Panasonic DMP-BD10PP Manual de usuario

rights reserved. Unauthorized copying and distribu-

tion is a violation of law.

ORDER NO.DSD0608009CE

B35

BD/DVD Player

DMP-BD10PP

Vol. 1

Colour

(K).......................Black Type

TABLE OF CONTENTS

PAGE PAGE

1 Safety Precaution-------------------------------------------------3

1.1. General guidelines-----------------------------------------3

1.2. Caution for fuse replacement ---------------------------3

2Warning--------------------------------------------------------------4

2.1. Prevention of Electrostatic Discharge (ESD)

to Electrostatic Sensitive (ES) Devices ---------------4

2.2. Precaution of Laser Diode -------------------------------5

2.3. Service caution based on legal restrictions----------6

3 Service Navigation------------------------------------------------7

3.1. Service Information ----------------------------------------7

4 Specifications ------------------------------------------------------8

5Features--------------------------------------------------------------9

5.1. What's a Blu-ray Disc?------------------------------------9

5.2. Structure of the BD-Video Disc -------------------------9

5.3. Benefits of the BD-Video Disc --------------------------9

5.4. Region codes of BD ROM: ---------------------------- 10

5.5. Features of DMP-BD10--------------------------------- 10

6 Location of Controls and Components------------------ 12

7 Operation Instructions ---------------------------------------- 14

7.1. Taking out the Disc from DVD-Drive Unit when

the Disc cannot be ejected by OPEN/CLOSE

button-------------------------------------------------------- 14

8 Service Mode----------------------------------------------------- 15

8.1. Self-Diagnosis and Special Mode Setting---------- 15

9 Service Fixture & Tools --------------------------------------- 22

10 Disassembly and Assembly Instructions--------------- 23

10.1. Disassembly Flow Chart-------------------------------- 23

10.2. P.C.B. Positions------------------------------------------- 23

10.3. Top cover --------------------------------------------------- 24

10.4. Front panel------------------------------------------------- 24

10.5. Front P.C.B., Power SW P.C.B.----------------------- 24

10.6. DVD drive -------------------------------------------------- 25

10.7. Rear panel ------------------------------------------------- 25

10.8. Power P.C.B. ---------------------------------------------- 26

10.9. Digital P.C.B. ---------------------------------------------- 26

10.10. Main P.C.B. ------------------------------------------------ 27

11 Measurements and Adjustments -------------------------- 28

11.1. Service Positions ----------------------------------------- 28

1 Safety Precaution

1.1. General guidelines

1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or

damaged by the short circuit.

2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly

installed.

3. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.

1.1.1. Leakage current cold check

1. Unplug the AC cord and connect a jumper between the

two prongs on the plug.

2. Measure the resistance value, with an ohmmeter,

between the jumpered AC plug and each exposed metal-

lic cabinet part on the equipment such as screwheads,

connectors, control shafts, etc. When the exposed metal-

lic part has a return path to the chassis, the reading

should be between 1MΩand 5.2MΩ.

When the exposed metal does not have a return path to

the chassis, the reading must be .

Figure 1

1.1.2. Leakage current hot check

(See Figure 1 .)

1. Plug the AC cord directly into the AC outlet. Do not use

an isolation transformer for this check.

2. Connect a 1.5kΩ, 10 watts resistor, in parallel with a

0.15μF capacitors, between each exposed metallic part

on the set and a good earth ground such as a water pipe,

as shown in Figure 1.

3. Use an AC voltmeter, with 1000 ohms/volt or more sensi-

tivity, to measure the potential across the resistor.

4. Check each exposed metallic part, and measure the volt-

age at each point.

5. Reverse the AC plug in the AC outlet and repeat each of

the above measurements.

6. The potential at any point should not exceed 0.75 volts

RMS. A leakage current tester (Simpson Model 229 or

equivalent) may be used to make the hot checks, leakage

current must not exceed 1/2 milliampere. In case a mea-

surement is outside of the limits specified, there is a pos-

sibility of a shock hazard, and the equipment should be

repaired and rechecked before it is returned to the cus-

tomer.

1.2. Caution for fuse replacement

2Warning

2.1. Prevention of Electrostatic Discharge (ESD) to Electrostatic Sensitive

(ES) Devices

Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Elec-

trostatic Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistor-sand semi-

conductor chip components. The following techniques should be used to help reduce the incidence of component damage caused

by electrostatic discharge (ESD).

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your

body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,

which should be removed for potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alumi-

num foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static solder removal device. Some solder removal devices not classified as anti-static (ESD protected) can

generate electrical charge sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most

replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or compara-

ble conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material

to the chassis or circuit assembly into which the device will be installed.

Caution

Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise hamless motion such as the brush-

ing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to

damage an ES device).

2.2. Precaution of Laser Diode

2.3. Service caution based on legal restrictions

2.3.1. General description about Lead Free Solder (PbF)

The lead free solder has been used in the mounting process of all electrical components on the printed circuit boards used for this

equipment in considering the globally environmental conservation.

The normal solder is the alloy of tin (Sn) and lead (Pb). On the other hand, the lead free solder is the alloy mainly consists of tin

(Sn), silver (Ag) and Copper (Cu), and the melting point of the lead free solder is higher approx.30 degrees C (86°F) more than that

of the normal solder.

Definition of PCB Lead Free Solder being used

Service caution for repair work using Lead Free Solder (PbF)

• The lead free solder has to be used when repairing the equipment for which the lead free solder is used.

(Definition: The letter of PbF is printed on the PCB using the lead free solder.)

• To put lead free solder, it should be well molten and mixed with the original lead free solder.

• Remove the remaining lead free solder on the PCB cleanly for soldering of the new IC.

• Since the melting point of the lead free solder is higher than that of the normal lead solder, it takes the longer time to melt the

lead free solder.

• Use the soldering iron (more than 70W) equipped with the temperature control after setting the temperature at 350±30 degrees

C (662±86°F).

Recommended Lead Free Solder (Service Parts Route.)

• The following 3 types of lead free solder are available through the service parts route.

RFKZ03D01K-----------(0.3mm 100g Reel)

RFKZ06D01K-----------(0.6mm 100g Reel)

RFKZ10D01K-----------(1.0mm 100g Reel)

Note

* Ingredient: tin (Sn), 96.5%, silver (Ag) 3.0%, Copper (Cu) 0.5%, Cobalt (Co) / Germanium (Ge) 0.1 to 0.3%

The letter of “PbF” is printed either foil side or components side on the PCB using the lead free solder.

(See right figure)

3 Service Navigation

3.1. Service Information

4 Specifications

5 Features

5.1. What's a Blu-ray Disc?

The Blu-ray Disc (BD) is a next-generation optical disc format for storing a large amount of data using a short wavelength blue laser

to read and write. Like DVD, there are a number of BD standards, such as read-only BD-ROM, recordable BD-R and rewritable BD-

RE. The single largest feature of BD is its high-density data storage capacity of 25 GB per layer on one side. This lets you store

many hours of content, such as movies with HD resolution and high-quality music with loss-less audio compression. BD also fea-

tures a high-performance interactive function that uses Java™(*1), called BD-J, to deliver a new video experience to users not

offered by conventional video media. With many motion picture production companies and electronics, PC and gaming manufactur-

ers expressing their support for BD, new hardware and software products are expected to hit the market soon.

(*1): Java is a trademark of Sun Microsystems

5.2. Structure of the BD-Video Disc

The Blu-ray Disc is an optical disc with the same dimensions as the DVD disc: 12 cm in diameter and 1.2 mm in thickness. By using

a combination of the 405-nm-wavelength blue-violet laser, which is a shorter wavelength than the red laser used by DVD, and a

high-density objective lens with a numerical aperture of 0.85, BD uses a laser beam spot that is only about 1/5 the size used by

DVD. Thanks to these technologies, a single-layer BD-Video disc can store five times more data than a DVD disc.

5.3. Benefits of the BD-Video Disc

1. One Single-Layer Disc Equals Five DVDs in Data

Capacity

The BD-Video disc boasts a data storage capacity of 25

GB in a single layer and 50GB in dual layer, because it

uses the shorter wavelength blue-violet laser and a high-

density objective lens to enable higher-density data

reading. When a multi-layer system is adopted in the

future, the storage capacity can increase to 100 GB and

even 200 GB. One BD-Video disc can store a huge

amount of data so users can enjoy many hours of high-

definition content and high-quality surround sound that

could not previously be provided by other media.

2. HD Image Quality Video

In addition to the MPEG-2 format used by DVD-Video, the

BD-Video disc uses video codes, such as MPEG-4 AVC

and VC-1, which deliver high image quality using high

compression rates. The data transfer speed is 48 Mbps,

which is about three times faster than DVD. A future plan

also calls for a further increase in the data transfer speed.

These technologies allow long-time playback of content

with high-definition image quality.

3. High-Quality Surround Sound

The BD-Video disc optionally supports next-generation

surround sound formats like Dolby® Digital Plus. Con-

necting a BD-Video player to an AV center using an

HDMI(*2) cable enables linear PCM multi-channel data

transfer. This makes it possible to reproduce high-quality

7.1-channel surround sound with each channel offering

DVD-Audio quality, delivering a surround sound experi-

ence that rivals the quality of the master audio source.

(*2) HDMI Ver. 1.1 and newer.

4. BD-J for Extensive Interactive Functions

The BD-Video disc is equipped with an extended function

based on Java™(*1) technology, called BD-J, to provide

various interactive features. For example, this can be

used to program various operations, such as displaying a

pop-up menu while playing a BD-Video disc, and activat-

ing a keyword search. With unlimited application possibil-

ities, BD-J offers interactive enjoyment that is simply not

possible with conventional AV software.

5. Extensive Support for Both Hardware and Software

The Blu-ray Disc specifications have been established

mainly by leading electronics, PC and gaming manufac-

turers around the world, including Panasonic. These com-

panies will support BD promotion by introducing a variety

of hardware. A number of major motion picture production

companies have expressed their support. A variety of

software can be expected to hit the market before long.

5.4. Region codes of BD ROM:

• Region A/1: North America, South America, East Asia

except for China (India, Japan, Korea, Thailand, Malaysia

etc.)

• Region B/2: Europe and Africa

• Region C/3: China, Russia and other countries

5.5. Features of DMP-BD10

1. Ultimate picture quality

2. Superb sound quality

3. Utmost compatibility with existing Optical Discs

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