Samsung GT-B6520 Manual de usuario

GSM TELEPHONE

GT-B6520

GSM TELEPHONE CONTENTS

1. Safety Precautions

2. Specification

3. Product Function

4. Exploded View and Parts list

5. MAIN Electrical Parts List

6. Level 1Repair

7. Level 2Repair

8. Level 3Repair

9. Reference data

Notice

All functionality, features, specifications and o

ther product information provided in this docu

ment including, but not limited to, the benefit

s, design, pricing, components, performance,

availability, and capabiliti-es of the product

are subject to change without notice or oblig

ation. Samsung reserves the right to make

changes to this document and the product

described herein, at anytime, without

obligation on Samsung to provide notification

of such change.

SAMSUNG Proprietary-Contents may change without notice

1. Safety Precautions

1-1

This Document can not be used without Samsung's authorization

1-1. Repair Precaution

―Repair in Shield Box, during detailed tuning.

Take specially care of tuning or test, because the specification of cellular phone is sensitive for

surrounding interference(RF noise).

―Be careful to use akind of magnetic object or tool, because performance of parts is damaged by

the influence of magnetic force.

―Surely use astandard screwdriver when you disassemble this product, otherwise screw will be

worn away.

―Use athicken twisted wire when you measure level.

Athicken twisted wire has low resistance, therefore error of measurement is few.

―Repair after separate Test Pack and Set because for short danger (for example an overcurrent

and furious flames of parts etc) when you repair board in condition of connecting Test Pack and

tuning on.

―Take specially care of soldering, because Land of PCB is small and weak in heat.

―Surely tune on/off while using AC power plug, because arepair of battery charger is dangerous

when tuning ON/OFF PBA and Connector after disassembling charger.

―Don't use as you pleases after change other material than replacement registered on SEC System.

Otherwise engineer in charge isn't charged with problem that you don't keep this rules.

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Safety Precautions

1-2

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1-2. ESD(Electrostatically Sensitive Devices) Precaution

Several semiconductor may be damaged easily by static electricity. Such parts are called by ESD

(Electrostatically Sensitive Devices), for example IC,BGA chip etc. Read Precaution below.

You can prevent from ESD damage by static electricity.

―Remove static electricity remained your body before you touch semiconductor or parts with

semiconductor. There are ways that you touch an earthed place or wear static electricity prevention

string on wrist.

―Use earthed soldering steel when you connect or disconnect ESD.

―Use soldering removing tool to break static electricity. Otherwise ESD will be damaged by static

electricity.

―Don't unpack until you set up ESD on product. Because most of ESD are packed by box and

aluminum plate to have conductive power,they are prevented from static electricity.

―You must maintain electric contact between ESD and place due to be set up until ESD is

connected completely to the proper place or acircuit board.

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2. Specification

This Document can not be used without Samsung's authorization

2-1

2-1. GSM General Specification

GSM 850 EGSM 900 DCS1800 PCS1900 W-CDMA

900 W-CDMA

2100

Freq. Band[MHz]

Uplink/Downlink 824~849

869~894 880~915

925~960 1710~1785

1805~1880 1850~1910

1930~1990 882~913

927~958 1920~1980

2110~2170

ARFCN range 128~25 0~124 &

975~1023 512~885 512~810 UL:2712~2863

DL:2937~3088

UL:9612~9888

DL:10562~

10838

Tx/Rx spacing 45MHz 45MHz 95MHz 80MHz 45MHz 130MHz

Mod. Bit rate/

Bit Period 270.833kbps

3.692us 270.833kbps

3.692us 3.84Mcps 3.84Mcps

Time Slot

Period/Frame

Period

576.9us

4.615ms 576.9us

4.615ms

Frame length:

10ms

Slot length :

0.667ms

Frame length:

10ms

Slot length :

0.667ms

Modulation 0.3GMSK 0.3GMSK 0.3GMSK 0.3GMSK QPSK

HQPSK QPSK

HQPSK

MS Power 33dBm

~5dBm 33dBm

~5dBm 30dBm

~0dBm 30dBm

~0dBm 24dBm~- 50dBm 24dBm ~ -

50dBm

Power Class 4

(max

+33dBm)

(max

+33dBm)

(max

+30dBm)

(max

+30dBm)

(max +24dBm) 3

(max +24dBm)

Sensitivity -102dBm -102dBm -100dBm -100dBm -106.7dBm -106.7dBm

TDMAMux8888

Cell Radius 35Km 35Km 2Km 2Km 2Km 2Km

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Specification

2-2

This Document can not be used without Samsung's authorization

TX Power

control level GSM850

GSM900

533±2

dBm

631±2

dBm

729±2

dBm

827±2

dBm

925±2

dBm

10 23±2 dBm

11 21±2 dBm

12 19±2 dBm

13 17±2 dBm

14 15±2 dBm

15 13±2 dBm

16 11±3 dBm

17 9±3 dBm

18 7±3 dBm

19 5±3 dBm

TX Power

control level DCS1800

030±3

dBm

128±3

dBm

226±3

dBm

324±3

dBm

422±3

dBm

520±3

dBm

618±3

dBm

716±3

dBm

814±3

dBm

912±4

dBm

10 10±4 dBm

11 8±4 dBm

12 6±4 dBm

13 4±4 dBm

14 2±5 dBm

15 0±5 dBm

TX Power

control level PCS1900

030±3

dBm

128±3

dBm

226±3

dBm

324±3

dBm

422±3

dBm

520±3

dBm

618±3

dBm

716±3

dBm

814±3

dBm

912±4

dBm

10 10±4 dBm

11 8±4 dBm

12 6±4 dBm

13 4±4 dBm

14 2±5 dBm

15 0±5 dBm

2-2. GSM Tx Power Class

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3. Operation Instruction and Installation

3-1

This Document can not be used without Samsung's authorization

Main Function

－HSDPA /UMTS, EDGE, GPRS

－BT 2.0 + EDR

－Camera: 2.0 Mega Pixel, CMOS

CIF CAMERA(Video Call)

－LCD :2.4"

LQVGA TFT-LCD

－Size : 116.5x61.8x11.5 mm

－GPRS/EDGE :class 10

－Battery: 1500mAH

－Band: GSM 900/1800/1900, FDDⅠ/Ⅷ

－BB: Qualcomm MSM7225

－RF: Qualcomm RTR6285

－WLAN 802.11 b/g

－A-GPS

－FM RADIO

－Video Sharing /Streaming

－USB 2.0

－MMS /SMS

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4. Exploded View and Parts List

4-1

This Document can not be used without Samsung's authorization

4-1. Cellular phone Exploded View

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Exploded View and Parts List

4-2

This Document can not be used without Samsung's authorization

Design LOC Discription SEC CODE

QCR03 SCREW-MACHINE 6001-001811

QCR49 SCREW-MACHINE 6001-001823

QCR101 SCREW-MACHINE 6001-002005

QAN02 INTENNA-GTB6520 MAIN GH42-02531A

QSM01 KEY FPCB-SIM ASSY GH59-09370A

QSP01 MODULE-SPK+RCV+MOT GH59-09396A

QCA01 CAMERA MODULE-GT-B6520 GH59-09505A

QVK01 KEY FPCB-VOL KEY GH59-09683A

QME01 ASSY MODULE-TF KEY PBA+LCD BRACKET(GTB65 GH96-04892A

QMP01 A/S ASSY-PBA MAIN (COMM) GH82-05107A

QLC01 ASSY LCD-2.4" TFT GT-B6520 GH96-04551A

QCA02 ASSY CAMERA-CIF MODULE(GT-B6520) GH96-04577A

QKP01 ASSY KEYPAD-(BLACK/OPEN) GH98-16968A

QBC00 ASSY CASE-BATT COVER GH98-17868A

QFR01 ASSY CASE-FRONT GH98-16965A

QMW01 ASSY COVER-MAIN WINDOW GH98-17562A

QRE01 ASSY CASE-REAR GH98-16964A

QRF06 PMO COVER-USB GH72-59495A

QSD01 PMO COVER-SD GH72-59496A

QVO01 PMO KEY-VOLUME GH72-59497A

QCK01 PMO KEY-CAMERA GH72-59498A

4-2. Cellular phone Parts list

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5. MAIN Electrical Parts List

5-1

This Document can not be used without Samsung's authorization

SEC Code Design Location Description

0403-001741 ZD400 DIODE-ZENER

0406-001231 ZD401 DIODE-TVS

0406-001231 ZD402 DIODE-TVS

0406-001231 ZD403 DIODE-TVS

0406-001231 ZD502 DIODE-TVS

0406-001231 ZD503 DIODE-TVS

0406-001231 ZD505 DIODE-TVS

0406-001231 ZD507 DIODE-TVS

0406-001231 ZD508 DIODE-TVS

0406-001231 ZD510 DIODE-TVS

0406-001231 ZD511 DIODE-TVS

0406-001231 ZD512 DIODE-TVS

0406-001231 ZD600 DIODE-TVS

0406-001231 ZD602 DIODE-TVS

0406-001231 ZD603 DIODE-TVS

0406-001231 ZD606 DIODE-TVS

0406-001390 ZD513 DIODE-TVS

0406-001413 D601 DIODE-TVS

0406-001413 D602 DIODE-TVS

0406-001413 D603 DIODE-TVS

0406-001413 D604 DIODE-TVS

0406-001413 D605 DIODE-TVS

0406-001413 D606 DIODE-TVS

0406-001413 D607 DIODE-TVS

0406-001413 D608 DIODE-TVS

0406-001413 ZD501 DIODE-TVS

0406-001413 ZD504 DIODE-TVS

0406-001413 ZD509 DIODE-TVS

0407-001002 D400 DIODE-ARRAY

0407-001002 D500 DIODE-ARRAY

0504-001138 TR500 TR-DIGITAL

0505-001325 TR600 FET-SILICON

0505-002341 TR400 FET-SILICON

0801-003200 U302 IC-CMOS LOGIC

0801-003265 U301 IC-CMOS LOGIC

1001-001488 U402 IC-ANALOG SWITCH

1001-001607 U205 IC-RF SWITCH

1001-001645 U500 IC-ANALOG MULTIPLEX

1108-000348 UME300 IC-MCP

1201-002971 U202 IC-RF AMP

1201-003057 PAM101 IC-POWER AMP

1201-003060 PAM102 IC-POWER AMP

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Main Electrical Parts List

5-2

This Document can not be used without Samsung's authorization

SEC Code Design Location Description

1201-003112 PAM100 IC-POWER AMP

1202-001068 U502 IC-VOLTAGE COMP.

1203-003924 U400 IC-VOL. DETECTOR

1203-004776 U501 IC-POSI.FIXED REG.

1203-006291 U401 IC-POWER SUPERVISOR

1203-006346 U405 IC-RESET

1203-006370 U601 IC-DC/DC CONVERTER

1205-003297 U100 IC-TRANSCEIVER

1205-003883 U203 IC-BLUETOOTH

1205-004047 UCP300 IC-MODEM

1205-004076 U201 IC-WIFI

1404-001221 TH300 THERMISTOR-NTC

2007-000137 R319 R-CHIP

2007-000138 R100 R-CHIP

2007-000138 R321 R-CHIP

2007-000138 R335 R-CHIP

2007-000138 R415 R-CHIP

2007-000138 R500 R-CHIP

2007-000138 R515 R-CHIP

2007-000140 R330 R-CHIP

2007-000140 R331 R-CHIP

2007-000140 R332 R-CHIP

2007-000140 R333 R-CHIP

2007-000140 R518 R-CHIP

2007-000140 R606 R-CHIP

2007-000141 R108 R-CHIP

2007-000141 R303 R-CHIP

2007-000141 R304 R-CHIP

2007-000141 R309 R-CHIP

2007-000141 R310 R-CHIP

2007-000143 R311 R-CHIP

2007-000143 R312 R-CHIP

2007-000144 R400 R-CHIP

2007-000148 R305 R-CHIP

2007-000148 R430 R-CHIP

2007-000148 R502 R-CHIP

2007-000149 R112 R-CHIP

2007-000149 R423 R-CHIP

2007-000153 R603 R-CHIP

2007-000157 R207 R-CHIP

2007-000157 R208 R-CHIP

2007-000157 R417 R-CHIP

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