Silicon Laboratories Si4438-C Manual de usuario

Si4438-C

HIGH-PERFORMANCE, LOW-CURRENT TRANSCEIVER

Features

Applications

Description

Silicon Laboratories' Si4438 is a high-performance, low-current

transceivers covering the sub-GHz frequency bands from 425 to

525 MHz. The Si4438 is targeted at the Chinese smart meter market and

is especially suited for electric meters. This device is footprint- and

pin-compatible with the Si446x radios, which provide industry-leading

performance for worldwide sub-GHz applications. The radios are part of

the EZRadioPRO®family, which includes a complete line of transmitters,

receivers, and transceivers covering a wide range of applications. All

parts offer outstanding sensitivity of –124 dBm while achieving extremely

low active and standby current consumption. The 58 dB adjacent channel

selectivity with 12.5 kHz channel spacing ensures robust receive

operation in harsh RF conditions. The Si4438 offers exceptional output

power of up to +20 dBm with outstanding TX efficiency. The high output

power and sensitivity results in an industry-leading link budget of 144 dB

allowing extended ranges and highly robust communication links.

Frequency

range = 425–525 MHz

Receive sensitivity = –124 dBm

Modulation

(G)FSK

OOK

Max output power

+20 dBm

Low active power consumption

14 mA RX

Ultra low current powerdown

modes

30 nA shutdown, 40 nA standby

Data rate = 100 bps to 500 kbps

Preamble Sense Mode

6 mA average Rx current at

1.2 kbps

Fast wake and hop times

Power supply = 1.8 to 3.8 V

Excellent selectivity performance

58 dB adjacent channel

75 dB blocking at 1 MHz

Antenna diversity and T/R switch

control

Highly configurable packet handler

TX and RX 64 byte FIFOs

Auto frequency control (AFC)

Automatic gain control (AGC)

Low BOM

Low battery detector

Temperature sensor

20-Pin QFN package

IEEE 802.15.4g ready

Suitable for China regulatory (State

Grid)

China smart meters

Patents pending

Pin Assignments

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Si4438-C

2 Rev 1.0

Functional Block Diagram

Product Freq. Range Max Output

Power

TX Current RX Current

Si4438 425–525 MHz +20 dBm 75 mA 13.7 mA

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Si4438-C

Rev 1.0 3

TABLE OF CONTENTS

Section Page

1. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4

2. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11

3. Controller Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12

3.1. Serial Peripheral Interface (SPI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12

3.2. Fast Response Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14

3.3. Operating Modes and Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14

3.4. Application Programming Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18

3.5. Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18

3.6. GPIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18

4. Modulation and Hardware Configuration Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19

4.1. Modulation Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19

4.2. Hardware Configuration Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19

4.3. Preamble Length . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21

5. Internal Functional Blocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23

5.1. RX Chain . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23

5.2. RX Modem . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23

5.3. Synthesizer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25

5.4. Transmitter (TX) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27

5.5. Crystal Oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29

6. Data Handling and Packet Handler . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31

6.1. RX and TX FIFOs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31

6.2. Packet Handler . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32

7. RX Modem Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33

8. Auxiliary Blocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33

8.1. Wake-up Timer and 32 kHz Clock Source . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33

8.2. Low Duty Cycle Mode (Auto RX Wake-Up) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33

8.3. Temperature, Battery Voltage, and Auxiliary ADC . . . . . . . . . . . . . . . . . . . . . . . . . .34

8.4. Low Battery Detector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35

8.5. Antenna Diversity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35

8.6. Preamble Sense Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35

9. Pin Descriptions: Si4438-C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37

10. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39

11. Package Outline: Si4438 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40

12. PCB Land Pattern: Si4438 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .41

13. Top Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .43

13.1. Si4438 Top Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .43

13.2. Top Marking Explanation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .43

Contact Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .44

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Si4438-C

4 Rev 1.0

1. Electrical Specifications

Table 1. DC Characteristics*

Parameter Symbol Test Condition Min Typ Max Unit

Supply Voltage

Range

VDD 1.8 3.3 3.8 V

Power Saving Modes IShutdown RC Oscillator, Main Digital Regulator,

and Low Power Digital Regulator OFF

—30—nA

IStandby Register values maintained and RC

oscillator/WUT OFF

—40—nA

ISleepRC RC Oscillator/WUT ON and all register values

maintained, and all other blocks OFF

— 740 — nA

ISleepXO Sleep current using an external 32 kHz crystal. — 1.7 — A

ISensor -LBD Low battery detector ON, register values main-

tained, and all other blocks OFF

—1—A

IReady Crystal Oscillator and Main Digital Regulator ON,

all other blocks OFF

— 1.8 — mA

Preamble Sense

Mode Current

Ipsm Duty cycling during preamble search,

1.2 kbps, 4 byte preamble

—6—mA

Ipsm Fixed 1 s wakeup interval, 50 kbps, 5 byte pream-

ble

—10—A

TUNE Mode Current ITune_RX RX Tune — 7.6 — mA

ITune_TX TX Tune — 7.8 — mA

RX Mode Current IRXH — 13.7 — mA

TX Mode Current

(Si4438) ITX_+20 +20 dBm output power, class-E match, 490 MHz,

3.3 V

—75—mA

*Note: All minimum and maximum values are guaranteed across the recommended operating conditions of supply voltage

and from –40 to +85 °C unless otherwise stated. All typical values apply at VDD = 3.3 V and 25 °C unless otherwise

stated.

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Si4438-C

Rev 1.0 5

Table 2. Synthesizer AC Electrical Characteristics1

Parameter Symbol Test Condition Min Typ Max Unit

Synthesizer Frequency

Range (Si4438)

FSYN 425 — 525 MHz

Synthesizer Frequency

Resolution2

FRES-525 425–525 MHz — 14.3 — Hz

Synthesizer Settling Time tLOCK Measured from exiting Ready mode with

XOSC running to any frequency.

Including VCO Calibration.

—50— s

Phase Noise L(fM)F = 10 kHz, 460 MHz — –109 — dBc/Hz

F = 100 kHz, 460 MHz — –111 — dBc/Hz

F = 1 MHz, 460 MHz — –131 — dBc/Hz

F = 10 MHz, 460 MHz — –141 — dBc/Hz

Notes:

1. All minimum and maximum values are guaranteed across the recommended operating conditions of supply voltage and

from –40 to +85 °C unless otherwise stated. All typical values apply at VDD = 3.3 V and 25 °C unless otherwise stated.

2. Default API setting for modulation deviation resolution is double the typical value specified.

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Si4438-C

6 Rev 1.0

Table 3. Receiver AC Electrical Characteristics1

Parameter Symbol Test Condition Min Typ Max Unit

RX Frequency

Range (Si4438)

FRX 425 — 525 MHz

RX Sensitivity2PRX_0.5 (BER < 0.1%)

(500 bps, GFSK, BT = 0.5,

f = 250Hz)2

— –124 — dBm

PRX_40 (BER < 0.1%)

(40 kbps, GFSK, BT = 0.5,

f = 20 kHz)2

— –108 — dBm

PRX_100 (BER < 0.1%)

(100 kbps, GFSK, BT = 0.5,

f = 50 kHz)1

— –104 — dBm

PRX_9.6 (BER < 0.1%)

(9.6 kbps, GFSK, BT = 0.5,

f = 4.8 kHz)2

— –114 — dBm

PRX_OOK (BER < 0.1%, 4.8 kbps, 350 kHz BW,

OOK, PN15 data)2

— –108 — dBm

(BER < 0.1%, 40 kbps, 350 kHz BW,

OOK, PN15 data)2

— –102 — dBm

(BER < 0.1%, 120 kbps, 350 kHz BW,

OOK, PN15 data)2

— –98 — dBm

RX Channel Bandwidth BW 1.1 — 850 kHz

RSSI Resolution RESRSSI — ±0.5 — dB

1-Ch Offset Selectivity,

450 MHz2

C/I1-CH Desired Ref Signal 3 dB above sensitiv-

ity, BER < 0.1%. Interferer is CW, and

desired is modulated with 2.4 kbps

F = 1.2 kHz GFSK with BT = 0.5, RX

channel BW = 4.8 kHz,

channel spacing = 12.5 kHz

— –60 — dB

Blocking 1 MHz Offset21MBLOCK Desired Ref Signal 3 dB above sensitiv-

ity, BER = 0.1%. Interferer is CW, and

desired is modulated with 2.4 kbps,

F = 1.2 kHz GFSK with BT = 0.5,

RX channel BW = 4.8 kHz

— –77 — dB

Blocking 8 MHz Offset28MBLOCK — –84 — dB

Image Rejection ImREJ Rejection at the image frequency.

IF = 468 kHz

—40—dB

Notes:

1. All minimum and maximum values are guaranteed across the recommended operating conditions of supply voltage and

from –40 to +85 °C unless otherwise stated. All typical values apply at VDD = 3.3 V and 25 °C unless otherwise stated.

2. Measured over 50000 bits using PN9 data sequence and data and clock on GPIOs. Sensitivity is expected to be better

if reading data from packet handler FIFO especially at higher data rates.

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Si4438-C

Rev 1.0 7

Table 4. Transmitter AC Electrical Characteristics1

Parameter Symbol Test Condition Min Typ Max Unit

TX Frequency

Range FTX 425 — 525 MHz

(G)FSK Data Rate2DRFSK 0.1 — 500 kbps

OOK Data Rate2DROOK 0.1 — 120 kbps

Modulation Deviation

Range f525 425–525 MHz — 750 — kHz

Modulation Deviation

Resolution3FRES-525 425–525 MHz —14.3 —Hz

Output Power Range4

PTX

Typical range at 3.3 V

with class E match optimized for best

PA efficiency.

–20 — +20 dBm

TX RF Output Steps PRF_OUT

Using Class E match within 6 dB of max

power — 0.25 — dB

TX RF Output Level

Variation vs. Temperature PRF_TEMP –40 to +85 C — 2.3 — dB

TX RF Output Level

Variation vs. Frequency PRF_FREQ — 0.6 — dB

Transmit Modulation

Filtering B*T Gaussian Filtering Bandwith Time

Product — 0.5 —

Notes:

1. All minimum and maximum values are guaranteed across the recommended operating conditions of supply voltage and

from –40 to +85 °C unless otherwise stated. All typical values apply at VDD = 3.3 V and 25 °C unless otherwise stated.

2. The maximum data rate is dependent on the XTAL frequency and is calculated as per the formula:

Maximum Symbol Rate = Fxtal/60, where Fxtal is the XTAL frequency (typically 30 MHz).

3. Default API setting for modulation deviation resolution is double the typical value specified.

4. Output power is dependent on matching components and board layout.

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Si4438-C

8 Rev 1.0

Table 5. Auxiliary Block Specifications1

Parameter Symbol Test Condition Min Typ Max Unit

Temperature Sensor

Sensitivity

TSS— 4.5 — ADC

Codes/

°C

Low Battery Detector

Resolution

LBDRES —50—mV

Microcontroller Clock

Output Frequency Range2

FMC Configurable to Fxtal or Fxtal

divided by 2, 3, 7.5, 10, 15, or

30 where Fxtal is the reference

XTAL frequency. In addition,

32.768 kHz is also supported.

32.768K — Fxtal Hz

Temperature Sensor

Conversion

TEMPCT Programmable setting — 3 — ms

XTAL Range3XTALRange 25 — 32 MHz

30 MHz XTAL Start-Up Time t30M Using XTAL and board layout in

reference design. Start-up time

will vary with XTAL type and

board layout.

— 300 — s

30 MHz XTAL Cap

Resolution

30MRES —70—fF

32 kHz XTAL Start-Up Time t32k — 2 — sec

32 kHz Accuracy using

Internal RC Oscillator

32KRCRES — 2500 — ppm

POR Reset Time tPOR ——6ms

Notes:

1. All minimum and maximum values are guaranteed across the recommended operating conditions of supply voltage and

from –40 to +85 °C unless otherwise stated. All typical values apply at VDD = 3.3 V and 25 °C unless otherwise stated.

2. Microcontroller clock frequency tested in production at 1 MHz, 30 MHz, 32 MHz, and 32.768 kHz. Other frequencies

tested in bench characterization.

3. XTAL Range tested in production using an external clock source (similar to using a TCXO).

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Si4438-C

Rev 1.0 9

Table 6. Digital IO Specifications (GPIO_x, SCLK, SDO, SDI, nSEL, nIRQ, SDN)1

Parameter Symbol Test Condition Min Typ Max Unit

Rise Time2,3 TRISE 0.1 x VDD to 0.9 x VDD,

CL= 10 pF,

DRV<1:0> = LL

— 2.3 — ns

Fall Time3,4 TFALL 0.9 x VDD to 0.1 x VDD,

CL= 10 pF,

DRV<1:0> = LL

—2—ns

Input Capacitance CIN —2—pF

Logic High Level Input Voltage VIH VDD x 0.7 — — V

Logic Low Level Input Voltage VIL ——V

DD x 0.3 V

Input Current IIN 0<VIN< VDD –1 — 1 A

Input Current If Pullup is Activated IINP VIL = 0 V 1 — 4 A

Drive Strength for Output Low

Level

IOmaxLL DRV[1:0] = LL3— 6.66 — mA

IOmaxLH DRV[1:0] = LH3— 5.03 — mA

IOmaxHL DRV[1:0] = HL3— 3.16 — mA

IOmaxHH DRV[1:0] = HH3— 1.13 — mA

Drive Strength for Output High

Level

IOmaxLL DRV[1:0] = LL3— 5.75 — mA

IOmaxLH DRV[1:0] = LH3— 4.37 — mA

IOmaxHL DRV[1:0] = HL3— 2.73 — mA

IOmaxHH DRV[1:0] = HH3— 0.96 — mA

Drive Strength for Output High

Level for GPIO0

IOmaxLL DRV[1:0] = LL3— 2.53 — mA

IOmaxLH DRV[1:0] = LH3— 2.21 — mA

IOmaxHL DRV[1:0] = HL3— 1.7 — mA

IOmaxHH DRV[1:0] = HH3— 0.80 — mA

Logic High Level Output Voltage VOH DRV[1:0] = HL VDD x 0.8 — — V

Logic Low Level Output Voltage VOL DRV[1:0] = HL — — VDD x 0.2 V

Notes:

1. All minimum and maximum values are guaranteed across the recommended operating conditions of supply voltage

and from –40 to +85 °C unless otherwise stated. All typical values apply at VDD = 3.3 V and 25 °C unless otherwise

stated.

2. 6.7 ns is typical for GPIO0 rise time.

3. Assuming VDD = 3.3 V, drive strength is specified at Voh (min) = 2.64 V and Vol(max) = 0.66 V at room temperature.

4. 2.4 ns is typical for GPIO0 fall time.

Si4438-C

10 Rev 1.0

Table 7. Thermal Operating Characteristics

Parameter Value Unit

Operating Ambient Temperature Range TA–40 to +85 C

Thermal Impedance JA 25 C/W

Junction Temperature TJMAX +105 C

Storage Temperature Range TSTG –55 to +150 C

Table 8. Absolute Maximum Ratings*

Parameter Value Unit

VDD to GND –0.3, +3.8 V

Instantaneous VRF-peak to GND on TX Output Pin –0.3, +8.0 V

Sustained VRF-peak to GND on TX Output Pin –0.3, +6.5 V

Voltage on Digital Control Inputs –0.3, VDD + 0.3 V

Voltage on Analog Inputs –0.3, VDD + 0.3 V

Voltage on XIN Input when using a TCXO –0.7, VDD + 0.3 V

RX Input Power +10 dBm

*Note: Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These

are stress ratings only and functional operation of the device at or beyond these ratings in the operational sections of

the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability. Power Amplifier may be damaged if switched on without proper load or termination connected. TX

matching network design will influence TX VRF-peak on TX output pin. Caution: ESD sensitive device.

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