SIMTRUM NANYTE BEAM Manual de usuario
NANYTE BEAM
Desktop Maskless Lithography
User Manual
BM-001-A3 / June 2022
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NANYTE BEAM Manual
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Contents
Contents......................................................................................................................................... 2
Getting Started ...................................................................................................................... 4
Safety Precautions ............................................................................................................................ 4
Laser Safety ....................................................................................................................................... 5
Maintenance ...................................................................................................................................... 5
Contact Information .......................................................................................................................... 6
Packing List ....................................................................................................................................... 6
Unpacking and installation ............................................................................................................... 6
Product overview .............................................................................................................................. 6
Specifications .................................................................................................................................... 8
System requirements........................................................................................................................ 9
Power ............................................................................................................................................. 9
Location ......................................................................................................................................... 9
Front View........................................................................................................................................ 10
BEAM ENGINE ................................................................................................................................. 12
Back View ........................................................................................................................................ 13
XPLORER Main Window ................................................................................................................. 14
Camera Window .............................................................................................................................. 18
Keyboard/Mouse Shortcuts ........................................................................................................... 19
Patterning ........................................................................................................................... 20
Sample preparation and loading .................................................................................................... 20
Load GDS ......................................................................................................................................... 21
Load image files .............................................................................................................................. 23
Draw patterns .................................................................................................................................. 24
Alignment ........................................................................................................................................ 25
Exposure .......................................................................................................................................... 27
Sample Retrieval ............................................................................................................................. 27
Calibration ........................................................................................................................... 28
Galvo scanner position calibration ................................................................................................ 29
Stepper calibration .......................................................................................................................... 29
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Laser calibrations ........................................................................................................................... 30
PI curve ........................................................................................................................................ 30
Spatial power calibration ............................................................................................................ 30
Stage levelling ................................................................................................................................. 31
Focus calibration ............................................................................................................................ 31
Calibrating the autofocus ........................................................................................................... 31
Calibrating the laser beam spot focus offset ........................................................................... 32
Troubleshooting .................................................................................................................. 33
Singapore
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NANYTE BEAM Manual
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Getting Started
Safety Precautions
The following safety precautions should be observed before using this product and any
associated instrumentation.
This product is intended for use by qualified personnel who recognize shock hazards and are
familiar with the standard lithography processes. Read and follow all installation, operation, and
maintenance information carefully before using the product. Refer to the user documentation for
complete product specifications.
If the product is used in a manner not specified, the protection provided by the product warranty
may be impaired.
The types of product users are:
Responsible body is the individual or group responsible for the use and maintenance of
equipment, for ensuring that the equipment is operated within its specifications and operating
limits, and for ensuring that operators are adequately trained.
Operators use the product for its intended function. They must be trained in standard lithography
procedures and proper use of the equipment.
Only properly trained service personnel may perform installation and service procedures.
Exercise extreme caution when a shock hazard is present. The American National Standards
Institute (ANSI) states that a shock hazard exists when voltage levels greater than 30V RMS,
42.4V peak, or 60VDC are present. A good safety practice is to expect that hazardous voltage is
present in any unknown circuit before measuring. Operators of this product must be protected
from electric shock at all times.
When installing equipment where access to the main power cord is restricted, such as rack
mounting, a separate main input power disconnect device must be provided in close proximity to
the equipment and within easy reach of the operator.
The equipment and accessories must be used in accordance with its specifications and operating
instructions, or the safety of the equipment may be impaired.
When fuses are used in a product, replace with the same type and rating for continued protection
against fire hazard.
The WARNING heading in the user documentation explains dangers that might result in personal
injury or death. Always read the associated information very carefully before performing the
indicated procedure.
The CAUTION heading in the user documentation explains hazards that could damage the
equipment. Such damage may invalidate the warranty. Instrumentation and accessories shall not
be connected to humans.
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NANYTE BEAM Manual
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Laser Safety
During operation, NANYTE BEAM uses <5 mW of laser radiation to cure the UV-sensitive
photoresist. For increased safety to operator, the equipment is equipped with a laser interlock
system to prevent accidental exposure to 405 nm light. Located on the bottom side of the front
door, the magnetic door catch/interrupt can detect if the front door is closed properly. The
interlock is directly connected to the microcontroller and triggers an interrupt to disable the laser
diode output current in under 1 millisecond. Under normal operating conditions, the magnetic
interlock cannot be triggered without the use of specialized tools, such as magnetic steel plates.
The laser does not require maintenance or calibration procedures that require the enclosure to
be opened while the laser is turned on. A built-in photodiode and the camera are used for
calibration and to verify the function of the laser.
Maintenance
Before performing any maintenance, disconnect the line cord and all test cables. To maintain
protection from electric shock and fire, replacement components in mains circuits - including the
power transformer, test leads, and input jacks - must be purchased from NANYTE. Standard fuses
with applicable national safety approvals may be used if the rating and type are the same.
Other components that are not safety-related may be purchased from other suppliers as long as
they are equivalent to the original component (note that selected parts should be purchased only
through NANYTE to maintain accuracy and functionality of the product). If you are unsure about
the applicability of a replacement component, contact your local NANYTE representative.
1. To clean the equipment,
2. use a damp cloth or mild, water-based cleaner.
3. Clean the exterior of the equipment only.
4. Do not apply cleaner directly to the equipment or allow liquids to enter or spill on the
equipment.
5. Products that consist of a circuit board with no case or chassis should never require
cleaning if handled according to instructions.
6. If the board becomes contaminated and operation is affected, the board should be
returned to the factory for proper cleaning/servicing.
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NANYTE BEAM Manual
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Contact Information
If you have any questions, please contact your local NANYTE representative. Alternatively, you
Packing List
Due to its low weight and compact size, NANYTE BEAM is shipped in a 50 x 50 x 50 cm corrugated
cardboard box with foam protection.
1 x NANYTE BEAM
1 x NANYTE BEAM ENGINE
1 x C13 AC supply cord (appropriate plug types for the region will be supplied)
1 x 2 meter USB 3.0 Type B cable
1 x Quick start guide
1 x Factory Acceptance Test report
1 x Allen key set
1 x User manual
1 x Pre-configured laptop with international warranty (optional)
Unpacking and installation
For unpacking instructions, please refer to the quick start guide that is shipped with the system.
Please refer to the quick start guide.
CAUTION: During shipping, locking screws are used to hold components in place. Failure to
remove the screws may damage the equipment.
Product overview
NANYTE BEAM is a full-feature compact maskless UV lithography system intended for rapid
prototyping of nano and microdevice. Maskless lithography enables nanopatterning at will,
without the need for slow and expensive photomasks. This convenience is especially useful for
research and rapid prototyping use. The NANYTE BEAM compliments the existing benefits by
bringing it to the desktop without any compromise in performance.
Compact.
Full-featured maskless lithography, smaller than a desktop computer.
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NANYTE BEAM Manual
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Powerful.
Sub-micron resolution while exposing a write field in less than two seconds.
Ultrafast autofocus.
Piezo actuators reach focus in less than a second when combined with our closed-looped focus
optics.
No-fuss multilayer.
Semi-automatic alignment allows multilayer alignment to be completed within minutes.
The BEAM ENGINE focuses a UV laser beam into a diffraction-limited spot and scans the spot to
expose any arbitrary pattern on a photoresist. To expose large wafers, precision steppers move
the wafer and allows multiple exposures to be stitched. The Beam Engine is capable of producing
features smaller than (CD) 0.8 µm across a 5” wafer.
A h-line laser light source is used and is compatible with a wide range of resists. The BEAM
ENGINE can be upgraded to use other light sources. Please contact your local representative for
this upgrade.
Below are some samples patterned with NANYTE BEAM.
50 µm
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Specifications
The following tables detail the design specifications of NANYTE BEAM.
Patterning
Minimum Linewidth 2 µm guaranteed
0.8 µm achievable
Minimum Pitch 1.6 µm achievable
Exposure Time < 2 s for 1 writefield
Maximum writefield 400 µm ✕ 400 µm
Laser Wavelength 405 nm
Galvo
Step size 8 nm
Repeatability < 100 nm (static)
Speed up to 200 mm/s
Stepping
Motorized
Stepper
Encoder Resolution 0.1 µm
Stage Repeatability (1σ) Better than 0.3 µm
Movement area 120 mm ✕ 120 mm
Largest sample size 130 mm ✕ 130 mm (> 5”)
Wafer alignment Multilayer processes supported
General
Accepted file
formats
.bmp, .png, .tiff, .gds, .dxf
Custom shapes can directly be drawn in software.
Software
Patterning
Nanyte Beam Xplorer
Design KLayout (most powerful), MS Paint/Powerpoint (rapid
prototyping)
Weight Lighter than 20 kg
System size 330 ✕ 310 ✕ 340 mm
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System requirements
Power
BEAM operates on 100-240 VAC 50-60 Hz. Line voltage and frequency are automatically
sensed; therefore, no switches are to be set. Check that the operating voltage in your area is
compatible.
CAUTION – Operating the equipment on an incorrect line voltage may cause damage, possibly
voiding the warranty.
Location
Indoor, dust free, near-non-conductive pollution (degree 2 of EN61010-1:2010)
Tabletop vibration should be kept under VC-A (50 um/s)
Cleanroom environment is optional
Equipment must be shaded from indirect sunlight
Relative humidity < 80% (no condensation)
Altitude < 2000 m
Temperature 10-25 C
Host Computer Minimum Requirements
NANYTE offers the option to ship BEAM along with a pre-configured laptop. Please contact your
local representative for such an option. If you are using your own computer, ensure that it meets
the below specifications.
CPU: Intel 9th Gen i7 9750H 6-core
GPU: NVIDIA GTX 1060
RAM: 16 GB
Storage: > 500 GB SSD
OS: Windows 10 Home or Professional Editions
Networking: Wi-Fi or Ethernet connection required for remote assistance
Others: Trackpads are not recommended for use with the control software.
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Front View
OBJECTIVES
Focuses the UV laser beam into a diffraction-limited spot to expose the resist. Objectives are
secured with standard screw thread. The table below summarizes the various objectives that is
compatible.
Objective Theoretical
Resolution (nm)
Achievable
Linewidth (nm)
Write Field
(um)
Working
Distance (mm)
Nikon 20x 370 600 400 1
Nikon 10x 1100 1000 800 7.5
Nikon 4x 2750 3500 2000 30
The standard NANYTE BEAM is shipped with the Nikon 20x option. The theoretical resolution is
calculated from the numerical aperture of the objectives, while the achievable linewidth is
empirically determined from testing. The values listed are for reference and may greatly differ
(increased or even decreased) due to process parameters. The write field parameter determines
the maximum area on the substrate that can be exposed without moving the steppers. Working
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