Supermicro AS-511E-WR Instrucciones de instalación
Abstract
This document provides clear guidance for end-of-life recyclers on how to identify
and disassemble reportable materials in compliance with the Waste Electrical and
Electronic Equipment (WEEE) directive.
WEEE DISASSEMBLY INSTRUCTIONS
SUPERMICRO AS-511E-WR ENCLOSURE
Table of Contents
1. Product Views............................................................................................................................................1
2. Reportable Materials on SYS-511E-WR ....................................................................................................2
3. Disassemble Instructions ..........................................................................................................................3
3.3 Step-by-Step Disassembly Instructions ..............................................................................................6
1. Removing Chassis Top Cover.............................................................................................................6
2. Removing Hard Disk Drive ................................................................................................................7
3. Removing Power Supply ...................................................................................................................9
4. Removing Power Distributor...........................................................................................................10
5. Removing Backplane.......................................................................................................................10
6. Removing Fan ..................................................................................................................................11
7. Removing Air shroud and Riser Bracket .........................................................................................11
8. Removing Riser Card .......................................................................................................................11
9. Removing Processor........................................................................................................................12
10. Removing DIMM..............................................................................................................................14
11. Removing M.2..................................................................................................................................14
12. Removing Motherboard..................................................................................................................15
1
1. Product Views
Front view
Rear view
Product construct view
2
2. Reportable Materials on SYS-511E-WR
According to Article 8(2) and Annex VII of WEEE directive 2012/19/EU, Below materials and components
should be selectively treated.
Description
Notes
No.
Quantity
Printed Circuit Boards (PCB) or
Printed Circuit Assemblies (PCA)
With a surface greater than 10 sq cm
2.4, 3.5, 4.2, 5.1, 8.1, 9.2,
10.1, 11.1, 12.1
13
Batteries
All types, including standard alkaline
and lithium coin or button style
batteries
12.2
1
Mercury-containing components
For example, mercury in lamps,
display backlights, scanner lamps,
switches, batteries
Liquid Crystal Displays (LCD) with
a surface greater than 100 sq cm
Includes background illuminated
displays with gas discharge lamps
Cathode Ray Tubes (CRT)
Capacitors / condensers
(Containing PCB/PCT)
Electrolytic Capacitors /
Condensers measuring greater
than 2.5 cm in diameter or height
Depending on the power supply
model
3.6
2
External electrical cables and
cords
1.1
2
Gas Discharge Lamps
Plastics containing Brominated
Flame Retardants weighing > 25
grams (not including PCBs or PCAs
already listed as a separate item
above)
Components and parts containing
toner and ink, including liquids,
semi-liquids (gel/paste), and toner
Include the cartridges, print heads,
tubes, vent chambers, and service
stations.
Components and waste containing
asbestos
Components, parts, and materials
containing refractory ceramic
fibers
Components, parts, and materials
containing radioactive substances
3. Disassemble Instructions
The intent of this document is to provide guidance to recyclers on the presence of materials and
components at the product / family level, as required by the EU WEEE Directive 2012/10/EU. This
document should also help direct recyclers to proper methods for removing parts and general
product disassembly instructions.
This chapter consists of three subsections:
Recommended disassembly tools, disassembled flowchart, and step-by-step disassembly instructions to
direct recycler proper methods to treat.
3.1 Recommended Disassembly Tools
Disassembly tool
Cross screwdriver
Flathead screwdriver
3.2 Disassembled flowchart
Server
Chassis
Power Supply
Storage Card and CPU
Chassis
Chassis Enclosure
Screw
Cover
Air Shroud
Fan Bracket
Foam
Fan
Mother Board/ M.2/ Riser
Card /Power Distributor
Cable
Backplane
Battery
Power Supply
Power Enclosure
Screw and Standoff
Power Supply Module
Power Cable
Storage Card and CPU
Heat Sink
Processor
Solid State Drive
TPM Module
DIMM
6
3.3 Step-by-Step Disassembly Instructions
1. Removing Cable and Chassis Top Cover
1. Use the operating system to power down the system.
2. After completely shut down, disconnect the power cords from the power supply modules.
.
4. Remove all cables/ unit from the server IO port.
5. Remove the top cover
No.
Description
No.
Description
1.1
Power Cable
1.6
1G LAN Ports
1.2
COM Port
1.7
VGA Port
1.3
Dedicated BMC LAN Port
1.8
Chassis
1.4
USB 2.0 Port
1.9
Top Cover
1.5
USB 3.2 Gen 1 Ports
1.8
1.9
1.1
1.2
1.3
1.4
1.5
1.6
1.7
7
2. Removing Hard Disk Drive
1. Push the release button on the drive carrier, which will extend the drive bay handle
2. Use the drive bay handle to pull the drive carrier out of the chassis
3. Remove the dummy tray insert by first removing two screws, then pull out the dummy tray
5. Use a cross screwdriver to remove drive enclosure
2.1
1
.
2.2
2.3
Este manual sirve para los siguientes modelos
1
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