Sony XR-C6100 Manual de usuario

MICROFILM

SERVICE MANUAL

FM/MW/SW CASSETTE CAR STEREO

Saudi Arabia Model

SPECIFICATIONS

XR-C6100

Dolby noise reduction manufactured under license

from Dolby Laboratories Licensing Corporation.

“DOLBY” and the double-D symbol aare trade-

marks of Dolby Laboratories Licensing Corporation.

Model Name Using Similar Mechanism NEW

Tape Transport Mechanism Type MG-25F-136

– Continued on next page –

– 2 –

TABLE OF CONTENTS

1. GENERAL

Location of Controls ....................................................... 3

Installation....................................................................... 4

Connections ..................................................................... 5

2. DISASSEMBLY ......................................................... 8

3. ASSEMBLY OF MECHANISM DECK........... 10

4. MECHANICAL ADJUSTMENTS ....................... 13

5. ELECTRICAL ADJUSTMENTS

Test Mode ........................................................................ 13

Tape Deck Section .......................................................... 13

Tuner Section .................................................................. 14

6. DIAGRAMS

6-1. IC Pin Function Description ........................................... 17

6-2. Note for Printed Wiring Boards and

Schematic Diagram ......................................................... 20

6-3. Printed Wiring Board – MAIN Section – ...................... 21

6-4. Schematic Diagram – MAIN Section (1/2) –................ 23

6-5. Schematic Diagram – MAIN Section (2/2) –................ 25

6-6. Printed Wiring Board – PANEL Section – .................... 27

6-7. Schematic Diagram – PANEL Section – ....................... 29

7. EXPLODED VIEWS................................................ 33

8. ELECTRICAL PARTS LIST ............................... 36

Flexible Circuit Board Repairing

• Keep the temperature of the soldering iron around 270 ˚C dur-

ing repairing.

• Do not touch the soldering iron on the same conductor of the

circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering

or unsoldering.

Notes on chip component replacement

• Never reuse a disconnected chip component.

• Notice that the minus side of a tantalum capacitor may be dam-

aged by heat.

– 3 –

SECTION 1

GENERAL This section is extracted from

instruction manual.

– 4 –

– 5 –

– 6 –

– 7 –

– 8 –

COVER ASS’Y

SUB PANEL, MECHANISM DECK (MG-25F-136)

Note: Follow the disassembly procedure in the numerical order given.

SECTION 2

DISASSEMBLY

cover ass’y

three screws

(PTT2.6

sub panel

connector

(CN302)

screw

(PTT2.6

mechanism dec

(MG-25F-136)

flexible flat cable

(CN301)

three screws

(PTT2.6

– 9 –

MAIN BOARD, HEAT SINK

two ground point

screws

three screws

(PTT2.6

10)

two screws

(PTT2.6

10)

screw

(PTT2.6

three screws

(PTT2.6

)

heat sink

rubber cap (25)

two screws

(PTT2.6

main board

– 10 –

SECTION 3

ASSEMBLY OF MECHANISM DECK

HOUSING

ARM (SUCTION)

Note: Follow the assembly procedure in the numerical order given.

part

Hold the hanger by

bending the claw.

Fit projection on

part.

Fit claw on

part.

Put the housing

under

part.

Fit projection on

part.

Install the catch to the hanger.

Install the hanger onto

two claws of the housing.

Holder the hanger by bending the claw.

hanger

housing

Move the arm (suction) in the arro

direction and fit on projection.

Fit the arm (suction) on the shaft.

projection

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