Pace TF 1000 BGA Manual de usuario
TF 1000 BGA/CSP
Rework Station
Operation Manual
MANUAL NO. 5050-0501
REV. A
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Safety
The following are safety precautions that personnel must understand and
follow when using or servicing PACE products.
1. POTENTIAL SHOCK HAZARD - Repair procedures on PACE
products should be performed by Qualified Service Personnel only.
Line voltage parts may be exposed when the equipment is
disassembled. Service personnel must avoid contact with these
parts when troubleshooting the product.
2. To prevent personnel injury, adhere to safety guidelines in
accordance with OSHA and all other applicable safety standards.
3. Always use PACE systems in a well ventilated area. A fume
extraction system, such as those available from PACE, is highly
recommended to help protect personnel from solder flux fumes.
4. Exercise proper precautions when using chemicals (e.g., solder
paste). Refer to the Material Safety Data Sheet (MSDS) supplied
with each chemical and adhere to all safety precautions
recommended by the manufacturer.
5. The following safety precautions cover use of PACE hot air
systems/hand pieces (e.g., ThermoFlo®, ThermoJet®).
a) Be careful when using in places where there are combustible
materials.
b) Do not use in the presence of an explosive atmosphere.
c) A fire may arise if a hot air hand piece is not used with care.
Do not leave the hand piece unattended when in use.
d) The heater assembly housing and any installed nozzle are
hot when the system is being cycled and for a period of time
thereafter. DO NOT touch the heater assembly housing,
nozzle or heated air stream. Severe burns may result.
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Table of Contents
Heading
Page #
A. Introduction 3
B. Regulation 3
C. Features 4
D. Structure 5
E. TF 1000 Setup 6
F. Before Operation 7
G. Installing PCB 8
H. Preparation for Component Rework 9
I. Component Alignment 10
J. Component Placement 11
K. Component Reflow 12
L. Specifications 15
M. Accessories 16
N. Maintenance 19
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TF 1000 BGA/CSP Rework Station
A. Introduction
As electronic assemblies get smaller and lighter, PCB’s are steadily decreasing
in size, and semiconductor devices are slowly being replaced by smaller area
array packages such as BGA’s and CSP’s. The TF-1000 has been specifically
designed for the rework of these devices, with an emphasis on small boards and
components.
B. Regulation
The TF-1000 is in conformity with the European Machinery Directive 98/37/EC
and EMC Directive 89/336/EMC, modified 92/31/ECC, 93/68/EEC.
Caution!
During normal operation, the top heater, nozzle, bottom-side-heater(s) and
halogen lamps will get hot. Contacting them directly may result in serious
injury.
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C. Features
1. The TF 1000 System is lightweight and compact, with the placement
station and reflow station combined in one unit
2. Up to 40 reflow profiles can be stored by the TF 1000. Saved profiles
can be recalled at the touch of a button and are displayed on the LCD
display panel.
3. A colored LED indicates each phase of the reflow cycle so the status of
each operation can be easily seen and monitored.
4. Placement of small BGA/CSP is easily accomplished through the use
of microscope optics with image overlay.
5. A highly efficient, 700-watt topside heater used in conjunction with a
truly unique nozzle design insures the uniformity of the temperature
across the assembly.
6. The infrared bottom side heater with a wide heating area is
incorporated to prevent warping of the PCB, and to enhance the reflow
of BGA/CSP.
7. The blower and vacuum pumps are self-contained. No external air
supplies are required.
8. A cooling fan automatically activates at the end of the reflow cycle to
cool the component, PCB, and nozzle.
9. The TF 1000 is versatile and ensures repeatable results
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D. Structure
1. Infrared Bottom-Side heater
2. Microscope Optics
3. Thermocouple inputs 1 and 2
4. Top-Side Heater Assembly
5. Control Panel
6. LCD Display
7. Component Alignment/Placement apparatus
8. Airflow control/Indicator
9. PCB and Component light adjustment
10.Power and Vacuum On/Off switch
11.Cooling Fan
12.PCB Holder
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Operation Manual
E. TF 1000 Setup
1. Place the TF 1000 on a flat and stable work surface.
2. Install the PCB Holder assembly by inserting the rear rail of the PCB
holder into the rolling guides on the TF 1000 housing and installing and
tightening the four screws shown in the figure below.
3. Insert the Microscope Optics into the Optics Holding Bracket and tighten
the Allen Screw after centering the Optics as shown below.
4. Connect the power cord to the AC power receptacle on the rear panel of
the TF 1000 and to the proper AC power source.
4 screws
Rolling Guides
Optics Holding
Bracket
Allen Screw
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F. Before Operation
1. Confirm the safety of the machine and the surrounding work area before
turning the power on.
2. The bottom heater will take approximately 5-6 minutes to warm up to the
desired temperature once power is applied. During this time the HEATER
START light will flicker on and off. Once the desired temperature is
reached the HEATER START light will remain lit, indicating the TF 1000 is
ready to use.
3. Confirm that components/devices mounted to the PCB do not exceed the
following height restrictions:
A. Top-side of PCB – 30 mm maximum height
B. Bottom-side of PCB – 15 mm maximum height
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G. Installing PCB
1. Loosen both (A) knobs to allow the PCB holders to glide freely in the X-
axis, and set the distance between them so that the spring loaded PCB
holder will hold the PCB firmly. Tighten the (A) knob on the left first, and
then slide the spring-loaded PCB holder into position and tighten the (A)
knob on the right.
2. Pull back on the spring-loaded board holder and insert the PCB.
3. Once the PCB is in place, loosening knob (C) will allow the entire PCB to
glide freely in the X-axis using the fine adjustment job (D). The PCB will
also slide freely in the Y-axis. Tighten knob (C) to lock the PCB in place.
NOTE: If profiling a PCB/Component and when using thermocouple(s), attach
the thermocouple(s) to the desired position on the PCB and plug them into the
Sensor 1 or 2 positions as shown below, before inserting PCB into PCB holder.
B B
A
C D A (Spring Loaded)
Thermocou
p
le In
p
uts
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H. Preparation for Component Rework
1. The reflow nozzle to PCB standoff height can be established prior to
component placement. Pull the Reflow Nozzle Control Handle out from the
housing and slide the Reflow Assembly down to the PCB as shown below.
2. Fine placement of the reflow nozzle down to the PCB can be achieved by
setting the Nozzle to PCB Offset Limiter and twisting the nozzle control
handle in either direction as shown below.
3. The Reflow Nozzle can now be lowered gently to the PCB by twisting the
Reflow Nozzle Control Handle back to the lowered position.
Reflow
Nozzle
Control
Handle
Start Finish
With the handle twisted so the
mechanics look like this… …the Reflow Nozzle will float
slightly off the PCB.
Nozzle to
PCB Offset
Limiter
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