Panasonic TX-R32LX80K Manual de usuario

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TX-R32LX80K

LH80 Chassis

LCD TV

Specifications

Power Source :

C SINGLE 220-240 V, 50/60 Hz

Power Consumption

Average Use 138 W

Standby condition 1.0 W

Display panel

Aspect Ratio 16:9

Visible screen size 698 mm (W) × 392 mm (H)

(No. of pixels) 1,049,088 (1,366 (W) × 768 (H))

Sound

Speaker Full range × 2 pcs, 8 Ω

Audio Output 20 W (10 W + 10 W), 10% THD

Headphones M3 (3.5 mm) Jack × 1

PC signals VGA, SVGA, XGA, WVGA, WXGA

Vertical scanning frequency 60 Hz

Receiving Systems / Band name SYSTEMS FUNCTIONS

———————————————————————————————————————

1PAL B, G, H

2PAL I Reception

of broadcast

transmission and

playback from

video cassette tape

recorders.

3PAL D, K

4SECAM B, G

5SECAM D, K

6SECAM K1

7NTSC M (NTSC 3.58 / 4.5 MHz)

———————————————————————————————————————

8NTSC 4.43 / 5.5 MHz Playback from

special VCR’s or DVD.

9NTSC 4.43 / 6.0 MHz

ORDER NO. MTV0801618CE

1 Safety Precautions 4

1.1. General Guidelines 4

1.2. Touch-Current Check 4

2 Prevention of Electro Static Discharge (ESD) to

Electrostatically Sensitive (ES) Devices 5

3 About Lead Free Solder (PbF) 6

4 Self Check Function 7

4.1. Self Check 7

4.2. Power LED Blinking Timing Chart 7

5 Chassis Board 8

5.1. Chassis Installation 8

6 Location of Lead Wiring 9

6.1. Wire Dressing 9

6.2. Wire Dressing and Connections 9

7 Disassembly for Service 10

7.1. AC Code dressing for 2-Pin 10

10 NTSC 4.43 / 6.5 MHz

11 NTSC 3.58 / 5.5 MHz Playback from

special VCR’s or DVD.

12 NTSC 3.58 / 6.0 MHz

13 NTSC 3.58 / 6.5 MHz

14 SECAM I

———————————————————————————————————————

15 PAL 60 Hz / 5.5 MHz Playback from

Special Disc Players

and Special VCR’s or DVD.

16 PAL 60 Hz / 6.0 MHz

17 PAL 60 Hz / 6.5 MHz

Aerial - Rear VHF / UHF

Operation Conditions Temperature : 0°C - 35°C

Humidity : 20% -- 80% RH (non-condensing)

Connection Terminals :

AV1 AUDIO L-R RCA PIN Type × 2 0.5 V[rms]

Input VIDEO RCA PIN Type × 1 1.0 V[p-p] (75 Ω)

AV2 AUDIO L-R RCA PIN Type × 2 0.5 V[rms]

Input VIDEO RCA PIN Type × 1 1.0 V[p-p] (75 Ω)

COMPONENT Y 1.0 V[p-p] (including synchronization)

PB/C

B,P

R/C

R±0.35 V[p-p]

AV3 AUDIO L-R RCA PIN Type × 2 0.5 V[rms]

Input VIDEO RCA PIN Type × 1 1.0 V[p-p] (75 Ω)

S VIDEO Mini DIN 4-pin Y: 1.0 V[p-p] (75 Ω) C: 0.286 V[p-p] (75 Ω)

Others HDMI 1/2 Input TYPE A Connectors

Audio Input for

HDMI 1 RCA PIN Type × 2 0.5 V[rms]

PC Input HIGH-DENSITY D-SUB 15 PIN R, G, B / 0.7 V[p-p] (75 Ω)

HD, VD / TTL LEVEL 2.0-5.0 V[rms] (high

impedance)

Monitor AUDIO L-R RCA PIN Type × 2 0.5 V[rms] (high impedance)

Output VIDEO RCA PIN Type × 1 1.0 V[p-p] (75Ω)

Dimensions (W × H × D) 820 mm × 578 mm × 225 mm (With TV Stand)

820 mm × 539 mm × 110 mm (TV only)

Mass 17 kg (Net)

Design and specifications are subject to change without notice. Mass and dimensions shown are approximate.

CONTENTS

Page Page

TX-R32LX80K

7.2. AC Code dressing for 3-Pin 10

7.3. Chassis Rail Installation 11

7.4. VESA Bracket Installation 12

7.5. Pedestal Assembly Preparation 13

7.6. LED Panel Installation 15

7.7. LCD Panel Assembly Installation 16

8 Service Mode Adjustment 17

8.1. SERVICE 1 17

8.2. SERVICE 2 17

8.3. Self Check Mode 17

8.4. Hotel Mode Adjustment 17

9 Adjustment 19

9.1. Voltage Chart of A Board 19

9.2. Voltage Chart of P board 19

9.3. DVCO Adjustment 19

10 Conductor Views 20

10.1. A-Board 20

10.2. A-Board 21

11 Schematic Diagram 22

11.1. Schematic Diagram Notes 22

11.2. A Board 23

11.3. G Board 33

11.4. K Board 35

11.5. P Board 36

11.6. SW Board 40

11.7. V Board 41

11.8. Z Board 45

12 Parts Location & Mechanical Replacement Parts List 49

12.1. Parts Location 49

13 Packing Exploded View 50

14 Replacement Parts List 51

14.1. Electrical Replacement Parts List 52

TX-R32LX80K

1 Safety Precautions

1.1. General Guidelines

1.When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or

damaged by the short circuit.

2.After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly

installed.

3.After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.

1.2. Touch-Current Check

1.Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.

2.Connect a measuring network for touch currents between each exposed metallic part on the set and a good earth ground such

as a water pipe as shown in Figure 1.

3.Use the Leakage Current Tester (Simpson 228 or equivalent) to measure the potential across the measuring network.

4.Check each exposed metallic part and measure the voltage at each point.

5.The potential at any point (touch current) expressed as voltage U1and U2, do not exceed the following values:

For AC: U1= 35 V (peak) and U2= 0.35 V (peak);

For DC: U1= 1.0 V,

NOTE :

The limit value of U2= 0.35 V (peak) for AC and U1= 1.0 V for DC correspond to the values 0.7 mA (peak) AC and 2.0 mA DC.

The limit value U1= 35 V (peak) for AC correspond to the value 70 mA (peak) AC for frequencies greater than 100 kHz.

6.Should a measurement be out of the limits specified, there is a possibility of a shock hazard, and the equipment should be

repaired and rechecked before it is returned to the customer.

TX-R32LX80K

2 Prevention of Electro Static Discharge (ESD) to

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are

called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-

effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the

incidence of component damage caused by electro static discharge (ESD).

1.Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your

body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,

which should be removed for potential shock reasons prior to applying power to the unit under test.

2.After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as

aluminium foil to prevent electrostatic charge buildup or exposure of the assembly.

3.Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4.Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can

generate electrical charges sufficient to damage ES devices.

5.Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6.Do not remove a replacement ES device from its protective package until immediately before you are ready to install it (most

replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminium foil or

comparable conductive material).

7.Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material

to the chassis or circuit assembly into which the device will be installed.

Caution:

Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8.Minimize bodily motions when handling unpackaged replacement ES devices (otherwise harmless motions such as the

brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD)

sufficient to damage an ES device).

TX-R32LX80K

3 About Lead Free Solder (PbF)

Note: Lead is listed as (Pb) in the periodic table of elements.

In the information below, Pb will refer to Lead Solder and PbF will refer to Lead Free Solder.

The Lead Free Solder (PbF) used in our manufacturing process and discussed below is (Sn+Ag+Cu).

Those are Tin (Sn), Silver (Ag) and Copper (Cu), although other types are available.

This model uses PbF in its manufacture due to environmental conservation issues. For service and repair work, we would suggest

the use of PbF as well, although Pb may be used.

PCBs manufactured using lead-free will have the “PbF within a leaf Symbol” stamped on their back.

Caution

• PbF has a higher melting point than that of standard solder. Typically the melting point is 50 ~ 70°F (30~40°C) higher.

Please use a high temperature soldering iron and set it to 700 20°F (370 10°C).

• PbF will tend to splash when heated too high (about 1100°F or 600°C).

If you must use Pb solder, please completely remove all of the PbF on the pins or solder area before applying Pb. If this is

not practical, be sure to heat the PbF until it melts, before applying Pb.

• After applying PbF to double layered boards, please check the component side for excess solder which may flow onto the

opposite side (see Figure 2).

Figure 2

Suggested PbF

There are several kinds of PbF available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder. However,

Sn+Cu (tin, copper) and Sn+Zn+Bi (tin, zinc, bismuth) solders can also be used.

Figure 3

TX-R32LX80K

4 Self Check Function

4.1. Self Check

1.Self Check is used to automatically check the bus lines and hexadecimal codes of the TV set.

2.To get into the Self Check mode, press the “DOWN” button on the customer’s controls at the front of the set, at the same time

pressing the “MENU” button on the remote control. The screen that will show is represented by Figure 4.

3.Press both “OFF TIMER” button on the remote control and “DOWN” key button on the control panel.

Figure 4

4.2. Power LED Blinking Timing Chart

1.Subject

Information of LED blinking timing chart.

2.Contents

When an abnormality occurs, the protection circuit will operate and reset the unit to stand by mode. During this time, the

defective block can be identified by the number of blinking times of the Power LED on the front panel of the unit as follow:

Blinking times Contents Check Point

2 INVERTER - SOS FPGA 6pin

5 24V down VCTP 106pin

6 SUB 8V down VCTP 1pin

7 3.3V Voltage down VCTP 160pin

8 FPGA down VCTP 105pin

TX-R32LX80K

5 Chassis Board

5.1. Chassis Installation

1.Fix 12 screws to ‘A-board’ and ‘P-board’.

Tightening torque should be 50 Ncm to 80 Ncm (5 kgf cm to 8 kgf cm).

2.Fix connectors G1, G2 and G3 to AT G-board.

3.Fix 2 screws to the side of AV bracket assembly.

Tightening torque should be 100 Ncm to 130 Ncm (10 kgf cm to 13 kgf cm).

4.Fix 1 screw to cabinet with power switch PCB bracket.

Tightening torque should be 100 Ncm to 130 Ncm (10 kgf cm to 13 kgf cm).

TX-R32LX80K

6 Location of Lead Wiring

6.1. Wire Dressing

= FELT-TMK4G215 = 7 pcs

6.2. Wire Dressing and Connections

CONNECTION 1234567891011

1CN 2 ~ P 2

2A2~P4

3A1~P3

4CN 2 ~ A 6

5G1~A4

6G2~A5

7V1~A7

8A 12 ~ SPEAKER (L)

9A 12 ~ SPEAKER (R)

10 P1~SW2

TX-R32LX80K

7 Disassembly for Service

7.1. AC Code dressing for 2-Pin

7.2. AC Code dressing for 3-Pin

TX-R32LX80K

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