Siemens S75 Guía de configuración

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Technical Documentation 10/2005

TD_Repair_L2.5L_S75_R1.0.pdf Page 1 of 15

Service Repair Documentation

Level 3 (2.5 light) – S75

Release Date Department Notes to change

R 1.0 04.10.2005 BenQMobile S CC CES New document

Company Confidential

2005©BenQ

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Table of Content

1Introduction ...............................................................................................................................3

1.1 PURPOSE ...............................................................................................................................3

1.2 SCOPE ...................................................................................................................................3

1.3 TERMS AND ABBREVIATIONS ...................................................................................................3

2List of available level 2.5light parts.........................................................................................4

3Hardware requirements ............................................................................................................4

4S75 Board layout.......................................................................................................................5

5SIM Card Problems ...................................................................................................................6

6IO Connector Problems ............................................................................................................7

7B to B connector (upper slider part) Problems ......................................................................9

8Battery Connector Problems..................................................................................................10

9MMC Connector Problems......................................................................................................11

10 Camera Connector Problems.................................................................................................12

11 IRDA Problems........................................................................................................................13

11 Display Problems ....................................................................................................................14

12 Main keypad illumination Problems ......................................................................................15

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1 Introduction

1.1 Purpose

This Service Repair Documentation is intended to support Service partners to carry out repairs on

BenQ repair level 3 (former level 2,5light). The described failures shall only be repaired in BenQ

authorized local workshops.

The level 3 (former Level 2.5light) partners are obliged to repair level 3 classified boards, up to their

repair level, under consideration of this repair instruction.

All repairs have to be carried out in an ESD protected environment and with ESD protected

equipment/tools. For all activities the international ESD regulations have to be considered.

Assembling/disassembling has to be done according to the latest S75 Level 1-2 repair

documentation. It has to be ensured that every repaired mobile Phone is checked according to the

latest released General Test Instruction document (both documents are available in the Technical

Support section of the C-market).

Check at least weekly C-market for updates and consider all S75 related Customer Care Information

S75 Partnumber on IMEI label: S30880-S7700-#xxx

, while # may be any letter (A-Z) and xxx may be any number from 100, 101, 102....

Scrap Handling: All Scrap information given in this manual are related to the

SCRAP-Rules and instructions.

Attention: Consider the new "LEAD-FREE" soldering rules (available in the communication

market), avoid excessive heat.

1.2 Scope

This document is the reference document for all BenQ mobile authorised Service Partners which are

released to repair BenQ mobile phones up to level 3 (2.5 light).

1.3 Terms and Abbreviations

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2 List of available level 3 (2.5light) parts

(according to Component Matrix V1.09 - check C-market for updates)

Product ID Order Number Description CM

S75 V2631 L36197-F5008-F492 IRDA 115.2 KBIT

S75 V4902 L50640-L2108-D670 FLASH-LED HIGH BRIGHTN. WHITE

S75 X1400 L36334-Z97-C213 CONNECTOR BATTERY 3-POL

S75 X1504 L36334-Z93-C303 IO-JACK SLIM 12-POL

S75 X1604 L36334-Z97-C337 CONNECTOR SIM CARD READER K1

S75 X2200 L50634-Z97-C380 CONNECTOR DISPLAY 20POL

S75 X2705 L50634-Z97-C363 CONNECTOR BOARD TO BOARD 14-POL. X75

S75 X3500 L50634-Z97-C379 CONNECTOR CAMERA-SOCKET

S75 X3800 L36334-Z93-C297 CONNECTOR ANTENNA 6mm

S75 X4800 L50634-Z97-C348 CONNECTOR RS-MMC-READER X75

S75 Z1601 L50620-U6029-D670 FILTER EMI (Fi-Type7) PB Free

3 Hardware requirements

(according to L3-4 (L2.5L-L2.5) General soldering information V1.3 - check C-market for updates)

Jigs, Tools and working materials for all described repairs:

 hot air blower

 soldering gun

 tweezers

 flux

 solder

 S75 dome sheet jig

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4 S75 Board layout

Upper board side

Lower board side

Connector

MMC

MMI

Connector

IO Jack

Slim

Connector

Display

Connector

Antenna

Connector

Battery

Connector

Camera

Connector

SIM Card

Reade

IRDA

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5 SIM Card Problems

Fault Symptoms

Customer: GRT:

Handset does not accept SIM card SIM Card Problems

SIM Card Problems

Watch for oxidation and

damaged pads of the

SIM Card reader

caused by customer

SCRAP - has to be send

separately to WSC

not

oka

okay not

oka

Check the status of the

EMI Filter visually

Check the status of the

SIM Card reader visually

Use the resistor test

function of a multimeter

to check connection

between spring

contacts and soldering

contacts.

The value must be ~0

Exchange

SIM Card reade

Continue with

higher repair level

Exchange the

dama

ed Filter

okay

not

oka

not

oka

- check for twisted or

bent contacts

- check for dry joints

Back to customer

without repair

Connector SIM Card Reader

Use soldering iron to remove defective component. Avoid excessive heat! Watch surrounding

components! Resolder new component afterwards.

E-commerce order number: L50634-Z97-C406

E-commerce order name: CONNECTOR SIM CARD READER R65 (B)

Soldering temperature: ~ 360°C TIP Temp.

EMI Filter

Use hot air blower to remove defective component. Avoid excessive heat! Watch surrounding

components! Resolder new component afterwards.

E-commerce order number: L50620-U6029-D670

E-commerce order name: FILTER EMI (Fi-Type7) PB Free

Soldering temperature: ~ 360°C TIP Temp

IRIS Diagnose Code: 43300 Interface/SIM Card reader/Mechanical Damage

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6 IO Connector Problems

Fault Symptoms

Customer: GRT:

Charging Problems No connection to GRT

Problems with external loudspeaker or microphone when using a

car kit

Problems with accessories connected at the IO connector

Connector IO Jack

IO connector Problems

Watch for oxidation and

damaged pads of the

IO connector

caused by customer

SCRAP - has to be send

separately to WSC

not

oka

okay not

oka

Check the dust inside

the IO connector

Check the status of the

IO connector visually

Use the resistor test

function of a multimeter

to check connection

between spring

contacts and soldering

contacts.

The value must be ~0

Exchange

IO connecto

Continue with

higher repair level

Clean IO connector

okay

not

oka

not

oka

- check for twisted or

bent contacts

- check for dry joints

Back to customer

without repair

Use soldering iron to remove defective component. Avoid excessive heat! Watch surrounding

components! Resolder new component afterwards.

E-commerce order number: L36334-Z93-C303

E-commerce order name: IO-JACK SLIM 12-POL

Soldering temperature: ~ 360°C TIP Temp.

IRIS Diagnose Code: 46100 Interface/Charging Connector/Mechanical Damage

47300 Interface/Data Interface/Mechanical Damage

4B100 Interface/Headset Connector/Mechanical Damage

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Important additional soldering hints

The MMC Reader is located on the opposite of the SLIM-Lumberg connector.

Therefore the risk to damage the plastic material of this MMC-Reader is potentially high if excessive

heat is used while removal or soldering of the SLIM-Lumberg connector.

Please follow these instructions:

a) Remove the SLIM-Lumberg connector with a soldering iron and Desolder Wick

b) Clean the Pads afterwards

c) Solder the new connecter by using soldering iron under consideration of the max. allowed

temperature range.

Samples of critical area:

Lock mechanism damaged Lock mechanism OK

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7 B to B connector (upper slider part) Problems

Fault Symptoms

Customer: GRT:

Upper slider keyboard malfunction Keyboard malfunction

Upper slider keypad illumination does not work Current measured failed

B to B connector problems

Watch for oxidation and

damaged pads of the

B to B connector

caused by customer

SCRAP - has to be send

separately to WSC

not

oka

okay

Check the status of the

B to B connector visually

Exchange

B to B

connector

Continue with

higher repair level

okay

not

oka

not

oka

- check for twisted or

bent contacts

- check for dry joints

Back to customer

without repair

Connector Board to Board

Use hot air blower to remove defective component. Avoid excessive heat! Watch surrounding

components! Resolder new component afterwards.

E-commerce order number: L50634-Z97-C340

E-commerce order name: BOARD TO BOARD 30-POL

Soldering temperature: ~ 360°C TIP Temp.

IRIS Diagnose Code: 32100 Keys / Main / No Function

32200 Keys / Main / Reduced Functionality

36000 Keys / Illumination

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8 Battery Connector Problems

Fault Symptoms

Customer: GRT:

Mobile does not switch on No connection to GRT

Battery connector problems

Watch for oxidation and

damaged pads of the

battery connector

caused by customer

SCRAP - has to be send

separately to WSC

not

oka

okay

Check the status of the

battery connector

visuall

Exchange

battery

connector

Continue with

higher repair level

okay

Use the resistor test

function of a multimeter

to check connection

between spring

contacts and soldering

contacts. The value

must be ~ 0.

not

oka

not

oka

- check for twisted or

bent contacts

- check for dry joints

Back to customer

without repair

Connector BATTERY

Use hot air blower to remove defective component. Avoid excessive heat! Watch surrounding

components! Resolder new component afterwards.

E-commerce order number: L36334-Z97-C213

E-commerce order name: CONNECTOR BATTERY 3-POL

Soldering temperature: ~ 360°C TIP Temp.

IRIS Diagnose Code: 13000 Battery/Mechanical Damage

Company Confidential

2005©BenQ

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