Sony XR-4890 Manual de usuario

MICROFILM

SERVICE MANUAL

US Model

Canadian Model

Model Name Using Similar Mechanism XR-C5100

Tape Transport Mechanism Type MG-25F-136

SPECIFICATIONS

XR-4890

Photo: XR-4890

FM/AM CASSETTE CAR STEREO

– Continued on next page –

– 2 –

TABLE OF CONTENTS

1. GENERAL

Location of Controls ....................................................... 3

Resetting the Unit ........................................................... 4

Detaching the Front Panel............................................... 4

Setting the Clock ............................................................. 4

Installation....................................................................... 5

Connections ..................................................................... 6

2. DISASSEMBLY ......................................................... 9

3. ASSEMBLY OF MECHANISM DECK ............ 11

4. MECHANICAL ADJUSTMENTS ....................... 14

5. ELECTRICAL ADJUSTMENTS

Tape Deck Section .......................................................... 14

Tuner Section .................................................................. 14

6. DIAGRAMS ................................................................. 15

6-1. Printed Wiring Board –MAIN Section– ........................ 17

6-2. Schematic Diagram –MAIN (1/2) Section–..................19

6-3. Schematic Diagram –MAIN (2/2) Section–..................21

6-4. Printed Wiring Board –PANEL Section– ...................... 23

6-5. Schematic Diagram –PANEL Section– ......................... 25

6-6. IC Pin Function Description ........................................... 27

7. EXPLODED VIEWS................................................ 29

8. ELECTRICAL PARTS LIST ............................... 32

Flexible Circuit Board Repairing

• Keep the temperature of the soldering iron around 270 ˚C dur-

ing repairing.

• Do not touch the soldering iron on the same conductor of the

circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering

or unsoldering.

Notes on chip component replacement

• Never reuse a disconnected chip component.

• Notice that the minus side of a tantalum capacitor may be dam-

aged by heat.

– 3 –

SECTION 1

GENERAL This section is extracted from

instruction manual.

– 4 –

– 5 –

– 6 –

– 7 –

– 8 –

– 9 –

FRONT PANEL ASS’Y

COVER ASS’Y

Note: Follow the disassembly procedure in the numerical order given.

SECTION 2

DISASSEMBLY

Push the button

(release).

Remove the front panel ass’y

to the direction of the arrow

cover ass’y

– 10 –

SUB PANEL, MECHANISM DECK (MG-25F-136)

MAIN BOARD, HEAT SINK

connector

(CN351)

sub panel

three screws

(PTT2.6

three screws

(PTT2.6

screw

(PTT2.6

mechanism deck

(MG-25F-136)

flexible flat cable

(CN301)

Two ground point

screws

two screws

(PTT 2.6

two screws

(PTT 2.6

10)

screw

(PTT2.6

two screws

(PTT 2.6

heat sink

rubber cap (25)

two screws

(PTT2.6

main board

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