Panasonic NV-VP31GL Manual de usuario

ORDERNO. MAV0309001C3

DVDPlayer/ Video Cassette Recorder

NV-VP31GL / NV-VP31GC / NV-VP31GCS

R4-MECHANISM

SPECIFICATIONS

Unauthorized copying and distribution isaviolation of law.

1. INTRODUCTION

1.1. INTRODUCTION

This service manual contains technical information whichwill allowservice personnel to

understand and service this model.

If the circuit is changedormodified, this information will be followedbysupplementaryservice

manual tobe filedwithoriginal service manual.

Note:

1. Adjustment procedures, DisassemblyProcedures and Assembly

Procedures for Mechanism Chassisare separate volume from this

service manual.

Please refer to the service manual for R4-Mechanism Chassis.

(Order No. VRD0202010C8)

2. The Model No. isindicated on the SchematicDiagram and Circuit

Board Diagrams as follows.

Model No. Indication Mark

NV-VP31GL (GL)

NV-VP31GC (GC)

NV-VP31GCS (GCS)

1.2. ABOUTLEAD FREE SOLDER(PbF)

Distinction of PbF PCB:

PCBs (manufactured) using leadfree solderwill have a PbF stampon the PCB.

Caution:

-Pb free solder has ahigher melting point than standard solder,

Typicallythe melting point is50-70°F (30-40°C)higher. Please use

ahigh temperature soldering iron. Incase of soldering iron with

temperature control,please set itto 700±20°F (370±10°C)

-Pb free solder will tend to splash when heated too high (about

1100°F/600°C).

Whensoldering orunsoldering, please completelyremove all of the solderon the pins orsolder

area, and be sure toheat the soldering points withthe Pbfree solderuntil it melts enough.

2. SAFETY PRECAUTIONS

2.1. GENERALGUIDELINES

1. When servicing, observe the original lead dress. Ifashort circuit

isfound, replace all parts which have been overheated or

damaged bythe short circuit.

2. After servicing, confirm that all the protective devices such as

insulation barriers, insulation papers shields are properly

installed.

3. After servicing, do the following leakage current checks to

prevent the customer from being exposed to shock hazards.

2.1.1. LEAKAGE CURRENTCOLD CHECK

1. Unplug the AC cord and connect ajumper between the two

prongs on the plug.

2. Measure the resistance value, with an ohmmeter, between the

jumpered AC plug and each exposed metalliccabinet part on the

equipment such as screwheads, connectors, control shafts, etc.

When the exposed metallicpart has areturn path to thechassis,

the reading shouldbe between 1M and 5.2M .

When the exposed metal does not have areturn path to the

chassis, the reading must be .

Figure 1

2.1.2. LEAKAGE CURRENTHOTCHECK (See Figure 1 .)

1. Plug the AC cord directlyinto the AC outlet. Donot use an

isolation transformer for thischeck.

2. Connect a1.5k , 10 watts resistor, inparallel with a0.15 F

capacitors, between each exposed metallicpart on the set and a

good earth ground such as awater pipe, as shownin Figure 1 .

3. Use an AC voltmeter, with 1000 ohms/voltor more sensitivity, to

measure the potential across the resistor.

4. Check each exposed metallicpart, and measure the voltage at

each point.

5. Reverse the AC plug inthe AC outlet and repeat each of the above

measurements.

6. The potential at anypoint shouldnot exceed 0.75 volts RMS. A

leakage current tester (Simpson Model 229 or equivalent) maybe

used to do the hot checks, leakage current must not exceed 1/2

milliamp. Incase ameasurement isoutsideof the limits specified,

there isapossibilityof ashock hazard, therefore the equipment

shouldbe repaired and rechecked before itisreturned to the

customer.

3. PREVENTION OF ELECTRO STATIC DISCHARGE

(ESD) TO ELECTROSTATICALLY SENSITIVE (ES)

DEVICES

Some semiconductor(solidstate) devices canbe damagedeasilybystatic electricity. Such

components commonlyare calledElectrostaticallySensitive (ES) Devices. Examples of typical

ES devices are integratedcircuits and some field-effect transistorsand semiconductor"chip"

components. The following techniques shouldbe usedtohelpreduce the incidence of

component damage causedbyelectrostatic discharge (ESD).

1. Immediatelybefore handling anysemiconductor component or

semiconductor-equipped assembly, drainoff anyESDon your

bodybytouching aknownearth ground. Alternatively, obtainand

wear acommerciallyavailabledischargingESDwrist strap, which

shouldbe removed for potential shock reasons prior to applying

power to the unitunder test.

2. After removing an electrical assemblyequipped with ES devices,

place the assemblyon aconductive surface such as alminum foil,

to prevent electrostaticcharge buildup or exposure of the

assembly.

3. Use onlyagrounded-tipsoldering iron to solder or unsolder ES

devices.

4. Use onlyan anti-staticsolder removal device. Some solder

removal devices not classified as "anti-static(ESDprotected)"

can generate electrical charge sufficient to damage ES devices.

5. Donot use freon-propelled chemicals. These can generate

electrical charges sufficient to damage ES devices.

6. Donot remove areplacement ES device from its protective

package until immediatelybefore you are readyto install it. (Most

replacement ES devices are packaged with leads electrically

shorted together byconductive foam, alminum foil or

comparableconductive material).

7. Immediatelybefore removing the protective material from the

leads of areplacement ES device, touch the protective material to

the chassisor circuitassemblyinto which the device will be

installed.

Caution

Besure no power isapplied to the chassisor circuit, and observe

all other safetyprecautions.

8. Minimize bodilymotions when handling unpackaged replacement

ES devices. (Otherwise harmless motion such as the brushing

together of your clothes fabricor the lifting of your foot from a

carpeted floor can generate staticelectricity(ESD)sufficient to

damage an ES device).

4. PRECAUTION OF LASER DIODE

5. PREVENTION OF STATIC ELECTRICITY

DISCHARGE

The laserdiode inthe traverse unit (optical pickup) maybreak downdue tostatic electricityof

clothes orhumanbody. Use due caution toelectrostatic break downwhenservicing and

handling the laserdiode.

5.1. Grounding for electrostaticbreakdownprevention

Some devices suchas the DVD playeruse the optical pickup (laserdiode) and the optical

pickup will be damagedbystatic electricityinthe working environment. Proceedservicing

works underthe working environment where grounding works is completed.

5.1.1. Worktablegrounding

1. Put aconductive material (sheet) or iron sheet on the area where

the optical pickup isplaced, and ground the sheet.

5.1.2. Human bodygrounding

1. Use the anti-staticwrist strap to discharge the staticelectricity

form your body.

5.1.3. Handling of optical pickup

1. Inorder to keep the optical pickup ingood quality, during

transporting and before installing, both ends of the laser diode

are to be shortcircuited. After replacing the part with anew one,

remove the short circuitaccording to the correctprocedure. (

Refer to thisService manual )

2. Failure to do so will damage the laser diode due to the external

current surge from the power supplyinthe tester.

5.2. Handling Precautions for Traverse Unit(Optical Pickup)

1. Donot give aconsiderableshock to the traverse unit(optical

pickup) as ithas an extremelyhigh-precise structure.

2. When replacing the optical pickup, install the flexiblecableand

cut its short land with anipper. Refer to the optical pickup

replacement procedure inthisService Manual. Before replacing

the traverse unit, remove the short pinfor preventingstatic

electricityand install anew unit. Connect the connector as soon

as possible.

3. The flexiblecablemaybe cut off ifan excessive force isapplied to

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