Supermicro X11SPA-TF Manual de usuario

X11SPA-TF

X11SPA-T

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QUICK REFERENCE GUIDE

Revision 1.0b

X11SPA-TF/X11SPA-T QUICK REFERENCE GUIDE

Standardized Warning Statements

Motherboards

About Standardized Warning Statements

The following statements are industry standard warnings, provided to warn the user of situations where bodily injury

might occur. Should you have questions or experience difculty, contact Supermicro's Technical Support Department

for assistance. Only certied technicians should attempt to install or congure components.

Read this section in its entirety before installing or conguring components in the Supermicro chassis.

WARNING: This product can expose you to chemicals including

lead, known to the State of California to cause cancer and birth

defects or other reproductive harm. For more information, go

to www.P65Warnings.ca.gov.

Battery Handling

Warning!

There is a danger of explosion if the battery is replaced incorrectly. Replace the battery only with the same or an equiva-

lent type recommended by the manufacturer. Dispose of used batteries according to the manufacturer's instructions.

警告

電池更換不當會有爆炸危險。請使用製造商建議之相同或功能相當的電池更換原有電池。請按照製造商的說明指示處理

廢棄舊電池。

警告

电池更换不当会有爆炸危险。请只使用同类电池或制造商推荐的功能相当的电池更换原有电池。请按制造商的说明处理

废旧电池。

電池の取り扱い

電池交換が正しく行われなかった場合、破裂の危険性があります。交換する電池はメーカーが推奨する型、または同等のもの

を使用下さい。使用済電池は製造元の指示に従って処分して下さい。

경고!

배터리가 올바르게 교체되지 않으면 폭발의 위험이 있습니다. 기존 배터리와 동일하거나 제조사에서 권장하는 동등한

종류의 배터리로만 교체해야 합니다. 제조사의 안내에 따라 사용된 배터리를 처리하여 주십시오.









Note: For complete product safety information, refer to http://www.supermicro.com/about/policies/safety_information.cfm.

Product Safety Information

X11SPA-TF/X11SPA-T QUICK REFERENCE GUIDE 限用物質含有情況標示聲明書

限用物質含有情況標示聲明書

設備名稱：主機板

Motherboard

,型號（型式）:

X11SPA-TF, X11SPA-T

單元Ｕnit

限用物質及其化學符號

鉛Lead

(Pb) 汞Mercury

(Hg) 鎘Cadmium

(Cd)

六價鉻

Hexavalent

chromium

(Cr+6)

多溴聯苯

Polybrominated

biphenyls

(PBB)

多溴二苯醚

Polybrominated

diphenyl ethers

(PBDE)

主機板

(Motherboard)

－○○○○○

備考1.〝超出0.1 wt %〞及〝超出0.01 wt %〞係指限用物質之百分比含量超出百分比含量基準

值。

備考2.〝○〞係指該項限用物質之百分比含量未超出百分比含量基準值。

備考3.〝－〞係指該項限用物質為排除項目。

Equipment name

Type designation (Type)

Restricted substances and its chemical symbols

Declaration of the Presence Condition of the Restricted Substances Marking

Note 1：“Exceeding 0.1 wt %” and “exceeding 0.01 wt %” indicate that the percentage content of the restricted substance exceeds the

reference percentage value of presence condition.

Note 2：“○” indicates that the percentage content of the restricted substance does not exceed the percentage of reference value of presence.

Note 3：The “−” indicates that the restricted substance corresponds to the exemption.

X11SPA-TF/X11SPA-T QUICK REFERENCE GUIDE BIOS POST Codes

AMI BIOS POST Codes

About AMI BIOS POST Codes

The table below lists some of AMI BIOS POST codes for X11SPA-TF/X11SPA-T. For more information, refer to https://

www.supermicro.com/manuals/other/AMI_AptioV_BIOS_POST_Codes_for_SM_Motherboards.pdf.

Code Description

0x32 CPU post-memory initialization is started

0x55 No Memory detected or memory failed

0x63 CPU DXE initialization is started

0x69 North Bridge DXE initialization is started

0x70 South Bridge DXE initialization is started

0x92 PCI Bus initialization is started

0x99 Super IO Initialization

0x9A USB initialization is started

0xA0 IDE initialization is started

0xA9 Boot into BIOS setup menu

0xAE Legacy Boot event

0xB2 Legacy Option ROM Initialization

0xB4 USB hot plug

0xD6 No console output devices are found

0xD7 No console input devices are found

0xF2 Recovery process started

0xF9 Recovery capsule is not found

X11SPA-TF/X11SPA-T QUICK REFERENCE GUIDE M.2 SSD Installation Instructions

M.2 SSD Installation Instructions

M.2 SSD Installation

Warning: Be sure to install the M.2 SSD(s) prior to placing a motherboard into a chassis. Please refer to the

M.2 SSD installation and removal instructions as shown below and on the next page for proper procedures.

Unscrew the existing mounting screws

on the M.2 heatsink and then remove the

heatsink.

Remove the plastic liner from the M.2

heatsink thermal pad.

Be sure that the M.2 SSD is securely

fastened.

Unscrew the M.2 screw on the mother-

board. Insert the M.2 SSD into the M.2

socket at a 30 degree angle and press

down.

Tighten the M.2 SSD with the M.2 screw

removed in Step 2.

*The position of the screw is dependent on the M.2 SSD used.

(The default position supports 2280 form factor.)

Resecure the M.2 heatsink in place with

the mounting screws removed in Step 1.

M.2 SSD Removal Instructions

M.2 SSD Removal

X11SPA-TF/X11SPA-T QUICK REFERENCE GUIDE M.2 SSD Removal Instructions

Unscrew the existing mounting screws

on the M.2 heatsink and then remove

the heatsink.

Unscrew the existing M.2 screw on the

M.2 SSD.

Gently lift the M.2 SSD and be careful

not to damage the notch.

The M.2 SSD underneath the M.2

heatsink will be seen after the heatsink

is removed.

Pull the M.2 SSD straight out of the M.2

socket.

The M.2 SSD is now removed.

Note: The position of the standoff can be adjusted slightly to t your M.2 SSD if needed. (Refer to the FAQ on the

Supermicro website at https://www.supermicro.com/support/faqs/faq.cfm?faq=30404.)

X11SPA-TF/X11SPA-T QUICK REFERENCE GUIDE Memory Population

Memory Population

Note: Unbalanced memory conguration decreases memory performance and is not recommended for Supermicro

motherboards.

DCPMM (Intel Optane™ DC Persistent Memory Modules) Population Tables for the X11SPA-TF/

X11SPA-T (w/12 Slots) based on the 82xx/62xx/52xx/42xx Platform

Symmetric Population within 1 CPU Socket

Modes P1-DIMMF1 P1-DIMMF2 P1-DIMME1 P1-DIMME2 P1-DIMMD1 P1-DIMMD2 P1-DIMMA2 P1-DIMMA1 P1-DIMMB2 P1-DIMMB1 P1-DIMMC2 P1-DIMMC1 Channel

Cong.

AD DRAM1 DCPMM DRAM1 DCPMM DRAM1 DCPMM DCPMM DRAM1 DCPMM DRAM1 DCPMM DRAM1 2-2-2

MM DRAM1 DCPMM DRAM1 DCPMM DRAM1 DCPMM DCPMM DRAM1 DCPMM DRAM1 DCPMM DRAM1 2-2-2

AD + MM DRAM3 DCPMM DRAM3 DCPMM DRAM3 DCPMM DCPMM DRAM3 DCPMM DRAM3 DCPMM DRAM3 2-2-2

AD DRAM1 - DRAM1 - DRAM1 DCPMM DCPMM DRAM1 - DRAM1 - DRAM1 2-1-1

MM DRAM2 - DRAM2 - DRAM2 DCPMM DCPMM DRAM2 - DRAM2 - DRAM2 2-1-1

AD + MM DRAM3 - DRAM3 - DRAM3 DCPMM DCPMM DRAM3 - DRAM3 - DRAM3 2-1-1

AD DRAM1 - DRAM1 DCPMM DRAM1 DCPMM DCPMM DRAM1 DCPMM DRAM1 - DRAM1 2-2-1

MM DRAM1 - DRAM1 DCPMM DRAM1 DCPMM DCPMM DRAM1 DCPMM DRAM1 - DRAM1 2-2-1

AD + MM DRAM3 - DRAM3 DCPMM DRAM3 DCPMM DCPMM DRAM3 DCPMM DRAM3 - DRAM3 2-2-1

AD DCPMM - DRAM1 - DRAM1 - - DRAM1 - DRAM1 - DCPMM 1-1-1

MM DCPMM - DRAM1 - DRAM1 - - DRAM1 - DRAM1 - DCPMM 1-1-1

AD + MM DCPMM - DRAM3 - DRAM3 - - DRAM3 - DRAM3 - DCPMM 1-1-1

AD DCPMM - DRAM1 DRAM1 DRAM1 DRAM1 DRAM1 DRAM1 DRAM1 DRAM1 - DCPMM 2-2-1

Asymmetric Population within 1 CPU Socket

Modes P1-DIMMF1 P1-DIMMF2 P1-DIMME1 P1-DIMME2 P1-DIMMD1 P1-DIMMD2 P1-DIMMA2 P1-DIMMA1 P1-DIMMB2 P1-DIMMB1 P1-DIMMC2 P1-DIMMC1 Channel

Cong.

AD DRAM1 - DRAM1 - DRAM1 - DCPMM DRAM1 - DRAM1 - DRAM1 2/1-1-1

AD* DRAM1 - DRAM1 - DRAM1 - DCPMM DRAM1 - DRAM1 - DRAM1 2/1-1-1

Legend (for the two tables above)

DDR4 Type Capacity

DRAM1 RDIMM 3DS RDIMM LRDIMM 3DS LRDIMM

Refer to Validation Matrix (DDR4 DIMMs

validated with DCPMM) below.

DRAM2 RDIMM - -

DRAM3 RDIMM 3DS RDIMM LRDIMM -

Notication for the Mounting Holes

Note: Before assembling the motherboard, pay attention to the location of mounting holes. Please select the chassis

which ts the mounting hole locations of this motherboard. Refer to the illustration below for the location details.

X11SPA-TF/X11SPA-T QUICK REFERENCE GUIDE Notication for the Mounting Holes

Notes

X11SPA-TF/X11SPA-T QUICK REFERENCE GUIDE Notes

X11SPA-TF/X11SPA-T

Quick RefeRence Guide Rev. 1.0b

SUPERMICR R

DESIGNED IN USA

X11SPA-TF

REV:1.01

MAC CODE

A C

Intel C621

ASPEED

AST2500

PLX

PEX8747

BIOS

LICENSE IPMI CODE BAR CODE

MAC CODE

RAID Key Header

USB3.1 Gen.1 USB3.1 Gen.1 USB3.1 Gen.2

USB3.1 Gen.2

USB3.1 Gen.1

JPAC1

IPMI

USB10 (3.1)

(3.1)USB11

USB0/1

(3.0)USB2/3

UID-SWUID-LED

AUDIO FP

USB4/5(3.0)

LAN2

USB6/7 (3.0)

IPMI_LAN

COM1

VGA

LAN1

(3.1)USB8/9

JPI2C1

JSD1

JPME2

JPG1

JWD1

JL1 JD1

12V_PUMP_PWR1

CPU SLOT1 PCI-E 3.0 x16

CPU SLOT2 PCI-E 3.0 x8

CPU SLOT3 PCI-E 3.0 x16

CPU SLOT4 PCI-E 3.0 x8

JSPDIF_OUT

CPU SLOT5 PCI-E 3.0 x16

CPU SLOT6 PCI-E 3.0 x8

CPU SLOT7 PCI-E 3.0 x16

JPWR4

HD AUDIO

FAN C

FAN D

JPL2

FAN6 FAN5

FAN4

JVRM1

JPWR3

JP5

JPUSB1

COM2

J9701

M.2-C04

PCI-E 3.0 x4

M.2-C03

JOH1-OH

J9702

M.2-C02

PCI-E 3.0 x4

DIMMF1

DIMME1

DIMMF2

DIMME2

DIMMD1

DIMMD2

DIMMB1

DIMMA2

DIMMA1

DIMMB2

DIMMC1

DIMMC2

JTPM1

JRK1

JSD2

I-SATA0

I-SATA1 I-SATA3

I-SATA2 I-SATA4

I-SATA5 I-SATA6

I-SATA7

I-SGPIO2

FAN B FAN A

I-SGPIO1

M.2-C01

PCI-E 3.0 x4

JP4

FAN1

FAN2

JF1

JSTBY1

JPWR2

JIPMB1

BATTERY JPWR1

FAN3

JPL1

LEDPWR

LEDBMC

Universal ID

LE3

LE4

LE5

LE6

Motherboard Layout and Features

=mounting hole

LGA 3647

I/O BACK PANEL

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