Panasonic TX-22LT2F Manual de usuario

22lt2f.html
Table Of Contents 
COVER 
1 Safety Precautions 
1.1 General Guidelines 
1.2 Touch-Current Check 
2 Prevention of Electro Static Discharge (ESD) to Electrostatically Sensitive (ES) Devices 
3 About lead free solder (PbF) 
4 Self Check 
5 Chasis Board Layout 
6 Servicing method 
6.1 Removing tilt base 
6.2 Removing rear panel 
6.3 Removing speaker unit 
6.4 Removing chassis 
6.5 Removing A-Board 
6.6 Removing B-Board (with tuner assembly) 
6.7 Removing DG-Board 
6.8 Removing H1-Board and H2-Board 
6.9 Removing P1-Board 
6.10 Removing P2-Board 
6.11 Removing K-Board 
6.12 Removing V-Board 
6.13 A-Board servicing 
7 Service Mode Function 
7.1 How to enter SERVICE 1 
7.2 How to enter SERVICE 2 
7.3 Option Description 
8 Conductor Views 
8.1 A-Board 
8.2 B, H1, H2, K, P1 and P2-Board 
8.3 DG-Board 
9 Block and Schematic Diagrams 
9.1 Schematic Diagram Notes 
9.2 Power Block Diagram 
9.3 Signal Block Diagram 
9.4 Interconnection Schematic Diagram 
9.5 A-Board (1 of 7) and H1-Board Schematic Diagram 
9.6 A-Board (2 of 7) and H2-Board Schematic Diagram 
9.7 A-Board (3 of 7) Schematic Diagram 
9.8 A-Board (4 of 7), B-Board, K-Board and V-Board Schematic Diagram 
9.9 A-Board (5 of 7), P1-Board and P2-Board Schematic Diagram 
9.10 A-Board (6 of 7) and P1-Board Schematic Diagram 
9.11 A-Board (7 of 7) Schematic Diagram 
9.12 DG-Board (1 of 7) Schematic Diagram 
9.13 DG-Board (2 of 7) Schematic Diagram 
9.14 DG-Board (3 of 7) Schematic Diagram 
9.15 DG-Board (4 of 7) Schematic Diagram 
9.16 DG-Board (5 of 7) Schematic Diagram 
9.17 DG-Board (6 of 7) Schematic Diagram 
9.18 DG-Board (7 of 7) Schematic Diagram 
10 Parts Location & Mechanical Replacement Parts List 
Service Manual
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ORDER NO. ITD0203006C2
22” Diagonal LCD TV 
●TX-22LT2F
LH4 Chassis
Specifications
Power Source 
 AC 100~240V, 50/ 60Hz 
Power Consumption 
 Average use: 67W 
 Stand-by condition: 5W 
 TV set: DC 15V, 4.1 A max. 
LCD 
 22-inch(558mm), 16:9 aspect ratio LCD panel 
Screen Size 
 19.17-inch (486.7mm)(W) x 10.77-inch (273.6mm)(H) x 
22-inch (558mm)(Diagonal) 
Sound 
 Speaker 
 Tweeter (4 x 7cm 2pcs, 8Ω), Woofer (Ø 5cm 2pcs, 4Ω) 
 Audio Output 
 9W (2.5W+ 2.5W+ 4.0W (Woofer)), 10% THD 
 Headphones 
 M3(3.5 mm) Jack x 1 8Ωimpedance 
FEATURES 
 Aero-Hammer ® Double Woofer System (2Way 4Speaker System) 
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10.1 Parts Location

10.2 Packing Exploded View

10.3 Mechanical Replacement Parts List

11 Replacement Parts List

11.1 Replacement Parts List Notes

11.2 Electrical Replacement Parts List

12 Schematic Diagram for printing with A4 size

Receiving Systems/ Band name

PAL B,G,H, SECAM B,G SECAM L/ L’

VHF E2-E12 VHF H1-H2 (ITALY)

VHF A-H (ITALY) UHF E21-E69

CATV (S01-S05) CATV S1-S10 (M1-M10)

CATV S11-S20

(U1-U10) CATV S21-S41 (Hyperband)

PAL 525/ 60

Playback of NTSC tape from some PAL video recorders (VCR)

M.NTSC

Playback from M.NTSC Video recorders (VCR)

NTSC

Playback from NTSC Video recorders (VCR)

(AV INPUT ONLY)

Aerial-Rear

UHF-VHF

Operating Conditions

Temperature: 41° F-95° F(5-35° C)

Humidity: 5% -90% RH (non-condensing)

Connection Terminals

AV1

21Pin socket (Audio/ Video in, TV out, RGB in)

AV2

21Pin socket (Audio/ Video in, Audio/ Video out, S-Video, Q-Link)

AV3

VIDEO

RCA PIN Type x 1

S-VIDEO

Mini DIN 4-pin

AUDIO L-R

RCA PIN Type x 2

Dimensions (W x H x D)

Including TV Stand

586mm x 424mm x 240mm

TV Set Only

586mm x 388mm x 67mm

Weight (Mass)

11.5kg Net

Note:

Design and Specifications are subject to change without notice. Weight and Dimensions shown are approximate.

law.

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1 Safety Precautions

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1.1 General Guidelines

1.2 Touch-Current Check

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1.1 General Guidelines

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1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which

have been overheated or damaged by the short circuit.

2. After servicing, see to it that all the protective devices such as insulation barriers, insulation

papers shields are properly installed.

3. After servicing, make the following leakage current checks to prevent the customer from being

exposed to shock hazards.

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1.2 Touch-Current Check

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1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.

2. Connect a measuring network for touch currents between each exposed metallic part on the set

and a good earth ground such as a water pipe, as shown in Figure 1.

3. Use Leakage Current Tester (Simpson 228 or equivalent) to measure the potential across the

measuring network.

4. Check each exposed metallic part, and measure the voltage at each point.

5. Reserve the AC plug in the AC outlet and repeat each of the above measure.

6. The potential at any point (TOUGH CURRENT) expressed as voltage U1 and U2, does not

exceed the following values:

For a. c.: U1 = 35 V (peak) and U2 = 0.35 V (peak);

For d. c.: U1 = 1.0 V,

Note:

The limit value of U2 = 0.35 V (peak) for a. c. and U1 = 1.0 V for d. c. correspond to the values

0.7 mA (peak) a. c. and 2.0 mA d. c.

The limit value U1 = 35 V (peak) for a. c. correspond to the value 70 mA (peak) a. c. for

frequencies greater than 100 kHz.

7. In case a measurement is out of the limits specified, there is a possibility of a shock hazard, and

the equipment should be repaired and rechecked before it is returned to the customer.

Figure 1

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2 Prevention of Electro Static Discharge (ESD) to Electrostatically Sensitive

(ES) Devices

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Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices.

Examples of typical ES devices are integrated circuits and some field-effect transistorsand semiconductor "chip" components. The following techniques should be

used to help reduce the incidence of component damage caused by electro static discharge (ESD).

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your body by touching a known earth

ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap, whichshould be removed for potential shock reasons prior to

applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alminum foil, to prevent electrostatic

charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can generate electrical charge

sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are

packaged with leads electrically shorted together by conductive foam, alminum foil or comparableconductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly

into which the device will be installed.

Caution

Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise hamless motion such as the brushing together of your clothes fabric

or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient todamage an ES device).

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3 About lead free solder (PbF)

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Note: Lead is listed as (Pb) in the periodic table of elements.

In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.

The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).

That is Tin (Sn), Silver (Ag) and (Cu) although other types are available.

This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For

service and repair work, we’d suggest the use of Pb free solder as well, although Pb solder may be used.

PCBs manufactured using lead free solder will have the PbF within a leaf Symbol

stamped on the back of PCB.

Caution

●Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~

70 °F (30~40°C) higher. Please use a high temperature soldering iron and set it to 700 ± 20 °F

(370 ± 10 °C).

●Pb free solder will tend to splash when heated too high (about 1100 °F or600°C).

If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder

area before applying Pb solder. If this is not practical, be sure to heat the Pb free solder until it

melts, before applying Pb solder.

●After applying PbF solder to double layered boards, please check the component side for excess

solder which may flow onto the opposite side. (see figure below)

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Suggested Pb free solder

There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin,

silver, copper) solder. However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also

beused.

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