Panasonic TH-50PF30U Manual de usuario

Unauthorized copying and distribution is a violation

of law.

Order Number MTNC110670CE

B34 Canada: B62

High Definition Plasma Display

Model No. TH-50PF30U

GPF14DMON Chassis

TABLE OF CONTENTS PAGE PAGE

1 Safety Precautions----------------------------------------------- 3

1.1. General Guidelines---------------------------------------- 3

2 Warning-------------------------------------------------------------- 4

2.1. Prevention of Electrostatic Discharge (ESD)

to Electrostatically Sensitive (ES) Devices---------- 4

2.2. About lead free solder (PbF)---------------------------- 5

3 Service Navigation----------------------------------------------- 6

3.1. Service Hint------------------------------------------------- 6

3.2. Applicable signals ----------------------------------------- 7

4 Specifications ----------------------------------------------------- 9

5 Operating Instructions-----------------------------------------10

6 Service Mode -----------------------------------------------------12

6.1. CAT (Computer Aided Test) mode -------------------12

6.2. IIC mode structure (following items value is

sample data)-----------------------------------------------16

7 Troubleshooting Guide----------------------------------------17

7.1. Self Check--------------------------------------------------17

7.2. No Power---------------------------------------------------20

7.3. No Picture --------------------------------------------------20

7.4. Local screen failure-------------------------------------- 21

8 Disassembly and Assembly Instructions--------------- 22

8.1. Removal of Rear Cover --------------------------------22

8.2. Removal of Slot Block ---------------------------------- 22

8.3. Removal of DS-Board----------------------------------- 22

8.4. Removal of D-Board------------------------------------- 22

8.5. Removal of HX-Board----------------------------------- 22

8.6. Removal of A-Board------------------------------------- 23

8.7. Removal of Fan-------------------------------------------23

8.8. Removal of P-Board------------------------------------- 24

8.9. Removal of AC Inlet Assy------------------------------ 24

8.10. Removal of H3-Board Block---------------------------25

8.11. Removal of SU-Board and SD-Board--------------- 25

8.12. Removal of SC-Board----------------------------------- 25

8.13. Removal of SS-Board----------------------------------- 26

8.14. Removal of C1-Board----------------------------------- 26

8.15. Removal of C2-Board----------------------------------- 26

8.16. Removal of C3-Board----------------------------------- 27

8.17. Removal of S1-Board----------------------------------- 27

TH-50PF30U

8.18. Removal of Front Glass, V1, V2-Board and

Cabinet Assy ----------------------------------------------27

8.19. Removal of Plasma Display Panel-------------------29

9 Measurements and Adjustments --------------------------33

9.1. Adjustment-------------------------------------------------33

9.2. Adjustment-------------------------------------------------34

10 Block Diagram ---------------------------------------------------39

10.1. Main Block Diagram ------------------------------------39

10.2. Block (1 of 5) Diagram----------------------------------40

10.3. Block (2 of 5) Diagram----------------------------------41

10.4. Block (3 of 5) Diagram----------------------------------42

10.5. Block (4 of 5) Diagram----------------------------------43

10.6. Block (4 of 5) Diagram----------------------------------44

11 Wiring Connection Diagram---------------------------------45

11.1. Wiring (1)---------------------------------------------------45

11.2. Wiring (2)---------------------------------------------------46

11.3. Wiring (3)---------------------------------------------------47

12 Schematic Diagram---------------------------------------------48

13 Printed Circuit Board ------------------------------------------48

14 Exploded View and Replacement Parts List-----------48

14.1. Exploded View--------------------------------------------48

14.2. Electrical Replacement Parts List--------------------48

TH-50PF30U

1 Safety Precautions

1.1. General Guidelines

1. When conducting repairs and servicing, do not attempt to modify the equipment, its parts or its materials.

2. When wiring units (with cables, flexible cables or lead wires) are supplied as repair parts and only one wire or some of the

wires have been broken or disconnected, do not attempt to repair or re-wire the units. Replace the entire wiring unit instead.

3. When conducting repairs and servicing, do not twist the Fasten connectors but plug them straight in or unplug them straight

out.

4. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or

damaged by the short circuit.

5. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly

installed.

6. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.

1.1.1. Leakage Current Cold Check

1. Unplug the AC cord and connect a jumper between the

two prongs on the plug.

2. Measure the resistance value, with an ohmmeter,

between the jumpered AC plug and each exposed metal-

lic cabinet part on the equipment such as screwheads,

connectors, control shafts, etc. When the exposed metal-

lic part has a return path to the chassis, the reading

should be between 1Mohm and 5.2Mohm.

When the exposed metal does not have a return path to

the chassis, the reading must be .

Figure 1

1.1.2. Leakage Current Hot Check (See

Figure 1 .)

1. Plug the AC cord directly into the AC outlet. Do not use

an isolation transformer for this check.

2. Connect a 1.5kohm, 10 watts resistor, in parallel with a

0.15µF capacitors, between each exposed metallic part

on the set and a good earth ground such as a water pipe,

as shown in Figure 1 .

3. Use an AC voltmeter, with 1000 ohms/volt or more sensi-

tivity, to measure the potential across the resistor.

4. Check each exposed metallic part, and measure the volt-

age at each point.

5. Reverse the AC plug in the AC outlet and repeat each of

the above measurements.

6. The potential at any point should not exceed 0.75 volts

RMS. A leakage current tester (Simpson Model 229 or

equivalent) may be used to make the hot checks, leakage

current must not exceed 1/2 milliamp. In case a mea-

surement is outside of the limits specified, there is a pos-

sibility of a shock hazard, and the equipment should be

repaired and rechecked before it is returned to the cus-

tomer.

TH-50PF30U

2 Warning

2.1. Prevention of Electrostatic Discharge (ESD) to Electrostatically Sensi-

tive (ES) Devices

Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Elec-

trostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and

semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage

caused by electrostatic discharge (ESD).

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your

body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,

which should be removed for potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alumi-

num foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static solder removal device. Some solder removal devices not classified as “anti-static (ESD protected)” can

generate electrical charge sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most

replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or compara-

ble conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material

to the chassis or circuit assembly into which the device will be installed.

Caution

Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise ham less motion such as the brush-

ing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient

to damage an ES device).

TH-50PF30U

2.2. About lead free solder (PbF)

Note: Lead is listed as (Pb) in the periodic table of elements.

In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.

The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).

That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.

This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d

suggest the use of Pb free solder as well, although Pb solder may be used.

PCBs manufactured using lead free solder will have the PbF within a leaf Symbol PbF stamped on the back of PCB.

Caution

• Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher. Please

use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).

• Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).

If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb sol-

der. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.

• After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto the

opposite side. (see figure below)

Suggested Pb free solder

There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder. How-

ever, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.

TH-50PF30U

3 Service Navigation

3.1. Service Hint

Board Name Function Board Name Function

A Digital Signal Processor, Microcomputer

Audio Processor, Speaker Out Amplifier C2 Data drive (Center)

C3 Data drive (Left)

DS Slot Interface S1 Power switch

D Format Converter, Plasma AI Processor

Sub-Field Processor, Sync Processor V1 Remote receiver, LED-G, R

V2 Key switch

SC Scan drive P Power supply

SU Scan out (Upper)

Non serviceable.

SU-Board should be exchanged for service.

V1 Remote receiver, LED-G, R

SD Scan out (Lower)

Non serviceable.

SD-Board should be exchanged for service.

Key switch

SS Sustain drive, Sustain out H3 Speaker terminal

C1 Data drive (Right) HX PC / RS-232C_Input terminal, 3D Signal out, Speaker

terminal (L)

TH-50PF30U

3.2. Applicable signals

TH-50PF30U

4 Specifications

Power Source 110 - 127 V AC, 50/60 Hz

Power Consumption

Rated Power Consumption 475 W

Stand-by condition Save OFF 0.7 W, Save ON 0.4 W

Power off condition 0.2 W

Plasma Display panel Drive method: AC type 50-inch,

16:9 aspect ratio

Screen size 43.5 inch (1,105 mm) (W) ×24.4 inch (622 mm) (H) ×49.9 inch (1,268 mm) (diagonal)

(No. of pixels) 2,073,600 (1,920 (W) ×1,080 (H)) [5,760 ×1,080 dots]

Operating condition

Temperature 32 °F - 104 °F (0 °C - 40 °C)

Humidity 20 % - 80 %

Applicable signals

Color System NTSC, PAL, PAL60, SECAM, Modified NTSC

Scanning format 525 (480) / 60i 60p, 625 (575) / 50i 50p, 750 (720) / 60p 50p, 1125 (1080) /

60i 60p 50i 50p 24p 25p 30p 24sF, 1250 (1080) / 50i

PC signals VGA, SVGA, XGA, SXGA

UXGA ..... (compressed)

Horizontal scanning frequency 15 - 110 kHz

Vertical scanning frequency 48 - 120 Hz

Connection terminals

LAN RJ45 10BASE-T/100BASE-TX, compatible with PJLinkTM

AV IN VIDEO BNC 1.0 Vp-p (75-ohm)

AUDIO L-R RCA Pin jack ×2 0.5 Vrms

HDMI TYPE A Connector

COMPONENT / RGB IN

Y / G BNC with sync 1.0 Vp-p (75-ohm)

PB/CB/B BNC 0.7 Vp-p (75-ohm)

PR/CR/R BNC 0.7 Vp-p (75-ohm)

AUDIO L-R RCA PIN JACK ×2 0.5 Vrms

DVI-D IN DVI-D 24 Pin Compliance with DVI Revision 1.0

Content Protection Compatible with HDCP 1.1

AUDIO Stereo mini jack (M3) ×1 0.5 Vrms, Shared with PC IN

PC IN High-Density Mini D-sub 15 Pin Y or G with sync 1.0 Vp-p (75-ohm)

Y or G without sync 0.7 Vp-p (75-ohm)

PB/ CB/ B:0.7 Vp-p (75-ohm)

PR/ CR/ R:0.7 Vp-p (75-ohm)

HD / VD:1.0 - 5.0 Vp-p (high impedance)

AUDIO Stereo mini jack (M3) ×1 0.5 Vrms, Shared with DVI-D IN

SERIAL External Control Terminal

D-sub 9 Pin RS-232C compatible

3D IR TRANSMITTER for 3D IR TRANSMITTER

3D SHUT-

TER OUT M3 jack ×1

DC 8V OUT Center plus, for EIAJ 4mm plug

EXT SP Speaker Terminal 6-ohm, 16 W [8 W + 8 W] (10 % THD)

Accessories Supplied

Remote Control Transmitter N2QAYB000535

Batteries AA Size ×2

Clamper TMME289 ×1

Dimensions (W ×H ×D) 47.7 inch (1,210 mm) ×28.5 inch (724 mm) ×3.5 inch (89 mm)

Mass (weight)

main unit only approx. 72.8 lbs

with speakers approx. 83.8 lbs

Note:

• Design and specifications are subject to change without notice. Mass and dimensions shown are approximate.

TH-50PF30U

5 Operating Instructions

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