Philips BDP9000 Manual de usuario
Blu-ray Disc Player Model
BDP9000
Service Manual
Contents Page
1. About this Manual 2 Contents Page
2. Safety Instructions, Warnings and Notes 3
3. System Overview 5
4. Technical Reference 7
5. Required Equipment List 13
6. Diagnosis and Repair Flowchart 14
7. Software Update and Repair 27
8. Mechanical Instructions 28
9. Circuit Diagrams and PWB Layouts 35
10. Spare Parts List 70
11. Directions for Use 73
©
Copyright 2006 Philips Consumer Electronics B.V. Eindhoven, The Netherlands.
All rights reserved. No part of this publication may be reproduced, stored in a
retrieval system or transmitted, in any form or by any means, electronic,
mechanical, photocopying, or otherwise without prior permission of Philips.
Published by Consumer Electronics Printed in the Netherlands
Subject to modification EN 0000 000 00000
EN 2 1. BDP9000 About this Manual
1. About this Manual
1.1. Content of this Manual
Note: The BDP9000 will be serviced on a modular level only. Faulty modules will be identified and replaced. Detailed circuit
diagrams and technical information on a component level are therefore not provided in this document.
1.1.1. What is included in this Manual
• Safety Information
• System Overview
• Basic System Block Diagrams
• Parts / Module Identification
• Module Functional Descriptions
• Basic Module Technical Descriptions
• Basic Measuring Point Information
• Basic Fault Finding Strategy
• Module Removal & Replacement Procedures
• Parts List / 12NC Numbers
1.2. Additional Documentation
The following documentation is supplied by Philips and must be kept with this Service Manual.
• BDP9000 User Manual
• RC4380 User Manual
Safety Instructions, Warnings and Notes BDP9000 2. EN 3
2. Safety Instructions, Warnings and Notes
2.1. Safety Instructions
2.1.1. Safety components
Replace safety components, indicated by the symbol , only by components identical to the original ones. Any other component
substitution (other than original type) may increase risk of fire or electrical shock hazard.
2.1.2. After repair
• Safety regulations require that after a repair, the set must be returned in its original condition.
• Before returning the BDP9000 to the customer always do a safety check. Pay attention to the built-in protective devices, leakage
current and insulation resistance.
2.2. Warnings
2.2.1. General
Never replace modules or other components while the unit is switched “on”.
2.2.2. ESD Protection
All ICs and many other semi-conductors are susceptible to electrostatic discharges (ESD). Careless handling during
repair can reduce life drastically. When repairing, make sure that you are connected with the same potential as the
mass of the set via a wrist wrap with resistance. Keep components and tools also at this potential.
2.3. Notes
2.3.1. Handling of the optical pick-up
The laser diode in the optical pick-up may suffer electrical breakdown because of potential static electricity from clothing and your body.
The following method is recommended to prevent damage:
1. Place a conductive sheet on the work bench. You can use the black sheet that is used to wrap repair parts.
2. Place the set on the conductive sheet to ground the chassis to the sheet.
3. Place your hands on the conductive sheet to give them the same ground as the sheet.
4. Remove the optical pick-up block.
5. Perform work on top of the conductive sheet. Be careful not to touch the unit with your clothes or any other static objects.
6. Short the short terminal on the PCB in the pick-up assembly before you lift or remove the pick-up assembly.
7. After replacing the pick-up assembly, open the short terminal on the PCB.
2.3.2. Schematic notes
• All resistor values are in ohms, and the value multiplier is often used to indicate the decimal point location (e.g. 2K2 indicates
2.2 kohm).
• Resistor values with no multiplier may be indicated with either an "E" or an "R" (e.g. 220E or 220R indicates 220 ohm).
• All capacitor values are given in micro-farads (µ = x10-6), nano-farads (n = x10-9), or pico-farads (p = x10-12).
• Capacitor values may also use the value multiplier as the decimal point indication (e.g. 2p2 indicates 2.2 pF).
• An "asterisk" (*) indicates component usage varies. Refer to the diversity tables for the correct values.
• The correct component values are listed in the Spare Parts List. Therefore, always check this list when there is any doubt.
EN 4 2. BDP9000 Safety Instructions, Warnings and Notes
2.3.3. Led-free solder
Philips CE is producing lead-free sets (PBF) from 1.1.2005 onwards.
Identification: The bottom line of a type plate gives a 14-digit serial number. Digits 5 and 6 refer to the production year, digits 7 and 8
refer to production week (in example below it is 1991 week 18).
Figure 2.1-1
Regardless of the special lead-free logo (which is not always indicated), one must treat all sets from this date onwards according to the
rules as described below.
Figure 2.1-2
Due to lead-free technology some rules have to be respected by the workshop during a repair:
• Use only lead-free soldering tin Philips SAC305 with order code 0622 149 00106. If lead-free solder paste is required, please
contact the manufacturer of your soldering equipment. In general, use of solder paste within workshops should be avoided because
paste is not easy to store and to handle.
• Use only adequate solder tools applicable for lead-free soldering tin. The solder tool must be able:
- To reach a solder-tip temperature of at least 400 °C.
- To stabilize the adjusted temperature at the solder-tip.
- To exchange solder-tips for different applications.
• Adjust your solder tool so that a temperature of around 360 °C – 380 °C is reached and stabilized at the solder joint.
Heating time of the solder-joint should not exceed ~ 4 sec.
Avoid temperatures above 400 °C, otherwise wear-out of tips will increase drastically and flux-fluid will be destroyed.
To avoid wear-out of tips, switch “off” unused equipment or reduce heat.
• Mix of lead-free soldering tin/parts with leaded soldering tin/parts is possible but PHILIPS recommends strongly to avoid mixed
regimes. If this cannot be avoided, carefully clean the solder-joint from old tin and re-solder with new tin.
• Use only original spare-parts listed in the Service-Manuals.
Not listed standard material (commodities) has to be purchased at external companies.
• Special information for lead-free BGA ICs: these ICs will be delivered in so-called "dry-packaging" to protect the IC against
moisture. This packaging may only be opened shortly before it is used (soldered). Otherwise the body of the IC gets "wet" inside
and during the heating time the structure of the IC will be destroyed due to high (steam-) pressure inside the body. If the packaging
was opened before usage, the IC has to be heated up for some hours (around 90 °C) for drying (think of ESD-protection!).
Do not re-use BGAs at all!
• For sets produced before 1.1.2005, containing leaded soldering tin and components, all needed spare parts will be available till the
end of the service period. For the repair of such sets nothing changes.
In case of doubt whether the board is lead-free or not (or with mixed technologies), you can use the following method:
- Always use the highest temperature to solder, when using SAC305 (see also instructions below).
- De-solder thoroughly (clean solder joints to avoid mix of two alloys).
Caution: For BGA-ICs, you must use the correct temperature profile, which is coupled to the 12NC. For an overview of these profiles,
visit the website www.atyourservice.ce.philips.com (needs subscription, but is not available for all regions)
You will find this and more technical information within the "Magazine", chapter "Repair downloads".
For additional questions please contact your local repair help desk.
System Overview BDP9000 3. EN 5
3. System Overview
3.1. Technical Specification
System - General Connections, front
Power requirements AC 120 V, 60 Hz Card reader CF Type 1
Power consumption 51 W (< 10 W stand-by) MD
Standby/on light Red/blue SM
Weight 9.3 lbs MS Pro
Dimensions (W x D x H) 16.9 x 12.8 x 3.1 inches MS Duo (with adapter)
Operating temperature +41 °F to 104 °F MMC
Operating humidity 10 to 75% (non-condensing) RS-MMC (with adapter)
SD
Optical drive Mini SD (with adapter)
BD Reading speed: Connections, rear
(Blu-ray Disc) 4.917 m/s Video outputs HDMI
DVD Reading speed: Component video
(Digital Versatile Disc) 3.49 - 4.06 m/s Composite video
Approx. play time: S-Video
135 min. (single side and layer) Audio outputs HDMI
CD: 12 cm Reading speed: Digital audio (S/PDIF)
(Compact Disc) 4.8 - 5.6 m/s 5.1-Channel
Max. play time: 2-Channel
74 min. Playable discs
CD: 8 cm Reading speed: Types BD:
(Compact Disc) 4.8 - 5.6 m/s BD-ROM, BD-RE
Max. play time: DVD:
20 min. DVD-VIDEO, DVD+RW (4.7
GB), DVD-RW (4.7 GB),
DVD+R (4.7 GB), DVD-R (4.7
GB),
Video output CD:
Component video Y: AUDIO-CD, CD-RW, CD-R
1.0 Vp-p (75 Ωload) Region codes BD:
Pr: A
0.70 Vp-p (75 Ωload) DVD:
Pb: All or 1
0.70 Vp-p (75 Ωload) Playable memory cards CD Type 1, MD, SM, MS PRO,
MS Duo (with adapter), MMC,
RS-MMC (with adapter), SD
Mini SD (with adapter)
Composite video I channel: Accessories
1.0Vp-p (75 Ωload) RC4380 Remote Control (with batteries)
S-Video Luminance: Quick Start Guide
1.0 Vp-p (75 Ωload) BDP9000 User Manual
Chrominance: RC4380 User Manual
0.3 Vp-p (75 Ωload) Product registration card
HDMI 480p, 720p, 1080i, 1080p HDMI cable
Audio output Component video cable
2-Channel L (1/L), R (2/R) Audio cable
5.1-Channel F/L, F/R, R/L, R/R, C, SubW
HDMI PCM multichannel audio,
Bitstream audio
PCM audio
Digital audio output Optical/Coaxial (S/PDIF)
Frequency response 48 kHz sampling:
4 Hz to 22 kHz
96 kHz sampling:
4 Hz to 44 kHz
S/N Ratio 110 dB
Dynamic range 100 dB
Total Harmonic Distortion 0.0004%
EN 6 3. BDP9000 System Overview
3.2. Video output
HDMI connection
Disc type Supported resolutions
BD (with token) 720p, 1080i, 1080p
BD, Image Constraint Token (ICT) 720p, 1080i, 1080p
BD, Digital Only Token (DOT) 720p, 1080i, 1080p
DVD 480p, 720p, 1080i, 1080p
Component video connection
Disc type Supported resolutions
BD (with token) 720p, 1080i
BD, Image Constraint Token (ICT) Not supported
BD, Digital Only Token (DOT) Not supported
DVD 480i, 480p
HDMI connection
Disc type Supported resolutions
BD (with token) Not supported
BD, Image Constraint Token (ICT) Not supported
BD, Digital Only Token (DOT) Not supported
DVD 480p, 720p, 1080i, 1080p
3.3. Audio output
2-Channel analog
Disc type Output
BD 2-Channel
DVD with Dolby Digital 2-Channel
DVD with DTS Mute
5.1-Channel analog
Disc type Output
BD 5.1-Channel
DVD with Dolby Digital 2-Channel (front left, front right)
DVD with DTS Mute
S/PDIF
Disc type Output
BD PCM: 2-Channel; Bitstream: bitstream from disc
DVD with Dolby Digital 2-Channel: (front left, front right); Bitstream: bitstream from disc
DVD with DTS PCM: Mute; Bitstream: bitstream from disc
HDMI
Disc type Output
BD PCM: 2-Channel/5.1-Channel; Bitstream: bitstream from disc
DVD with Dolby Digital 2-Channel: (front left, front right); Bitstream: bitstream from disc
DVD with DTS PCM: Mute; Bitstream: bitstream from disc
Technical Reference BDP9000 4. EN 7
4. Technical Reference
4.1. System
4.1.1. System Block Diagram
BD Loader
Flash
DDR
RC
From BD Decoder
Digital Audio
(I2S/SPDIF)
Digital Video
S-Video / CVBS
Down Mix 2ch
YPbPr
Digital Video
HDMI
Transmitter
8ch DAC
Local Bus
IDE Bus
4MB
Flash
Front I/F
(64M Byte)
UART
MPEG2
MPEG4/VC-1
Decoder
TS I/F
Digital Video
IDE Bus
PCI Bus
Memory Card
Memory
Card
Controller
DVD
decoder
BD decoder
Main CPU
I2S
SPDIF
I2S/SPDIF
Front
Surr
CT.LFE
A bus B bus C bus
DDR
DDR
DDR
Total 320M Byte
From DVD Decoder
Video DAC
(64M Byte)
Analog Video
1080p
1080i
DDR
4MB Flash Video DAC
DDR
Figure 4.1-1
EN 8 4. BDP9000 Technical Reference
4.1.2. Wiring Diagram
Figure 4.1-2
Technical Reference BDP9000 4. EN 9
4.2. Audio - AK4358 (AIC1)
SCF
DZF
LOUT1+
LOUT1-
ROUT1+
ROUT1-
LOUT2+
LOUT2-
ROUT2+
ROUT2-
LOUT3+
LOUT3-
ROUT3+
ROUT3-
LOUT4+
LOUT4-
ROUT4+
ROUT4-
DAC DATT MCLK
LRCK
BICK
SDTI1
SDTI2
SDTI3
SDTI4
DCLK
DSDL1
DSDR1
DSDL2
DSDR2
DSDL3
DSDR3
DSDL4
DSDR4
SCF DAC DATT
SCF DAC DATT
SCF DAC DATT
SCF DAC DATT
SCF DAC DATT
SCF DAC DATT
SCF
AK4358
DAC DATT
Audio
I/F
Control
Register
3-wire
or I2C
PCM
DSD
Figure 4.2-1
EN 10 4. BDP9000 Technical Reference
4.3. Video Encoder - ADV7322 (VIC4)
SD CONTROL BLOCK ADV7322
11-BIT
DAC
11-BIT
DAC
11-BIT
DAC
11-BIT
DAC
11-BIT
DAC
O
V
E
R
S
A
M
P
L
I
N
G
D
E
M
U
X
PROGRAMMABLE
RGB MATRIX
TIMING
GENERATOR
Y7-Y0
C7-C0
S7-S0
CLKIN_A
CLKIN_B
HSYNC
VSYNC
BLANK
PLL
COLOR CONTROL
BRIGHTNESS
DNR
GAMMA
PROGRAMMABLE
FILTERS
SD TEST PATTERN
HD CONTROL BLOCK
Figure 4.3-1
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