mercury in lamps,

display backlights, scanner lamps,

switches, batteries

Liquid Crystal Displays (LCD) with

a surface greater than 100 sq cm

Includes background illuminated

displays with gas discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers

(Containing PCB/PCT)

Electrolytic Capacitors /

Condensers measuring greater

than 2.5 cm in diameter or height

Depending on the power supply

model

3.6

External electrical cables and

cords

1.1

Gas Discharge Lamps

Plastics containing Brominated

Flame Retardants weighing > 25

grams (not including PCBs or PCAs

already listed as a separate item

above)

Components and parts containing

toner and ink, including liquids,

semi-liquids (gel/paste), and toner

Include the cartridges, print heads,

tubes, vent chambers, and service

stations.

Components and waste containing

asbestos

Components, parts, and materials

containing refractory ceramic

fibers

Components, parts, and materials

containing radioactive substances

3. Disassemble Instructions

The intent of this document is to provide guidance to recyclers on the presence of materials and

components at the product / family level, as required by the EU WEEE Directive 2012/10/EU. This

document should also help direct recyclers to proper methods for removing parts and general

product disassembly instructions.

This chapter consists of three subsections:

Recommended disassembly tools, disassembled flowchart, step-by-step disassembly instructions to direct

recycler proper methods to treated.

3.1 Recommended Disassembly Tools

Disassembly tool

Cross screwdriver

Flathead screwdriver

3.2 Disassembled flowchart

Server

Chassis

Power Supply

Storage Card and CPU

Chassis

Chassis Enclosure

Fan Holder

Sponge

Fan

Screw, Stand-off

Motherboard

Add-on Card

Controller Card

Riser Card

Controller Card

Cable

Battery

Power Supply

Power Enclosure

Screw and Standoff

Power Supply Module

Power Cable

Storage Card and CPU

Heat Sink

Processor

Solid State Drive

AIOM Card

DIMM

3.3 Step-by-Step Disassembly Instructions

1. Removing Cable and Chassis Top Cover

1. Use the operating system to power down the system.

2. After the system has completely shut-down, disconnect the power cords from the power supply

modules.

3. Remove all cables/ unit from the server IO port.

4. The chassis top cover can be lifted off after removing two screws.

No.

Description

No.

Description

1.1

Power Cable

1.6

Chassis

1.2

VGA Port

1.7

Top Cover

1.3

USB Port

1.4

BMC LAN

1.5

LAN Port

1.1

1.2

1.3

1.4

1.5

1.4

1.2

1.3

1.5

1.6

1.7

2. Removing Hard Disk Drive

1. Push the release button on the drive carrier, which will extend the drive bay handle

2. Use the drive bay handle to pull the drive carrier out of the chassis

3. Remove the dummy tray insert by first removing two screws, then pull out the dummy tray

5. Use a cross screwdriver to remove the drive enclosure

2.1

2.2

2.3

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