USN3se, MX3se-3I3P - Datasheet V1R01c
© 2016, Smartware CONFIDENTIAL 7
3FUNCTIONAL DESCRIPTION
USN3se and MX3se-3I3P are Smartware assemblies that include three independent US-NANO
modules.
Each US-NANO module provides a CPU core and a dual communication interfaces for contact and
contactless smart cards or smart objects.
3.1 CORE INTERFACES
An US-NANO module embeds the last generation of 32 bit Freescale ColdFire®CPU running at 240
MHz, with 64MB of RAM and 8MB of Flash.
MLOS proprietary multitasking operating system provides all resources to connect and use the core
interfaces such as the Ethernet and the Serial ports.
MLOS also manages additional user or system applications to drive all specific hardware resources
like the contact and contactless interfaces.
3.2 CONTACT INTERFACES
3.2.1 ISO/IEC 7816-3/4
CARD system application handles the standard ISO7816 smart card protocol. Its rich interface allows
to perform fast communication exchanges and to subtly configure all protocol parameters.
Non-exhaustive list of software features and configuration parameters:
•Smart cards voltage configuration with support of class A, B and C.
•Smart card clock frequency from 1 to 20 MHz.
•Communication bit rate (ETU).
•Automatic T=0 or T=1 protocol handling.
•Short and extended APDU exchanges.
•Protocol timing specific parameters such as EGT, WWT, BGT, CWT, BWT, etc.
•Character and block error management and recovery.
•Access to contact states for custom protocols.
3.2.2 SWP
SWP system application handles the ETSI standards (TS 102 613 and TS 102 622) to support
exchanges through the Single Wire Protocol.
Non-exhaustive list of software features and configuration parameters:
•Support LLC (ACT, SHDLC, CLT) and HCI layers.
•Supply voltage configuration with support of class B and C.
•Communication bit duration from 0.590us up to 10 us.
•Automatic CRC and Bit stuffing management.
