Sony XR-C5080R Manual de usuario

MICROFILM

SERVICE MANUAL

FM/MW/LW CASSETTE CAR STEREO

AEP Model

UK Model

Model Name Using Similar Mechanism XR-5800R

Tape Transport Mechanism Type MG-25G-136

SPECIFICATIONS

XR-C5080R/C5090R

Photo: XR-C5090R

– 2 –

TABLE OF CONTENTS

1. GENERAL

Location of Controls ....................................................... 3

Setting the Clock ............................................................. 3

Using the Rotary Commander ........................................ 4

Adjusting the Sound Characteristics .............................. 4

Attenuating the Sound .................................................... 4

Changing the Sound and Beep Tone............................... 4

Installation....................................................................... 5

Connections ..................................................................... 6

2. DISASSEMBLY ......................................................... 9

3. ASSEMBLY OF MECHANISM DECK........... 11

4. MECHANICAL ADJUSTMENTS....................... 14

5. ELECTRICAL ADJUSTMENTS

Test Mode ........................................................................ 14

Tape Deck Section .......................................................... 14

Tuner Section .................................................................. 15

6. DIAGRAMS

6-1. Printed Wiring Boards – MAIN Section – .................... 18

6-2. Schematic Diagram – MAIN Section –.......................... 21

6-3. Printed Wiring Board – PANEL Section – .................... 26

6-4. Schematic Diagram – PANEL Section –....................... 28

6-5. IC Pin Function Description ........................................... 34

7. EXPLODED VIEWS................................................ 37

8. ELECTRICAL PARTS LIST ............................... 40

Flexible Circuit Board Repairing

• Keep the temperature of the soldering iron around 270 ˚C dur-

ing repairing.

• Do not touch the soldering iron on the same conductor of the

circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering

or unsoldering.

Notes on chip component replacement

• Never reuse a disconnected chip component.

• Notice that the minus side of a tantalum capacitor may be dam-

aged by heat.

– 3 –

SECTION 1

GENERAL This section is extracted from

instruction manual.

– 4 –

– 5 –

– 6 –

– 7 –

– 8 –

– 9 –

FRONT PANEL ASS’Y

COVER ASS’Y

Note: Follow the disassembly procedure in the numerical order given.

SECTION 2

DISASSEMBLY

1

Push the button

(release).

2

Remove the front panel ass’y

to the direction of the arrow

cover ass’y

– 10 –

SUB PANEL, MECHANISM DECK (MG-25G-136)

MAIN BOARD, HEAT SINK

three screws

(PTT2.6

three screws

(PTT2.6

sub panel

connector

(CN352)

screw

(PTT2.6

mechanism deck

(MG-25G-136)

flexible flat cabl

(CN351)

two screws

(PTT2.6

heat sink

three screws

(PTT2.6

)

three screws

(PTT2.6

10)

two screws

(PTT2.6

14)

screw

(PTT2.6

rubber cap (25)

MAIN board

two ground point

screws

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