Panasonic TH-103VX200W Manual de usuario

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of law.

Order Number ITD1012166CE

High Definition Plasma Display

Model No. TH-103VX200W

GPF13DMONV Chassis

TABLE OF CONTENTS

PAGE PAGE

1 Safety Precautions----------------------------------------------- 3

1.1. General Guidelines---------------------------------------- 3

1.2. Touch-Current Check ------------------------------------- 3

2 Warning -------------------------------------------------------------- 4

2.1. Prevention of Electrostatic Discharge (ESD)

to Electrostatically Sensitive (ES) Devices---------- 4

2.2. About lead free solder (PbF)---------------------------- 5

3 Service Navigation ----------------------------------------------- 6

3.1. Service Hint ------------------------------------------------- 6

3.2. Applicable signals ----------------------------------------- 8

4 Specifications ----------------------------------------------------- 9

5 Operating Instructions-----------------------------------------10

6 Service Mode -----------------------------------------------------11

6.1. CAT (Computer Aided Test) mode -------------------11

6.2. IIC mode structure (following items value is

sample data) -----------------------------------------------15

7 Troubleshooting Guide ----------------------------------------16

7.1. Self Check--------------------------------------------------16

7.2. No Power ---------------------------------------------------18

7.3. No Picture-------------------------------------------------- 18

7.4. Local screen failure-------------------------------------- 19

8 Service Fixture & Tools --------------------------------------- 20

8.1. SC jig-------------------------------------------------------- 20

9 Disassembly and Assembly Instructions--------------- 21

9.1. Rear Cover and Board---------------------------------- 21

9.2. Location of Rear Cover screws----------------------- 22

9.3. Removal of Side Angle (L), (R) ----------------------- 24

9.4. Removal of HX-Board----------------------------------- 25

9.5. Removal of DS-Board ---------------------------------- 26

9.6. Removal of A-Board------------------------------------- 26

9.7. Removal of DN-Board ---------------------------------- 27

9.8. Removal of PB-Board----------------------------------- 27

9.9. Removal of D-Board------------------------------------- 27

9.10. Removal of P-Board (MAIN_1) ----------------------- 28

9.11. Removal of P-Board (MAIN_2) ----------------------- 28

9.12. Removal of P-Board (SUB)---------------------------- 28

9.13. Removal of S1-Board and V2-Board---------------- 29

9.14. Removal of SU-Board ---------------------------------- 29

TH-103VX200W

9.15. Removal of SM-Board ---------------------------------- 30

9.16. Removal of SD-Board ---------------------------------- 31

9.17. Removal of SC-Board----------------------------------- 32

9.18. Removal of SS2-Board -------------------------------- 33

9.19. Removal of SS3-Board -------------------------------- 33

9.20. Removal of SS-Board ----------------------------------- 34

9.21. Removal of Fan------------------------------------------- 34

9.22. Removal of C1-Board (upper) ------------------------ 35

9.23. Removal of C2-Board (upper) ------------------------ 36

9.24. Removal of C3-Board (upper) ------------------------ 36

9.25. Removal of C4-Board (upper) ------------------------ 37

9.26. Removal of C5-Board (upper) ------------------------ 37

9.27. Removal of C6-Board (upper) ------------------------ 37

9.28. Removal of C1-Board (lower) ------------------------- 37

9.29. Removal of C2-Board (lower) ------------------------- 38

9.30. Removal of C3-Board (lower) ------------------------- 38

9.31. Removal of C4-Board (lower) ------------------------- 39

9.32. Removal of C5-Board (lower) ------------------------- 39

9.33. Removal of C6-Board (lower) ------------------------- 39

9.34. Removal of AC Inlet ------------------------------------- 40

9.35. Removal of Front Glass, V1, V3, V-Board and

Cabinet Assy ---------------------------------------------- 40

9.36. Removal of Plasma Display Panel------------------- 44

10 Measurements and Adjustments -------------------------- 49

10.1. Adjustment Procedure ---------------------------------- 49

10.2. Adjustment------------------------------------------------- 54

11 Block Diagram --------------------------------------------------- 59

11.1. Diagram Notes ------------------------------------------- 59

11.2. Main Block (1 of 2) Diagram--------------------------- 60

11.3. Main Block (2 of 2) Diagram--------------------------- 61

11.4. Block (1 of 8) Diagram ---------------------------------- 62

11.5. Block (2 of 8) Diagram ---------------------------------- 63

11.6. Block (3 of 8) Diagram ---------------------------------- 64

11.7. Block (4 of 8) Diagram ---------------------------------- 65

11.8. Block (5 of 8) Diagram ---------------------------------- 66

11.9. Block (6 of 8) Diagram ---------------------------------- 67

11.10. Block (7 of 8) Diagram ---------------------------------- 68

11.11. Block (8 of 8) Diagram ---------------------------------- 69

12 Wiring Connection Diagram --------------------------------- 71

12.1. Wiring (1) --------------------------------------------------- 71

12.2. Wiring (2) --------------------------------------------------- 73

12.3. Wiring (3) --------------------------------------------------- 75

13 Exploded View and Replacement Parts List ----------- 76

TH-103VX200W

1 Safety Precautions

1.1. General Guidelines

1. When conducting repairs and servicing, do not attempt to modify the equipment, its parts or its materials.

2. When wiring units (with cables, flexible cables or lead wires) are supplied as repair parts and only one wire or some of the

wires have been broken or disconnected, do not attempt to repair or re-wire the units. Replace the entire wiring unit instead.

3. When conducting repairs and servicing, do not twist the Faston connectors but plug them straight in or unplug them straight

out.

4. When servicing, observe the original lead dress.If a short circuit is found, replace all parts which have been overheated or

damaged by the short circuit.

5. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly

installed.

6. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.

1.2. Touch-Current Check

1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.

2. Connect a measuring network for touch currents between each exposed metallic part on the set and a good earth ground

such as a water pipe, as shown in Figure 1.

3. Use Leakage Current Tester (Simpson 228 or equivalent) to measure the potential across the measuring network.

4. Check each exposed metallic part, and measure the voltage at each point.

5. Reserve the AC plug in the AC outlet and repeat each of the above measure.

6. The potential at any point (TOUGH CURRENT) expressed as voltage U1and U2, does not exceed the following values:

For a. c.: U1= 35 V (peak) and U2= 0.35 V (peak);

For d. c.: U1= 1.0 V,

Note:

The limit value of U2= 0.35 V (peak) for a. c. and U1= 1.0 V for d. c. correspond to the values 0.7 mA (peak) a. c. and 2.0

mA d. c.

The limit value U1= 35 V (peak) for a. c. correspond to the value 70 mA (peak) a. c. for frequencies greater than 100 kHz.

7. In case a measurement is out of the limits specified, there is a possibility of a shock hazard, and the equipment should be

repaired and rechecked before it is returned to the customer.

Figure 1

TH-103VX200W

2Warning

2.1. Prevention of Electrostatic Discharge (ESD) to Electrostatically Sensi-

tive (ES) Devices

Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Elec-

trostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and

semiconductor [chip] components. The following techniques should be used to help reduce the incidence of component damage

caused by electrostatic discharge (ESD).

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your

body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,

which should be removed for potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alumi-

num foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static solder removal device. Some solder removal devices not classified as [anti-static (ESD protected)] can

generate electrical charge sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most

replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or compara-

ble conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material

to the chassis or circuit assembly into which the device will be installed.

Caution

Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise ham less motion such as the brush-

ing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient

to damage an ES device).

TH-103VX200W

2.2. About lead free solder (PbF)

Note: Lead is listed as (Pb) in the periodic table of elements.

In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.

The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).

That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.

This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d

suggest the use of Pb free solder as well, although Pb solder may be used.

PCBs manufactured using lead free solder will have the PbF within a leaf Symbol PbF stamped on the back of PCB.

Caution

• Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher.

Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).

• Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).

If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb sol-

der. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.

• After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto the

opposite side. (see figure below)

Suggested Pb free solder

There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder. How-

ever, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.

TH-103VX200W

3 Service Navigation

3.1. Service Hint

TH-103VX200W

Board Name Function Board Name Function

A Digital Signal Processor, Microcomputer C1 (upper) Data drive (1) (upper)

DN 3D Digital Signal Processor, Microcomputer C2 (upper) Data drive (2) (upper)

D Format Converter, Plasma AI Processor

Sub-Field Processor

C3 (upper) Data drive (3) (upper)

C4 (upper) Data drive (4) (upper)

DS Slot Interface (Audio / Video / Sync Input Switch),

Sync Processor, Audio Processor, DC-DC Converter

C5 (upper) Data drive (5) (upper)

C6 (upper) Data drive (6) (upper)

SC Scan drive C1 (lower) Data drive (1) (lower)

SU Scan out (Upper) C2 (lower) Data drive (2) (lower)

SM Scan out (Middle) C3 (lower) Data drive (3) (lower)

SD Scan out (Lower) C4 (lower) Data drive (4) (lower)

SS Sustain drive C5 (lower) Data drive (5) (lower)

SS2 Sustain out (Upper) C6 (lower) Data drive (6) (lower)

SS3 Sustain out (Lower) P(MAIN_1) Power supply

V 3D Eyewear Transmitter P(MAIN_2) Power supply

V1 LED-G, R P(SUB) Power supply

V2 Key switch PB Fan Control

V3 Remote receiver HX PC / RS-232C

S1 Power switch

TH-103VX200W

3.2. Applicable signals

TH-103VX200W

4 Specifications

Power Source 200-240 V AC, 50/60Hz

Power Consumption

Power on 1450 W

Stand-by condition 0.5 W

Power off condition 0.3 W

Plasma Display panel Drive method: AC type 103-inch,

16:9 aspect ratio

Screen size 2,269 mm (W) ×1,276 mm (H) ×2,603 mm (diagonal)

(No. of pixels) 2,073,600 (1,920 (W) ×1,080 (H)) [5,760 ×1,080 dots]

Operating condition

Temperature 0 °C - 40 °C

Humidity 20 % - 80 %

Applicable signals

Colour System NTSC, PAL, PAL60, SECAM, Modified NTSC

Scanning format 525 (480) / 60i 60p, 625 (575) / 50i 50p, 750 (720) / 60p 50p, 1125 (1080) /

60i 60p 50i 50p 24p 25p 30p 24sF, 1250 (1080) / 50i

PC signals VGA, SVGA, XGA, SXGA

UXGA ..... (compressed)

Horizontal scanning frequency 15 - 110 kHz

Vertical scanning frequency 48 - 120 Hz

Connection terminals

LAN RJ45 10BASE-T/100BASE-TX, compatible with PJLinkTM

COMPONENT / RGB IN

Y / G (RCA Pin jack) with sync 1.0 Vp-p (75-ohm)

PB/CB/B (RCA Pin jack) 0.7 Vp-p (75-ohm)

PR/CR/R (RCA Pin jack) 0.7 Vp-p (75-ohm)

AUDIO L-R (RCA Pin jack ×2) 0.5 Vrms

PC IN (High-Density Mini D-sub 15 Pin) Y or G with sync 1.0 Vp-p (75-ohm)

Y or G without sync 0.7 Vp-p (75-ohm)

PB/ CB/ B: 0.7 Vp-p (75-ohm)

PR/ CR/ R: 0.7 Vp-p (75-ohm)

HD / VD: 1.0 - 5.0 Vp-p (high impedance)

VBS (use HD port) with picture 1.0 Vp-p (high impedance)

without picture 0.3 Vp-p (high impedance)

AUDIO (Stereo mini jack (M3) ×1) 0.5 Vrms

AV IN HDMI 1-4 (TYPE A Connector ×4)

HDMI (Version 1.4 with 3D)

SERIAL External Control Terminal (D-sub 9 Pin) RS-232C compatible

3D SHUTTER OUT (M3 jack ×1, for 3D IR TRANSMITTER)

AUDIO OUT L-R (RCA Pin jack ×2 (L / R))

Output level : Variable (- - 0 dB) [INPUT 1 kHz / 0dB, 10 k-ohm Load]

Accessories Supplied

Remote Control Transmitter N2QAYB000562

Batteries R6 (UM3) Size ×2

Fixing band TMME203 ×2

Dimensions (W ×H ×D) 2,412 mm ×1,419 mm ×129 mm (141 mm when including protruding portion of terminals)

Mass (weight) approx. 199.0 kg net

Notes:

• Design and specifications are subject to change without notice. Mass and dimensions shown are approximate.

• This equipment complies with the EMC standards listed below.

EN55022, EN55024, EN61000-3-2, EN61000-3-3.

TH-103VX200W

5 Operating Instructions

GPF13DMONV chassis series have special function and operation setting facility called Option Menu. This Option Menu is

useful for special function required customers. This should be set at the installation stage.

Option Menu for GPF13DMONV series

Option menus default setting Contents

Onscreen display On Enable/Disable to display input mode indication after power on and no signal

indication.

All Aspect Off Sets All Aspect mode (advanced aspect setting) or default aspect mode.

Auto Setup Manual Sets the operational mode of the automatic position adjustment in the POS./

SIZE memu.

Studio mode Off Switching functions in setting menus used for television studio applications.

3D Emitter INT Set the infrared transmitter for the 3D Eyewear.

Function button assign 1 3D settings Set the function to operate when the FUNCTION button 1 to 2 on the remote

control is pressed.

Function button assign 2 Signal

3D Safety Precautions On Set show/hide 3D Safety Precautions during power ON.

Memory lock Locks or unlocks saved profi les. Also for setting passwords.

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