Panasonic Viera TX-L42E30E Manual de usuario

Service Manual

LCD Television

TX-L42E30E

TX-LF42E30

TX-LR42E30

LA18 Chassis

Specifications

Power Source: 220-240V AC, 50 / 60Hz

Rated Power Consumption: 102W

Stand-by Power Consumption: 0.3W (Without monitor out recording)

14W (With monitor out recording)

Aerial Impedance: 75unbalanced, Coaxial Type

Receiving System: DVB-T (Digital Terrestrial Services (MPEG2 and MPEG4-AVC(H.264))

DVB-C (Digital cable services (MPEG2 and MPEG4-AVC(H.264))

PAL-I/H, B/G, D/K

SECAM B/G, D/K, L/L’

PAL-525/60 (AV only)

M.NTSC (AV only)

NTSC (AV only)

Receiving Chanels: VHF E2-E12 VHF H1-H2 ( ITALY )

VHF A-H ( ITALY ) UHF E21-E69

CATV (S01-S05) CATV S1-S10(M1-M10)

CATV S11-S20 (U1-U10) CATV S21-S41 (HYPERBAND)

VHF R1-R2 VHF R3-R5

VHF R6-R12

Aerial - Rear: VHF/UHF

Operating Conditions: Temperature: 0°C 35°C

Humidity: 20% 80% RH (non condensing)

Unauthorized copying and

distribution is a violation of law.

ORDER No. PCZ1102010CE

Intermediate Frequency:

Video/Audio

Video 38.9MHz, 33.9MHz

Audio 33.4MHz (B/G), 33.16MHz (A2)

33.05MHz (NICAM B/G, D/K, L)

32.4MHz (D/K), 32.66MHz (CZ STEREO)

40.4MHz (L’), 39.75MHz (L’NICAM)

Colour 34.47MHz (PAL)

34.5MHz, 34.65MHz (SECAM)

38.3MHz, 38.15MHz (SECAM L’)

Terminals:

AV1 IN Video (21 pin) 1V p-p 75

Audio (21 pin) 500mV rms 10k

RGB (21 pin) 0.7V p-p 75

AV1 OUT Video (21 pin) 1V p-p 75

Audio (21 pin) 500mV rms 1k

AV2 IN Video (RCAx1) 1V p-p 75

AUDIO IN Audio (RCAx2) 500mV rms 10k(used for HDMI4_AV2 audio IN)

COMPONENT Video (RCAx3) Y:1V p-p 75(including synchronization)

Pb, Pr: ±0.35V p-p 75

AUDIO IN Audio (RCAx2) 500mV rms 10k(used for HDMI1/2/3_Component Audio IN)

HDMI, HDMI2, HDMI3, HDMI4 Type A Connectors

HDMI 1/3/4 :HDMI (Version 1.4 with Content Type) Deep Colour

HDMI 2 :HDMI (Version 1.4 with Content Type, Audio Return Channel) Deep Colour

This TV supports “HDAVI Control 5” function.

AUDIO OUT Audio (RCAx2) 500mV rms 1k(high impedance)

DIGITAL AUDIO OUT PCM / Dolby digital / DTS, Fiber optic

USB 1/2/3 USB 2.0 DC 5V Max 500mA

PC HIGH-DENSITY D_SUB 15PIN R,G,B: 700mV p-p 75

HD,VD/TTL Level 2-5V p-p (high impedance)

ETHERNET RJ45, IEEE802.3 10BASE-T / 100BASE-TX

CARD SLOT E30E,LFE30 LRE30

SD CARD slot x1 SD CARD slot x1

Common interface (Complies with CI+)slot x1 Common interface slot x1

LCD screen: VVX42F115G00

1920 x 1080, 16:9

Visible Diagonal 1060mm

Audio Output: 20W (2 x 10W), 10% THD

Headphones: 3.5mm, 8Impedance

Accessories supplied : Remote Control 2 x R6 (UM3) Batteries

Dimensions:

Height: Width: Depth:

Including TV stand 646mm 1002mm 288mm

TV set only 611mm 1002mm 75mm

Mass:

Including TV stand 19.0kg

TV set only 15.5kg

Specifications are subject to change without notice.

Mass and dimensions shown are approximate.

This service information is designed for experienced repair technicians only and is not designed for use by the general public. It does not

contain warnings or cautions to advise non-technical individuals of potencial dangers in attempting to service a product. Products

powered by electricity should be serviced or repaired only by experienced professional technicians. Any attempt to service or repair the

product or products deal within this service information by anyone else could result in serious injury or death.

Warning

CONTENTS

SAFETY PRECAUTIONS ........................................... 4

GENERAL GUIDE LINES...................................... 4

TOUCH – CURRENT CHECK............................... 4

PREVENTION OF ELECTROSTATIC DISCHARGE

(ESD) TO ELECTROSTATICALLY SENSITIVE (ES)

DEVICES .................................................................... 5

ABOUT LEAD FREE SOLDER (PBF)......................... 6

SUGGESTED PB FREE SOLDER........................ 6

APPLICABLE SIGNALS.............................................. 7

SERVICE HINTS ........................................................ 8

CHASSIS BOARD LAYOUT ....................................... 9

LOCATION OF LEAD WIRING ................................... 9

TECHNICAL DESCRIPTION ................................….10

SPECIFICATION OF KEY FOR CI PLUS,

DTCP-IP, ONE-TO-ONE AND WIDEVINE .......... 10

GENERAL INFORMATION ................................. 10

REPLACEMENT OF ICS..................................... 10

MODEL AND KEYS ............................................ 10

SETTING INSPECTION............................................ 11

SELF CHECK ........................................................... 12

HOTEL MODE .......................................................... 17

DATA COPY BY SD CARD....................................... 18

DATA COPY FROM TV SET TO SD CARD ............. 19

DATA COPY FROM SD CARD TO TV SET ............. 20

OPTION BYTES DESCRIPTION .............................. 21

ADJUSTMENT METHOD.......................................... 22

WIRING DIAGRAM ................................................... 23

BLOCK DIAGRAM (1 OF 2)...................................... 24

PARTS LOCATION................................................... 26

REPLACEMENT PARTS LIST.................................. 28

SCHEMATIC DIAGRAMS ......................................... 39

A-BOARD (1 OF 18) SCHEMATIC DIAGRAM .... 40

P-BOARD (1 OF 2) SCHEMATIC DIAGRAM ...... 58

LD-BOARD (1 OF 2) SCHEMATIC DIAGRAM .... 60

KA-BOARD.......................................................... 62

CONDUCTOR VIEWS .............................................. 63

POWER LED BLINKING TIMING CHART ................ 13

SERVICE MODE FUNCTION ................................... 14

SERVICE ................................................................ 15

SERVICE TOOL MODE............................................ 16

Safety Precautions

General Guide Lines

1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated

or damaged by the short circuit.

2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly

installed.

3. After servicing, make the following touch current checks to prevent the customer from being exposed to shock hazards.

4. Always ensure cover label TBM4GU113 is correctly replaced before returning to customer (see Fig.1).

Touch-Current Check

1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.

2. Connect a measuring network for touch currents between each exposed metallic part on the set and a good earth

ground such as a water pipe, as shown in Fig. 2.

3. Use Leakage Current Tester (Simpson 228 or equivalent) to measure the potential across the measuring network.

4. Check each exposed metallic part, and measure the voltage at each point.

5. Reserve the AC plug in the AC outlet and repeat each of the above measure.

6. The potential at any point (TOUCH CURRENT) expressed as voltage U1 and U2, does not exceed the following values:

For a. c.: U1 = 35 V (peak) and U2 = 0.35 V (peak);

For d. c.: U1 = 1.0 V,

Note:

The limit value of U2 = 0.35 V (peak) for a. c. and U1 = 1.0 V for d. c. correspond to the values 0.7 mA (peak) a. c. and

2.0 mA d. c.

The limit value U1 = 35 V (peak) for a. c. correspond to the value 70 mA (peak) a. c. for frequencies greater than 100

kHz.

7. In case a measurement is out of the limits specified, there is a possibility of a shock hazard, and the equipment should

be repaired and rechecked before it is returned to the customer.

Fig. 2

APPLIANCES

EXPOSED

METAL PARTS

Resistance values in ohms ()

R0=500



RS=1500



CS=0.22



10k



0.022



COLD

WATER PIPE

(EARTH GROUND)

V: Voltmetr or oscilloscope

(r.m.s. or peak reading)

Measuring network for TOUCH CURRENTS

Input resistance: 





Input capacitance:200pF

Frequency range: 15Hz to 1MHz and d.c.respectively

NOTE – Appropriate measures should be taken to obtain the correct value in case of non-sinusoidal waveforms

U2(V)

Fig. 1

U1(V)

Prevention of Electrostatic Discharge (ESD) to Electrostatically

Sensitive (ES) Devices

Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are

called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect

transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of

component damage caused by electrostatic discharge (ESD).

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on

your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD

wrist strap, which should be removed for potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as

aluminum foil, to prevent electrostatic charge build up or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD

protected)" can generate electrical charge sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it.

(Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil

or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective

material to the chassis or circuit assembly into which the device will be installed.

Caution

Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the

brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity

(ESD) sufficient to damage an ES device).

There are special components used in this equipment which are important for safety.

These parts are marked by in schematic diagrams, exploded views and replacement parts list. It is essential that

these critical parts should be replaced with manufacturer’s specified parts to prevent shock, fire, or other hazards. Do

not modify the original design without permission of manufacturer.

IMPORTANT SAFETY NOTICE

About lead free solder (PbF)

Note: Lead is listed as (Pb) in the periodic table of elements.

In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.

The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).

That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.

This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work,

we’d suggest the use of Pb free solder as well, although Pb solder may be used.

PCBs manufactured using lead free solder will have the PbF within a leaf Symbol

stamped on the back of PCB.

Caution

Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40°C)

higher. Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).

Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).

If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before

applying Pb solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.

After applying PbF solder to double layered boards, please check the component side for excess solder which may

flow onto the opposite side. (see Fig.3)

Suggested Pb free solder

There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder.

However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used. (see Fig.4)

Fig.3

Fig.4

Applicable Signals

Applicable input signal for PC is basically compatible to VESA standard timing.

Signal name Horizontal frequency (kHz) Vertical frequency (Hz)

640 400 @70 Hz 31.47 70.07

640 480 @60 Hz 31.47 59.94

640 480 @75 Hz 37.50 75.00

800 600 @60 Hz 37.88 60.32

800 600 @75 Hz 46.88 75.00

800 600 @85 Hz 53.67 85.06

852 480 @60Hz 31.44 59.89

1,024 768 @60Hz 48.36 60.00

1,024 768 @70Hz 56.48 70.07

1,024 768 @75Hz 60.02 75.03

1,024 768 @85Hz 68.68 85.00

1,280 768 @60Hz 47.70 60.00

1,280 1,024 @60Hz 63.98 60.02

1,366 768 @60Hz 48.39 60.04

Macintosh 13“ (640 480) 35.00 66.67

Macintosh 16“ (832 624) 49.73 74.55

Macintosh 21“ (1,152 870) 68.68 75.06

Applicable input signal for PC is basically compatible to HDMI standard timing.

Signal name Horizontal frequency (kHz) Vertical frequency (Hz)

640 480 @60 Hz 31.47 60.00

750 (720) / 60p 45.00 60.00

1,125 (1,080) / 60p 67.50 60.00

Note:

Signals other than above may not be displayed properly.

The above signals are reformatted for optimal viewing on your display.

PC signal is magnified or compressed for display, so that it may not be possible to show fine detail

with sufficient clarity.

Signal name COMPONENT HDMI

525 (480) / 60i,60p * *

625 (576) / 50i, 50p * *

750 (720) / 60p, 50p * *

1,125 (1,080) / 60i, 50i * *

1,125 (1,080) / 60p *

1,125 (1,080) / 50p *

1,125 (1,080) / 24p *

PC (from D-sub 15P)

PC (from HDMI terminal)

Component (Y, Pb, Pr), HDMI

Service Hints

How to remove the backcover

Lay the main unit face down. (see Fig.5)

Remove the 4 fixing screws and the pedestal assembly. (see Fig.6)

Remove the 36 fixing screws, 4 caps and the backcover. (see Fig.7)

Fig.5

SCREWS

XYN4+F30FJK

Fig.6

Fig.7

(1) (1) (1) (1)

SCREWS

(1) XTB4+15JFJK /19pcs/

(2) THEJ0389 /15pcs/

(3) XTV3+10GFJK /2pcs/

(4) TKKL5521 /4pcs/

(1)

(1) (1) (1)

(1) (1) (1) (1)

(1)

(2)

(2) (2)

(2)

(2) (2)

(2)

(2) (2) (3) (3)

(4) (4)

Chassis Board Layout

Location of Lead Wiring

To find the Part Number of required wire in Replacement Parts List click on the wire name in red box.

Board Name Function

A-Board AV Terminal, HDMI, USB, Digital Audio Out, TV tuner, SD Card, CI slot, PC,

Ethernet, Peaks_LDA3, AV Switch, HDMI Switch, Speaker out,

EEPROM, Flash Memory, DDR SDRAM

KA-Board Remote Receiver, Power and Timer LED, C.A.T.S

P-Board Main Input, Power Supply, Key control, Power switch

LD-Board LED driver

P-BOARD

KA-BOARD

A-BOARD

LD-BOARD

A02

SP_L

A10

A12

KA10

A15

SP_R

LD2

A10-KA10 WIRE

P4-LD4 WIRE

A12-SPK WIRE

LD4

A02-P2 WIRE LVDS FFC

Technical Description

Specification of KEY for CI Plus, DTCP-IP, One-to-One and Widevine

General information:

1. EEPROM (IC8902) for spare parts has the seed of KEY for each.

2. The final KEY data will be generated by LDA3 IC (IC8000) when SELF CHECK was done and are stored in both LDA3 IC

(IC8000) and EEPROM (IC8902).

Three KEY are not generated for all models.

The necessary KEY are only generated and stored depend on the feature of models.

Replacement of ICs:

When LDA3 IC (IC8000) is replaced, EEPROM (IC8902) should be also replaced with new one the same time.

When EEPROM (IC8902) is replaced, LDA3 IC (IC8000) is not necessary to be replaced the same time.

After the replacement of IC, SELF CHECK should be done to generate the final KEY data.

How to SELF CHECK: While pressing [VOLUME ( - )] button on the main unit, press the STATUS button on the remote

control for more than 3 seconds.

TV will be forced to the factory shipment setting after this SELF CHECK.

Model and Keys:

Keys

Model No. CI PLUS DTCP-IP One-to-One

(for USB Rec.) Widevine

TX-L42E30E Yes Yes Yes Yes

TX-LF42E30 Yes Yes Yes Yes

TX-LR42E30 None None None Yes

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