Panasonic DMR-E85HP Manual de usuario

ORDERNO.DSD0403003C1

B24

DVDVideoRecorder

DMR-E85HP/ DMR-E85HPC

Colour

(S).......................SilverType

SPECIFICATIONS

1. Safetyprecautions

1.1. General guidelines

1. Whenservicing, observetheoriginal leaddress. Ifashortcircuit

isfound, replace all parts whichhavebeenoverheatedor

damagedbytheshortcircuit.

2. Afterservicing, see toitthat all theprotectivedevices suchas

insulation barriers, insulation papersshieldsareproperlyinstalled.

3. Afterservicing, make thefollowing leakagecurrentchecks to

preventthecustomerfrombeing exposedtoshock hazards.

1.1.1. Leakagecurrentcoldcheck

1. Unplug theACcordand connect ajumperbetweenthetwoprongs

on theplug.

2. Measuretheresistance value, withanohmmeter, betweenthe

jumperedACplug and eachexposedmetalliccabinet parton the

equipmentsuchas screwheads, connectors, control shafts, etc.

Whentheexposedmetallicparthas areturnpathtothechassis,

thereading shouldbebetween1M and 5.2M . / Whenthe

exposedmetal does nothaveareturnpathtothechassis, the

reading must be . Figure1

1.1.2. Leakagecurrenthotcheck / (See Figure 1 .)

1. Plug theACcorddirectlyintotheACoutlet. Donotuse an

isolation transformerforthischeck.

2. Connect a1.5k , 10 watts resistor, inparallel witha0.15 F

capacitors, betweeneachexposedmetallicparton theset and a

good earthground suchas awaterpipe, as shownin Figure1.

3. Use anACvoltmeter, with1000 ohms/voltormoresensitivity, to

measurethepotential across theresistor.

4. Check eachexposedmetallicpart, and measurethevoltageat

eachpoint.

5. Reverse theACplug intheACoutlet and repeat eachoftheabove

measurements.

6. Thepotential at anypointshouldnotexceed0.75 volts RMS. A

leakagecurrenttester(Simpson Model 229 orequivalent) maybe

usedtomake thehotchecks, leakagecurrentmust notexceed1/2

milliampere. Incase ameasurementisoutsideofthelimits

specified, thereisapossibilityofashock hazard, and the

equipmentshouldberepairedand recheckedbeforeitisreturned

tothecustomer.

1.2. Caution forfuse replacement

2. Prevention of ElectrostaticDischarge (ESD) to

ElectrostaticSensitive(ES) Devices

Somesemiconductor (solidstate)devices canbedamagedeasilybystaticelectricity. Such

componentscommonlyarecalledElectrostaticSensitive (ES)Devices. Examples oftypical ES

devices areintegratedcircuitsand somefield-effecttransistor-sandsemiconductor "chip"

components. Thefollowing techniques shouldbeusedtohelpreduce theincidence of

componentdamagecausedbyelectrostaticdischarge(ESD).

1. Immediatelybeforehandling anysemiconductorcomponentor

semiconductor-equippedassembly, drainoff anyESDon your

bodybytouching aknownearthground. Alternatively, obtainand

wearacommerciallyavailabledischarging ESDwrist strap,

whichshouldberemovedforpotential shock reasonspriorto

applying powertotheunitundertest.

2. Afterremoving anelectrical assemblyequippedwithES devices,

place theassemblyon aconductivesurface suchas aluminum

foil, topreventelectrostaticchargebuildup orexposureofthe

assembly.

3. Use onlyagrounded-tipsoldering iron tosolderorunsolderES

devices.

4. Use onlyananti-staticsolderremoval device. Somesolder

removal devices notclassifiedas "anti-static(ESDprotected)"can

generate electrical chargesufficienttodamageES devices.

5. Donotuse freon-propelledchemicals. These cangenerate

electrical charges sufficienttodamageES devices.

6. DonotremoveareplacementES device fromits protective

packageuntil immediatelybeforeyou arereadytoinstall it. (Most

replacementES devices arepackagedwithleadselectrically

shortedtogetherbyconductivefoam, aluminumfoil or

comparableconductivematerial).

7. Immediatelybeforeremoving theprotectivematerial fromthe

leadsofareplacementES device, touchtheprotectivematerial to

thechassisorcircuitassemblyintowhichthedevice will be

installed.

Caution

Besureno powerisappliedtothechassisorcircuit, and observe

all othersafetyprecautions.

8. Minimizebodilymotionswhenhandling unpackagedreplacement

ES devices. (Otherwise hamless motion suchas thebrushing

togetherofyourclothes fabricorthelifting ofyourfootfroma

carpetedfloorcangenerate staticelectricitysufficienttodamage

anES device).

3. Precaution of LaserDiode

4. Howtoreplace the LithiumBattery

REPLACEMENTPROCEDURE

1. RemovetheTop case and DVD-RAMdriveunitwithMainP.C.B. by

referring theDisassembling Procedure.

2. UnsoldertheLithiumBatteries:B7501 and thenreplace itintonew

one.

(Asshownin20.2.1. TheMainP.C.B. )

NOTE:

Thelithium batteryisacritical component. (TypeNo.:CR2354-1GUFManufacturedby

Panasonic. )

Itmustneverbesubjectedtoexcessive heator discharge.

Itmustthereforeonlybefittedinequipmentdesignedspecificallyfor itsuse.

Replacementbatteries mustbeofthesametypeand manufacture.

They mustbefittedinthesamemannerand location as theoriginal battery, withthecorrect

polaritycontactsobserved.

Donotattempttore-chargetheoldbatteryor re-use itfor anyotherpurpose.

Itshouldbedisposedofinwasteproductsdestinedfor burial ratherthanincineration.

5. Handling the Lead-free Solder

5.1. Aboutleadfree solder(PbF)

Distinction ofPbF P.C.B.:

P.C.B.s(manufactured)using leadfree solderwill have aPbF stampon theP.C.B.

Caution:

-Pbfree solderhas ahighermelting pointthanstandardsolder;

Typicallythemelting pointis50 -70°F(30 -40°C)higher. Please

use ahigh temperaturesoldering iron. Incase ofthesoldering iron

withtemperaturecontrol,please set itto700 ±20°F(370 ±10°C).

-Pbfree solderwill tend tosplashwhenheatedtoo high (about

1100°F/600°C).

-Whensoldering orunsoldering, please completelyremoveall ofthe

solderon thepinsorsolderarea, and besuretoheat thesoldering

points withthePbfree solderuntil itmelts enough.

6. Each Buttons

7. NewFeatures

7.1. Function ofPowerCircuit(IC1150)

1. General

WeadoptedICmoduleas theSwitching PowerCircuitfor lowerpowerconsumption.

IC1150 isconstructedwithSwitching materialsand Control IC, and ispartial resonance module.

WerealizedSwitching Powerwithhigh efficiency, lownoise and lowpowerconsumption.

2. Equivalence CircuittoIC1150

No. Symbol Description

1 Z/C Triggerinputterminal.

Zero detection voltage:0.25V

Itbecomes less than3V, themode

turnstostandby.

2F/B Bias currentfeedback inputterminal.

Switching ONtime(min.)~(max.)

1.5V ~4.5V / 0 sec. ~25 sec.

Instandbymode

Oscillation stops:less than0.8V

Oscillation starts:over1.8V

3GND GND terminal

4Vcc Powerterminal ofIC.

Oscillation starting voltage:Vcc =

and over14.5V

Oscillation stop voltage:Vcc =and

less than9.6V

Overvoltagelatching voltage:Vcc =

20V

5Drain Drainterminal for Mainswitching

material.

3. Startup Circuit

Whenpoweristurnedon, inputvoltageoftheSwitching TransformerissuppliedtoIC1150 as the

startup power.

AfterIC1150 has started, thestartup currentiscutoff.

ThecurrentofStartup Circuitissuppliedas constantcurrentsource inIC1150 and as charge

currentfor thecapacitor connectedbetweenVcc terminal and GND outsideofIC1150 until Vcc

reaches 14.4V.

WhenVcc reaches 14.4V, theStartup Circuitiscutoff, thenoscillation starts.

Afterthen, powerofIC1150 issuppliedfrom control coil.

Incase, thepowerfailureor shortoutoftheload, whenVcc becomes 9.0V;theoscillation stops,

furthermoreVcc becomes 7.1V theStartup Circuitstartsup and Vcc startstorise.

Startup CircuitTiming Chart

Function ofZ/CTerminal

WhenvoltageofZ/Creaches 0.25V, Gatesignal isoutputand Draincurrentstartstoflow.

Function ofF/Bterminal

F/Bsignal decides Switching ONwidthinlowvoltagecontrolling.

TheSwitching ONwidthrespondstochangeofF/BVoltage.

StandbyFunction

WhenZ/CVoltagebecomes less than3V, theunitchanges toStandbymode.

IC1150 Block Diagram

Signal name

PinNo. Name Symbol

1 Zero CurrentDet. Z/C

2Feedback F/B

3GND GND

4Vcc Vcc

5Drain Drain

8. Taking out the Disc fromRAM-DriveUnit when the

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