Panasonic CT-27SL13MUG Manual de usuario

MTNC030943A1

B05

Color Television

CT-27SL13MG / CT-27SL13MUG / CT-27SL33MG / CT-

27SL33MUG

NA10

Thissimplified service manual isissued to add listed modelsto the

simplified service manual order No. MTNC030733A1(CT-27SL33G).

Modelsincluded inthissimplified service manual are identical to the

versions included on simplified service manualorder No.

MTNC030733A1(CT-27SL33G)except for the differences included in

thissimplied service manual. Adifference parts list and unique

schematics to these modelsare included inthissimplified service

manual. Please fileand use thissimplifiedservice manual together

with the simplified service manual order No. MTNC030733A1(CT-

27SL33G).

rights reserved. Unauthorized copying and distribution isa

violation of law.

1. Safety precautions

General guidelines

Anisolation transformershouldalways be usedduring the servicing of a receiverwhose

chassis is not isolatedfromAC powerline. Use a transformerof adequate powerrating as this

protects the technicianfromaccidents resulting inpersonal injuryfromelectrical shocks. It will

alsoprotect the receiverfrombeing damagedbyaccidental shorting that mayoccurduring

servicing.

Whenservicing, observe the original leaddress, especiallyinthe high voltage circuit. Replace

all damagedparts (alsoparts that showsigns of overheating.)

Always replace protective devices, suchas fishpaper, isolation resistors and capacitors, and

shields afterservicing the receiver. Use onlymanufacturer’s recommendedrating forfuses,

circuits breakers, etc.

High potentials are present whenthis receiveris operating. Operation of the receiverwithout

the rearcoverintroduces dangerforelectrical shock. Servicing shouldnot be performedby

anyone who is not thoroughlyfamiliarwiththe necessaryprecautionswhenservicing high

voltage equipment.

Extreme care shouldbe practicedwhenhandling the picture tube. Rough handling maycause it

toimplode due toatmospheric pressure. (14.7 lbs persq. in.). Donot nick orscratchthe glass

orsubject it toanyundue pressure. Whenhandling, usesafetygoggles and heavygloves for

protection. Discharge the picture tube byshorting the anode tochassis ground (not tothe

cabinet ortoothermounting hardware). Whendischarging connect coldground (i.e. dag

ground lead) tothe anode witha wellinsulatedwire oruse a grounding probe.Avoidprolonged

exposure at close range tounshieldedareas of the picture tube toprevent exposure tox ray

radiation.

The test picture tube usedforservicing the chassis at the benchshouldincorporate safety

glass and magnetic shielding. The safetyglass provide shielding forthe tube viewing area

against x rayradiation as well as implosion. The magnetic shieldlimits the x rayradiation

around the bell of the picture tube inaddition tothe restricting magnetic effects. Whenusing a

picture tube test jigforservice, ensure that the jigis capable of handling 50kV without causing

x rayradiation.

Before returning a servicedreceivertothe owner, the service technicianmust thoroughlytest

the unit toensure that is completelysafe tooperate. Donot use a line isolation transformer

whentesting.

Leakage current coldcheck

Unplug the A.C. cordand connect a jumperbetweenthe twoplug prongs.Measure the

resistance betweenthe jumperedAC plug and expose metallic parts suchas screwheads,

antenna terminals, control shafts, etc. If the exposedmetallic part has a returnpathtothe

chassis, the reading shouldbe between240k and 5.2M . If the exposedmetallic part does

not have a returnpathtothe chassis, the reading shouldbe infinite.

Leakage current hot check

Plug the AC corddirectlyintothe AC outlet. Donot use anisolation transformerduring the

check.

Connect a 1.5k 10 watt resistorinparallel witha 0.15 Fcapacitorbetweenanexposed

metallic part and ground. Use earthground, forexample a waterpipe.

Using a DVM witha 1000 ohms/volt sensitivityorhigher, measure the AC potential across the

resistor.

Repeat the procedure and measure the voltage present withall otherexposedmetallic parts.

Verifythat anypotential does not exceed0.75 volt RMS. A leakage current tester(sucha

Simpson model 229, Sencore model PR57 orequivalent) maybe usedinthe above procedure, in

whichcase anycurrent measure must not exceed0.5 milliamp. Ifanymeasurement is out of the

specifiedlimits, there is a possibilityof a shock hazardand the receivermust be repairedand

recheckedbefore it is returnedtothe customer.

Hot check circuit

Insulation test

Connect aninsulation testerbetweenanexposedmetallic part and A.C. line. Apply1080VAC/

60Hz for1 second. Confirm that the current measurement is 0.5mA ~ 2.0mA. Repeat test with

othermetallic exposedparts.

X rayradiation

WARNING

The potential source of x rayradiation inthe TV set is inthe high voltage section and the picture

tube.

NOTE

It is important touse anaccurate, calibratedhigh voltage meter.

Set the brightness, picture, sharpness and colorcontrols tominimum.

Measure the high voltage. The high voltage shouldbe 30.55 ± 1.25kV. If the upperlimit is out of

tolerance, immediate service and correction is requiredtoinsure safe operation and toprevent

the possibilityof premature component failure.

Horizontal oscillatordisable circuit test

This test must be performedas a final check before the receiveris returnedtothe customer.

See horizontal oscillatordisable circuit procedure check inthis manual.

2. Service notes

NOTE

These components are affixedwithglue. Be careful not tobreak ordamage anyfoil underthe

component orat the pins of the ICs whenremoving. Usuallyapplying heat tothe component for

a short time while twisting withtweezers will break the component loose.

Leadless chipcomponent (surface mount)

Chipcomponents must be replacedwithidentical chips due tocritical foil track spacing. There

are no holes inthe boardtomount standardtransistors ordiodes. Some chips capacitoror

resistorboardsolderpads mayhave holes through the board,howeverthe hole diameterlimits

standardresistorreplacement to1/8 watt. Standardcapacitormayalsobe limitedforthe same

reason. It is recommendedthat identical components be used.

Chipresistorhave a three digit numerical resistance code, 1st and 2nd significant digits and a

multiplier. Example: 162 = 1600 or1.6k resistor, 0 = 0 (jumper).

Chipcapacitors generallydo not have the value indicatedon the capacitor. The colorof the

component indicates the general range of the capacitance.

Chiptransistors are identifiedbya twolettercode. The first letterindicates the type and the

second letter, the grade of transistor.

Chipdiodes have a twoletteridentification code as perthe code chart and are a dual diode pack

witheithercommon anode orcommon cathode. Check the parts list forcorrect diode number.

Component removal

1. Use solder wick to remove solder from component end caps or

terminal.

2. Without pulling up, carefullytwist the component with tweezers to

break the adhesive.

3. Donot reuse removed leadless or chipcomponents since they

are subject to stress fracture during removal.

Chipcomponent installation

1. Put asmall amount of solder on the board soldering pads.

2. Holdthe chipcomponent against the soldering pads with

tweezers or with aminiature alligator clipand applyheat to the

pad area with a30 watt iron until solder flows. Donot applyheat

for more than 3seconds.

Howtoreplace flat IC (requiredtools)

1. Remove the solder from all of the pins of aFlat ICbyusing a

desolder braid

2. Put the iron wire under the pins of the Flat ICand pull itinthe

direction indicated whileheating the pins using asoldering iron.

Asmall awl can be used instead of the iron wire.

3. Remove the solder from all the pads of the Flat ICbyusing ade

solder braid

4. Position the new Flat ICinplace (applythe pins of the Flat ICto

the soldering pads where the pins need to be soldered). Properly

determine the positions of the soldering pads and pins by

correctlyaligning the polaritysymbol

5. Solder all pins to the soldering pads using afine tipped soldering

iron

6. Check with amagnifier for solder bridge between the pins or for

dryjoint between pins and soldering pads. To remove asolder

bridge, use ade solder braidas showninthe figure below

IMPORTANT

To protect against possible damage tothe solidstate devices due toarching orstatic discharge,

make certainthat all ground wires and CRTDAG wire are securelyconnected.

CAUTION

The power supplycircuitisabove earth ground and the chassis

cannot be polarized. Use an isolation transformer when servicing

the receiver to avoiddamage to the test equipment or to the

chassis. Connect the test equipment to the proper ground(hot) or

(cold) when servicing, or incorrect voltages will be measured.

2.1. X-RayProtection CircuitCheck &Adjustments

This test must be performedas final check before the receiveris returnedtothe customer. If

voltages are out of tolerance, immediate service and correction is requiredtoinsure safe

operation and toprevent the possibilityof premature componentfailure.

Equipment:

1. Isolation transformer.

2. High voltage meter.

3. D.C. Ammeter

4. Short jumper.

5. HHSjig(See figure below).

Diode Connection Jumper.

Preparation:

1. Make sure the receiver isturned off.

2. Connect the receiver to an isolation transformer.

3. Connect the ammeter serial from the flyback anode lead to the

picture tube anode socket.

4. Prepare short jumper and HHSjig.

Procedure:

1. Connect the short jumper between TPD16 &TPD17.

2. Connect the jumper diode between TPD14 and TPD15 (anode

connected to TPD15 and cathode to TPD14).

3. Apply75VAC to AC input of isolation transformer.

4. Turn the receiver on.

5. Applyamonoscope pattern.

6. Set customer picture and brightness controlsto the minimum.

7. Set current within50 Ato 100 Abychanging the picture and

bright controls.

8. Slowlyincrease AC voltage at the input of the isolation

transformer and confirm HHSvoltage measure 34.5kV.

9. Turn power off and remove jigs.

3. EEPROM replacement

If a newEEPROM integratedcircuit is replacedforservicing, followthe next procedure once

that the memoryis properlyassembled:

1. Enter to service mode.

2. Turn the TV set ON.

3. Once inside service mode the first image that appears on-screen

isthe ID1register with the respective address value (FF) like the

image below.

Note:

All 3registers (ID1,ID2,ID3) shouldappear with FF values ifanew

EEPROMisassembled.

4. With “VOL” keysadjust the correct value according with the

service adjustment table(see “Service Mode” section).

5. Change to the next IDswitch register with “CH”keysand repeat

the same procedure as step 4.

6. When replacing anew EEPROMbe sure to set the correct ID

switch values for each model.

7. Once that all 3registers are set with the correct address value,

perform all of the remaining adjustments and servicing.

IMPORTANT:

Correct IDswitch configuration shouldbe input when replacing

EEPROMfor each television model, otherwise ifwrong values are

configured, the television software will not function accordingly

and properly.

4. About lead free solder (PbF)

NOTE

Leadis listedas (Pb) inthe periodic table of elements. / Inthe information below, Pbwill referto

leadsolder, and PbF will refertoLeadFree Solder. / The leadfree solderusedinour

manufacturing process and discussedbelowis (Sn+Ag+Cu). / Thatis Tin(Sn), Silver(Ag) and

Copper(Cu) although othertypes are available.

This model uses PbFree solderinit’s manufacture due toenvironmental conservation issues.

For/ service and repairwork, we’dsuggest the use of Pbfree solderas well, although Pbsolder

maybe / used. / PCBs manufacturedusing leadfree solderwill have the “PbF” ora leaf symbol

stampedon the / back of PCB.

CAUTION

-Pb free solder has ahigher melting point than standard solder.

Typicallythe melting point is50 ~ 70 °F (30 ~ 40 °C)higher. Please

use ahigh temperature soldering iron and set itto 700 ± 20 °F (370

± 10 °C).

-Pb free solder will tend to splash when heated too high (about 1100

°F or 600 °C). / Ifyou must use Pb solder, please completely

remove all of the Pb free solder on the pins or solder area before

applying Pb solder. Ifthisisnot practical, be sure to heat the Pb

free solder until itmelts, before applying Pb solder.

-After applying PbF solder to doublelayered boards, please check

the component side for excess solder which mayflow onto the

opposite side.

SuggestedPbfree solder

There are several kinds of Pbfree solderavailable forpurchase. This product uses Sn+Ag+Cu

(tin, silver, copper) solder. However, Sn+Cu(tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder

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