Panasonic DMR-E85HEB Manual de usuario

ORDERNO.DSD0403005C2

DVDVideoRecorder

DMR-E85HEB/ DMR-E85HEG

Colour

(K).......................Black Type

(S).......................SilverType

SPECIFICATIONS

Unauthorizedcopying and distribution isaviolation oflaw.

1. Safetyprecautions

1.1. General guidelines

1. Whenservicing, observetheoriginal leaddress. Ifashortcircuit

isfound, replace all parts whichhavebeenoverheatedor

damagedbytheshortcircuit.

2. Afterservicing, see toitthat all theprotectivedevices suchas

insulation barriers, insulation papersshieldsareproperlyinstalled.

3. Afterservicing, make thefollowing leakagecurrentchecks to

preventthecustomerfrombeing exposedtoshock hazards.

1.1.1. Leakagecurrentcoldcheck

1. Unplug theACcordand connect ajumperbetweenthetwoprongs

on theplug.

2. Measuretheresistance value, withanohmmeter, betweenthe

jumperedACplug and eachexposedmetalliccabinet parton the

equipmentsuchas screwheads, connectors, control shafts, etc.

Whentheexposedmetallicparthas areturnpathtothechassis,

thereading shouldbebetween1M and 5.2M . / Whenthe

exposedmetal does nothaveareturnpathtothechassis, the

reading must be . Figure1

1.1.2. Leakagecurrenthotcheck / (See Figure 1 .)

1. Plug theACcorddirectlyintotheACoutlet. Donotuse an

isolation transformerforthischeck.

2. Connect a1.5k , 10 watts resistor, inparallel witha0.15 F

capacitors, betweeneachexposedmetallicparton theset and a

good earthground suchas awaterpipe, as shownin Figure1.

3. Use anACvoltmeter, with1000 ohms/voltormoresensitivity, to

measurethepotential across theresistor.

4. Check eachexposedmetallicpart, and measurethevoltageat

eachpoint.

5. Reverse theACplug intheACoutlet and repeat eachoftheabove

measurements.

6. Thepotential at anypointshouldnotexceed0.75 volts RMS. A

leakagecurrenttester(Simpson Model 229 orequivalent) maybe

usedtomake thehotchecks, leakagecurrentmust notexceed1/2

milliampere. Incase ameasurementisoutsideofthelimits

specified, thereisapossibilityofashock hazard, and the

equipmentshouldberepairedand recheckedbeforeitisreturned

tothecustomer.

2. Prevention of ElectrostaticDischarge (ESD) to

ElectrostaticSensitive(ES) Devices

Somesemiconductor (solidstate)devices canbedamagedeasilybystaticelectricity. Such

componentscommonlyarecalledElectrostaticSensitive (ES)Devices. Examples oftypical ES

devices areintegratedcircuitsand somefield-effecttransistor-sandsemiconductor "chip"

components. Thefollowing techniques shouldbeusedtohelpreduce theincidence of

componentdamagecausedbyelectrostaticdischarge(ESD).

1. Immediatelybeforehandling anysemiconductorcomponentor

semiconductor-equippedassembly, drainoff anyESDon your

bodybytouching aknownearthground. Alternatively, obtainand

wearacommerciallyavailabledischarging ESDwrist strap,

whichshouldberemovedforpotential shock reasonspriorto

applying powertotheunitundertest.

2. Afterremoving anelectrical assemblyequippedwithES devices,

place theassemblyon aconductivesurface suchas aluminum

foil, topreventelectrostaticchargebuildup orexposureofthe

assembly.

3. Use onlyagrounded-tipsoldering iron tosolderorunsolderES

devices.

4. Use onlyananti-staticsolderremoval device. Somesolder

removal devices notclassifiedas "anti-static(ESDprotected)"can

generate electrical chargesufficienttodamageES devices.

5. Donotuse freon-propelledchemicals. These cangenerate

electrical charges sufficienttodamageES devices.

6. DonotremoveareplacementES device fromits protective

packageuntil immediatelybeforeyou arereadytoinstall it. (Most

replacementES devices arepackagedwithleadselectrically

shortedtogetherbyconductivefoam, aluminumfoil or

comparableconductivematerial).

7. Immediatelybeforeremoving theprotectivematerial fromthe

leadsofareplacementES device, touchtheprotectivematerial to

thechassisorcircuitassemblyintowhichthedevice will be

installed.

Caution

Besureno powerisappliedtothechassisorcircuit, and observe

all othersafetyprecautions.

8. Minimizebodilymotionswhenhandling unpackagedreplacement

ES devices. (Otherwise hamless motion suchas thebrushing

togetherofyourclothes fabricorthelifting ofyourfootfroma

carpetedfloorcangenerate staticelectricitysufficienttodamage

anES device).

3. Precaution of LaserDiode

4. Handling the Lead-free Solder

4.1. Aboutleadfree solder(PbF)

Distinction ofPbF P.C.B.:

P.C.B.s(manufactured)using leadfree solderwill have aPbF stampon theP.C.B.

Caution:

-Pbfree solderhas ahighermelting pointthanstandardsolder;

Typicallythemelting pointis50 -70°F(30 -40°C)higher. Please

use ahigh temperaturesoldering iron. Incase ofthesoldering iron

withtemperaturecontrol,please set itto700 ±20°F(370 ±10°C).

-Pbfree solderwill tend tosplashwhenheatedtoo high (about

1100°F/600°C).

-Whensoldering orunsoldering, please completelyremoveall ofthe

solderon thepinsorsolderarea, and besuretoheat thesoldering

points withthePbfree solderuntil itmelts enough.

5. Each Buttons

6. Taking out the Disc fromRAM-DriveUnit when the

Disc cannot be ejected byOPEN/CLOSE button

6.1. ForcibleDisc Eject

6.1.1. Whenthepowercanbeturnedoff.

1. Turnoff thepowerand press [STOP][CH UP]keyson thefront

panel simultaneouslyfor5seconds.

6.1.2. Whenthepowercannotbeturnedoff.

1. Press [POWER]keyon thefrontpanel forover10 secondstoturn

off thepowerforcibly, and press [STOP][CH UP]keyson thefront

panel simultaneouslyfor5seconds.

6.2. WhentheForcibleDisc Eject cannotbedone.

1. Turnoff thepowerand pull outACcord.

2. RemovetheTop Case.

3. RemovetheFrontPanel.

4. Remove4screwsand UpperBase UnitfromDVD-RAMDrive.

5. Take outthedisc and puttheOpenerRolleron fullyposition for

direction ofArrow.

6. PuttheUpperBase Unitsothat theOpenerRollerisinsertedinto

thegroove.

7. Check centerofOpenerRollerisseenthrough theOpener

position Checking Hole, and tighten4screws.

7. Service Explorer

Confirm “RAM-Drive LastError”inService Mode

ExecuteService Mode

1. Press [STOP], [TIMESLIP]and [OPEN/CLOSE]simultaneouslyfor

5secondswhenP-off.

FL Display:

*Afterfinishing display“(7). FactorofDriveErroroccurring”,

press [0] [2] ~[9] [9] keysoftheRemote Controllersothat 99

memories canbedisplayedas maximum.

2. Press [4] [2] keysofremote controller.

ExampleofFL Display:

(1)Error Numberisdisplayedfor 5seconds.

(2)Timewhentheerror has occurredisdisplayedfor 5seconds.

(3)LastDrive Error (1/2)isdisplayedfor 5seconds.

(4)LastDrive Error (2/2)isdisplayedfor 5seconds.

(5)Error occurring Disc typeisdisplayedfor 5seconds.

(6)Disc Maker's IDisdisplayedfor 5seconds.

ExampleofDisc Maker's ID:

DVD-R Disc

No. FL Display (Disc

Maker's ID) Disc Maker Country

1MEI Panasonic Japan

2PVC Pioneer Japan

3MCC Mitsubishi Chemical

Corporation Japan

4TDK TDK Japan

5MXL Maxell Japan

6MCI MITUICHEMICALS Japan

7 JVC Victor JVC Japan

8TAIYOYUDEN Taiyoyuden Japan

TYG

9GSC GigaStorage Taiwan

10 PRODISC Prodisc Taiwan

11 PRINCO PRINCO Taiwan

12 RITEK RITEK Taiwan

13 OPTDISC OPTDISC Taiwan

14 LEADDATA LEADDATA Taiwan

15 CMC CMC Taiwan

16 AUVISTAR AUVISTAR Taiwan

17 ACER Acer Taiwan

18 VIVASTAR VIVASTAR Switzerland

19 LGE LGElectronics Korea

DVD-RAMDisc

No. FL Display (Disc

Maker's ID) Disc Maker Country

1MEI Panasonic

2MATSUSHITA Panasonic Japan

3MXL Maxell Japan

4PRODISC Prodisc Taiwan

5OPTDISC OPTDISC Taiwan

6CMC CMC Taiwan

*Since andisplay isarbitrarilysetup bythedisk producerside, theabove-mentioneddisplay

may bechanged.

Please make itreference as anexampleofadisplay.

(7)Factor ofDrive Error occurring isleft displayed

Error Occurring Disc Type

FL Display Disc Type

00 DVD-ROM/Video

01 Audio-CD

02 2.6GBDVD-RAM

03 4.7GBDVD-RAM

04 DVD-R

Error Occurring Disc State

8. Self-Diagnosisand Special Mode Setting

8.1. Self-DiagnosisFunctions

Self-DiagnosisFunction provides information for errorstoservice personnel by“Self-Diagnosis

Display”whenanyerror has occurred.

U14, H** and F** arestoredinmemoryand held.

Display on FL will becancelledwhenthepoweristurnedoff or ACinputisturnedoff during self-

diagnosisdisplay isON.

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