Sapphire Audio FS-FP6 Manual de usuario

User’s Manual

AMD FP6 SOC SFF Mainboard

FS-FP6

TRADEMARK

All products and company names are trademarks or registered

trademarks of their respective holders.

These specifications are subject to change without notice.

Manual Revision 1.0

ovember 17, 2021

~ ii ~

Federal Communications Commission (FCC) Statement

This device has been tested and found to comply with the limits for a Class B

digital device, pursuant to Part 15 of FCC Rules These limits are designed to

provide reasonable protection against harmful interference in a residential

installation This equipment generates, uses and can radiate radio frequency

energy and, if not installed and used in accordance with instructions contained

in this manual, may cause harmful interference to radio and television

communications However, there is no guarantee that interference will not occur

in a particular installation

If this product does cause harmful interference to radio or television reception,

which can be determined by turning the equipment off and on, the user is

encouraged to try to correct the interference by one or more of the following

measures:

Reorient or relocate the receiving antenna

Increase the separation between the equipment and receiver

Connect the product into an outlet on a circuit different from that to which

the receiver is connected

Consult the dealer or an experienced radio/TV technician for help



Note1: Connecting this device to peripheral devices that do not comply

with Class B requirements, or using an unshielded peripheral data

cable, could also result in harmful interference to radio or television

reception



Note2: The user is cautioned that any changes or modifications not

expressly approved by the party responsible for compliance could

void the user’s authority to operate this product



Note3: To ensure that the use of this product does not contribute to

interference, it is necessary to use shielded I/O cables

CE: Radiation of EN 55022 & Immunity of EN 55024

~ iii ~

aste Electrical and Electronic Equipment ( EEE) Statement

To protect the global environment, this product must be sent to separate collection

facilities for recovery and recycling.

DISPOSAL

Do not dispose of this product as unsorted municipal waste. Collect such

waste separately for special treatment.

Manufacturer

Sapphire Technology Limited

Unit 909- 9 9, 9/F., Tower 2 Grand Central Plaza

38 Shatin Rural Committee Road

Shatin, Hong Kong

~ iv ~

Table of Contents

Chapter 1 Introduction .............................................................................1

1-1 Mainboard Specifications ................................................................1

1-2 Mainboard Layout ...........................................................................4

1-3 Mainboard Dimension .....................................................................6

Chapter 2 Installaion ................................................................................8

2-1 Installing System Memory ...............................................................8

Memory Configuration .....................................................................8

Memory Installation .........................................................................8

2-2 Installing Expansion Cards .............................................................9

M.2 E-Key Slot ................................................................................9

M.2 M-Key Slot ..............................................................................10

2-3 Connecting Cables and Jumper Settings ......................................13

Front Panel Header .......................................................................13

SATA3 Connector ..........................................................................14

SATA Power Header ......................................................................14

COM Header .................................................................................15

GPIO Header ................................................................................15

USB2.0 Header .............................................................................15

Case Open Header .......................................................................15

SMBus Header ..............................................................................16

SPI Header ....................................................................................16

Fan Headers .................................................................................16

RS422/RS232/RS485 Mode Select Jumper ..................................17

Slew Speed Select Jumper ...........................................................17

Auto Power ON Jumper ................................................................17

Clear CMOS Jumper .....................................................................18

2-4 LED Status Indicators ...................................................................19

Chapter 3 Configuring the BIOS ............................................................20

3-1 Select Boot Device .......................................................................20

3-2 Enter BIOS Setup .........................................................................20

3-3 Main Menu ....................................................................................22

3-4 Advanced Menu ............................................................................23

~ v ~

Trusted Computing ........................................................................23

ACPI Settings ................................................................................25

F81803 Super IO Configuration ....................................................26

Hardware Monitor ..........................................................................27

RTC Wake Settings .......................................................................29

CPU Configuration ........................................................................30

SATA Configuration....................................................................... 31

PCI Subsystem Settings ................................................................32

USB Configuration ........................................................................33

Network Stack Configuration .........................................................34

CSM Configuration ........................................................................35

NVMe Configuration ......................................................................37

Onboard Devices ..........................................................................37

AMD CBS ......................................................................................39

AMD PBS ......................................................................................43

3-5 Chipset Menu ................................................................................44

South Bridge .................................................................................44

North Bridge ..................................................................................45

3-6 Security Menu ...............................................................................46

3-7 Boot Menu ....................................................................................48

3-8 Save & Exit Menu .........................................................................49

Chapter 4 Driver Installation ...............................................................50

4-1 Driver Install ..................................................................................50

~ ~

Chapter 1 Introduction

1-1 Mainboard Specifications

APU

AMD

V2000 series APU for FP6 package with Zen 2 core

Graphics

AMD

Radeon Vega graphics series

Supports four independent displays with DisplayPort

Port Supported resolution

DisplayPort 1.4 3840x2160@60Hz

System Memory

Two 260-pin DDR4 SDRAM SO-DIMM (ECC/Non ECC) sockets

Supports 1 2V DDR4-2133/2400/2666/2933/3200 DIMMs with dual channel

architecture

* The memory speed will be depend on CPU specification

Supports 4GB, 8GB, 16GB and 32GB DDR4 SO-DIMMs up to maximum 64GB

Expansion Slots



One M 2 Slot E-key with 2230 type with PCIe x1 and USB2 0 for Wifi/BT

One M 2 Slot M-key with 2242/2280 storage type with PCIe x4 for SSD

USB Ports

Four USB 2 0 ports at rear panel and one 4-pin onboard headers supporting

transfer speed up to 480Mbps

One USB3 1 Type C port and one USB3 1 Gen 2 port at front panel supporting

transfer speed up to 10Gbps

- USB3 1 Type C port power delivery: Nominal voltage 5V; maximum current

1 5A

Supports wake-up from S3 and S4 modes

~ 2 ~

SATA Ports

One SATA3 port with 6Gb/s data transfer rate

Supports AHCI (Advanced Host Controller Interface)

Onboard LAN

Two Gigabit Ethernet from Realtek

RTL8111H Gigabit controller

Onboard TPM

Supports TPM2 0 from Infineon SLB9670

Onboard Audio

Supports 2-channel High-Definition audio from Realtek ALC262 codec

Onboard Fintek F81803U LPC bus I/O controller

Supports Hardware Monitor for fan speed monitoring, CPU and system

temperature

Back Panel /O Ports

2 x RJ45 LAN ports

4 x USB2 0 ports

4 x DisplayPorts

1 x DC-in 12V~19V Jack, dimension: 5 5x2 5mm

Front Panel /O Ports

1 x USB3 1 Type C port

1 x USB3 1 Gen 2 port

1 x Line-Out port

1 x Mic-In port

nternal /O Connectors

1 x 4-pin 12V ATX Power connector

1 x SATA3 header

1 x SATA Power header, 2 50mm pitch

1 x Front Panel header, 2 00mm pitch

~ 3 ~

1 x COM header, 2 00mm pitch

1 x GPIO header, 2 00mm pitch

1 x Case Open header, 2 54mm pitch

1 x SMBus header, 2 54mm pitch

1 x SPI header, 1 27mm pitch

1 x USB2 0 4-pin header, 2 54mm pitch

1 x 4-pin CPU Fan header

1 x 3-pin SYSTEM Fan header

Onboard Jumper

RS232 / RS422 / RS485 mode select jumper, 2 54mm pitch

Slew Speed Select Jumper, 2 54mm pitch

Auto Power ON selection jumper, 2 54mm pitch

Clear CMOS jumper, 2 54mm pitch

B OS

128Mb SPI Flash with AMI based BIOS

Supports ACPI (Advanced Configuration and Power Interface)

Onboard jumper to clear the CMOS data

Dimensions

Size: 147 3mm×139 7mm

Operating systems

Supports Windows 10 (64bit), Ubuntu 20 04 1 (64-bit)

Environmental

Power Requirement: Power adapter of 12V~19V DC OUT, ~75W, 5 5/2 5mm

power jack, input voltage tolerance +/- 10%

Operating Temperature: 0°C~50°C (32°F~122°F)

Storage Temperature: -20°C~80°C (-4°F~176°F)

Relative Humidity: 10%~90%

~ 4 ~

1-2 Mainboard Layout

The following figure shows the location of components on the mainboard

See page 5 for component description

Note:

Picture is for reference only, actual board may be slightly different.

See next page for details.

~ 5 ~

Item

Component description Item

Component description

1 AMD FP6 APU 16 GPIO Header, 2.00mm pitch

2 DDR4 SO-DIMM *2 17 Front Panel Header, 2.00mm pitch

3 M.2 E-Key slot for Wifi/BT card

18 COM Header, 2.00mm pitch

4 M.2 M-key for SSD device 19 USB2.0 Header, 2.54mm pitch

4-pin 2V ATX Power

Connector

(Note)

20 CPU Fan Header, 2.54mm pitch

6 DC-in 2V ~ 9V Jack

(Note)

21 SYSTEM Fan Header, 2.54mm pitch

7 Display Port *4 22 RS232/422/485 Mode Select Jumper

for COM , 2.54mm pitch

8 USB2.0 Port *4 23 Slew Speed Select Jumper, 2.54mm

pitch

9 RJ45 LAN Port *2 24 Case Open Header, 2.54mm pitch

10 Line-Out Port 2 SMBus Header, 2.54mm pitch

11 USB3. Type C Port 26 SPI Header, .27mm pitch

12 USB3. Gen 2 Port 27 Auto Power ON Jumper, 2.54mm

pitch

13 Mic-In Port 28 Clear CMOS Jumper, 2.54mm pitch

14 SATA3 Connector 29 BIOS

1 SATA Power Header, 2.50mm

pitch 30

Battery Header

Note:

There are two ways to source power to the board: DC jack or 4-pin ATX power connector.

Two different physical ports that can only be used one at a time.

e.g. When DC-in 2V ~ 9V jack is being used, the 4-pin power connector (PW ) shouldn’t

be connected to any power source.

Warning:

e of the power inputs may be damaged when connecting both DC jack and ATX power at

the same time.

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