Murata GRM0225C1E8R7BA03 Seres Manual de usuario

GRM0225C1E8R7BA03_ (01005, C0G:EIA, 8.7pF, DC25V)

_: packaging code Reference Sheet

1.Scope

2.MURATA Part NO. System

(Ex.)

3. Type & Dimensions

(Unit:mm)

4.Rated value

5.Package

Product specifications in this catalog are as of Mar.1,2016,and are subject to change or obsolescence without notice.

Please consult the approval sheet before ordering.

Please read rating and !Cautions first.

0.13 min.

(1)-1 L

0.4±0.02

(1)-2 W

0.2±0.02

Chip Monolithic Ceramic Capacitor for General

Packaging Unit

DC 25 V

Temp. Range

(Ref.Temp.)

(8) Packaging

(6)

Capacitance

Tolerance

8.7 pF

Temp. coeff

or　Cap. Change

±0.1 pF

This product specification is applied to Chip Monolithic Ceramic Capacitor used for General Electronic equipment.

(2) T

0.2±0.02

-55 to 125 °C

0±30 ppm/°C

25 to 125 °C

(25 °C)

(4)

Rated

Voltage

Specifications and Test

Methods

(Operating

Temp. Range)

f180mm Reel

EMBOSSED W4P1

40000 pcs./Reel

(3) Temperature Characteristics

(Public STD Code):C0G(EIA)

0.07 to 0.14

(5) Nominal

Capacitance

mark

(1)L/W

Dimensions

(2)T

Dimensions

(3)Temperature

Characteristics

(4)Rated

Voltage

(5)Nominal

Capacitance

(6)Capacitance

Tolerance

(8)Packaging

Code



Control Code

GRM 02 25C 1E 8R7 B A03 L

GRM0225C1E8R7BA03-01 1

1 Rated Voltage Shown in Rated value. The rated voltage is defined as the maximum voltage

which may be applied continuously to the capacitor.

When AC voltage is superimposed on DC voltage,

VP-P or VO-P, whichever is larger, should be maintained

within the rated voltage range.

2 Appearance No defects or abnormalities. Visual inspection.

3 Dimension Within the specified dimensions. Using calipers. (GRM02 size is based on Microscope)

4 Voltage proof No defects or abnormalities. Measurement Point : Between the terminations

Test Voltage : 300% of the rated voltage

(Temperature compensating type)

Applied Time : 1s to 5 s

Charge/discharge current : 50mA max.

5 Insulation Resistance(I.R.)

C≦ Measurement Point 　　 : Between the terminations

C＞ Measurement Voltage : DC Rated Voltage

C:Nominal Capacitance Charging Time : 1 min

Charge/discharge current : 50mA max.

Measurement Temperature : Room Temperature

6 Capacitance Shown in Rated value. Measurement Temperature : Room Temperature

(1)Temperature Compensating Type

7 Q or Dissipation Factor (D.F.)

30pF and over:Q≧1000

30pF and below:Q≧400+20C

C:Nominal Capacitance(pF)

Temperature

Nominal values of the temperature coefficient is shown in Rated value.

The capacitance change should be measured after 5 min

Characteristics at each specified temp. stage.

of Capacitance

But,the Capacitance Change under 20℃is shown in Table A. In case of applying voltage, the capacitance change should be

measured after 1 min with applying voltage in equilibration of

Capacitance Drift each temp. stage.

Within +/-0.2% or +/-0.05pF Capacitance value as a reference is the value in step 3.

(Whichever is larger.)

The capacitance drift is calculated by dividing the differences

between the maximum and minimum measured values in the

step 1,3 and 5 by the cap. value in step 3.

9 Adhesive Strength No removal of the terminations or other defect Solder the capacitor on the test substrate shown in Fig.3.

of Termination should occur.

Holding Time : 10+/-1s

Applied Direction : In parallel with the test substrate and vertical with

the capacitor side.

Test Method

(Ref. Standard:JIS C 5101, IEC60384）

Specification

■Specifications and Test Methods

Item

Type Applied Force(N)

GRM02 1

GRM03 2

GRM15/GRM18 5

GRM21/GRM31/GRM32 10

Step

Temperature(C)

Reference Temp.+/-2

Min. Operating Temp.+/-3

Reference Temp.+/-2

Max. Operating Temp.+/-3

Reference Temp.+/-2

Capacitance

Frequency

Voltage

C≦1000pF

1.0+/-0.1MHz

0.5 to 5.0Vrms

C＞1000pF

1.0+/-0.1kHz

1.0+/-0.2Vrms

JEMCGS-04590A 2

10 Vibration  Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.

Capacitance Within the specified initial value.

Q or D.F. Within the specified initial value. Kind of Vibration : A simple harmonic motion

10Hz to 55Hz to 10Hz (1min)

Total amplitude : 1.5mm

This motion should be applied for a period of 2h in each 3 mutually

perpendicular directions(total of 6h).

11 Substrate Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.1.

Bending test

Capacitance Within +/-5% or +/-0.5pF

Change (Whichever is larger) Pressurization method : Shown in Fig.2

Flexure　　　　: 1mm

Holding Time : 5+/-1s

Soldering Method : Reflow soldering

12 Solderability 95% of the terminations is to be soldered evenly and continuously. Test Method : Solder bath method

Flux Solution of rojin ethanol 25(wt)%

Preheat :

80℃to 120℃for 10s to 30s

Solder : Sn-3.0Ag-0.5Cu

Solder Temp. :

245+/-5℃

Immersion time :

2+/-0.5s

Resistance to Appearance No defects or abnormalities. <GRM03 size min.>

Soldering Heat Capacitance Within +/-2.5% or +/- 0.25pF Test Method : Solder bath method

Change (Whichever is larger) Solder : Sn-3.0Ag-0.5Cu

Solder Temp. :

270+/-5℃

Q or D.F. Within the specified initial value.

Immersion time :

10+/-0.5s

Exposure Time : 24+/-2h

I.R. Within the specified initial value. Preheat :

GRM31 size max.: 120℃to 150℃for 1 min

　GRM32 size 　　 : 100℃to 120℃for 1 min

Voltage proof No defects.

and 170℃to 200℃for 1 min

Test Method : Reflow soldering (hot plate)

Solder : Sn-3.0Ag-0.5Cu

Solder Temp. :

270+/-5℃

Reflow Time : 10+/-0.5s

Test Substrate : Glass epoxy PCB

Exposure Time : 24+/-2h

Preheat :

120℃to 150℃for 1 min

Temperature Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.

Sudden Change Capacitance Within +/-2.5% or+/- 0.25pF

Change (Whichever is larger) Perform the five cycles according to the four heat treatments

shown in the following table.

Q or D.F. Within the specified initial value.

I.R. Within the specified initial value.

Voltage proof No defects.

Exposure Time : 24+/-2h

Test Method

(Ref. Standard:JIS C 5101, IEC60384）

Specification

Item

Type Applied Force(N)

GRM02 1

GRM03 2

GRM15/GRM18 5

GRM21/GRM31/GRM32 10

Step

Temp.(C)

Time (min)

Min.Operating Temp.+0/-3

30+/-3

Room Temp.

2 to 3

Max.Operating Temp.+3/-0

30+/-3

Room Temp

2 to 3

JEMCGS-04590A 3

High Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.

Temperature

High Humidity Capacitance Within +/-7.5% or +/-0.75pF

Test Temperature :

40+/-2℃

(Steady) Change (Whichever is larger)

Test Humidity :

90%RH to 95%RH

Test Time :

500+/-12h

Q or D.F. 30pF and over:Q≧200 Applied Voltage : DC Rated Voltage

30pF and below Charge/discharge current : 50mA max.

:Q≧100+10C/3

Exposure Time :

24+/-2h

C:Nominal Capacitance(pF)

I.R. 

16 Durability Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.

Capacitance Within +/-3% or +/-0.3pF Test Temperature : Max. Operating Temp. +/-3℃

Change (Whichever is larger)

Test Time :

1000+/-12h

Applied Voltage : 200% of the rated voltage

Q or D.F. 30pF and over:Q≧350 Charge/discharge current : 50mA max.

10pF and over Exposure Time : 24+/-2h

30pF and below　: Q≧275+5C/2

10pF and below　: Q≧200+10C

C:Nominal Capacitance (pF)

I.R. 

Test Method

(Ref. Standard:JIS C 5101, IEC60384）

Specification

Item

Type Applied Force(N)

GRM02 1

GRM03 2

GRM15/GRM18 5

GRM21/GRM31/GRM32 10

Table A

Char.

Capacitance Change from 20C (%) (5C only : 25C)

-55℃

-30℃

-25℃

-10℃

Max.

Min.

Max.

Min.

Max.

Min.

Max.

Min.

0.82

-0.45

0.49

-0.27

0.33

-0.18

1.37

-0.90

0.82

-0.54

0.55

-0.36

2.56

-1.88

1.54

-1.13

1.02

-0.75

0.58

-0.24

0.40

-0.17

0.25

-0.11

JEMCGS-04590A 4

Substrate Bending test

・Test substrate

Material : Copper-clad laminated sheets for PCBs

(Glass fabric base, epoxy resin)

Thickness : 1.6mm (GRM02/GRM03/GRM15: t:0.8mm)

Copper foil thickness : 0.035mm

　　　　　　　　　　　: Solder resist

(Coat with heat resistant resin for solder)

Fig.1 (in mm)

・Test substrate

Kind of Solder : Sn-3.0Ag-0.5Cu

・Test substrate

Pressurization method

Fig.2 (in mm)

Adhesive Strength of Termination, Vibration, Temperature Sudden Change, Resistance to Soldering Heat (Reflow method)

High Temperature High Humidity(Steady) , Durability

・Test substrate

Material : Copper-clad laminated sheets for PCBs

(Glass fabric base, epoxy resin)

Thickness : 1.6mm or 0.8mm

Copper foil thickness : 0.035mm

・Test substrate

Kind of Solder : Sn-3.0Ag-0.5Cu

・Test substrate

Land Dimensions

Fig.3

Type Applied Force(N)

GRM02 1

GRM03 2

GRM15/GRM18 5

GRM21/GRM31/GRM32 10

＊2

4.0±0.1

8.0±0.3

3.5±0.05

0.05以下

＊1

φ1.5

+0.1

-0

Ａ

*1,2：2.0±0.05

1.75±0.1

Ｂ

100

Land

f4.5

Type

Dimension (mm)

GRM02

0.2

0.56

0.23

GRM03

0.3

0.9

0.3

GRM15

0.4

1.5

0.5

GRM18

1.0

3.0

1.2

GRM21

1.2

4.0

1.65

GRM31

2.2

5.0

2.0

GRM32

2.2

5.0

2.9

Type

Dimension (mm)

GRM02

0.2

0.56

0.23

GRM03

0.3

0.9

0.3

GRM15

0.4

1.5

0.5

GRM18

1.0

3.0

1.2

GRM21

1.2

4.0

1.65

GRM31

2.2

5.0

2.0

GRM32

2.2

5.0

2.9

SolderResist

Chip Capacitor

Land

Flexure:≦1

Capacitance meter

Pressurization

speed

1.0mm/s

Support

Capacitor

Pressurize

50 min.

JEMCGS-04590A 5

1.Tape Carrier Packaging(Packaging Code:D/E/W/L/J/F/K)

1.1 Minimum Quantity(pcs./reel)

1.2 Dimensions of Tape

(1)GRM01/02 (W4P1 CODE:L) (in:mm)

*3 Nominal value

10000(W8P2)

50000(W8P2)

4000

GRM55

GRM43

GRM32

GRM31

GRM21

GRM15

5(LW Dimensions Tolerance:±0.2

and T Dimensions:0.5 +0/-0.1)

5(LWT Dimensions Tolerance:±0.1min.)

5(LWT Dimensions Tolerance:±0.05)

R/D/E

GRM01

GRM02

3/X

5 (LW Dimensions Tolerance:±0.1min.

and T Dimensions Tolerance:±0.05)

GRM03

GRM18

A/B

6/9

M/X

10000(W8P2)

4000

N/R/D

4000

50000(W4P1)

N/C/R/D

A/M

Package

GRM Type

15000(W8P2)

20000(W8P2)

10000(W8P2)

Paper Tape

Plastic Tape

Paper Tape

Plastic Tape

4000

30000(W8P1)

20000(W8P1)

40000(W4P1)

3000

2000

3000

300

50000(W8P2)

2000

1000

10000

500

1000

500

1000

500

3000

10000

40000(W8P2)

50000(W8P2)

10000

1500

Code:D/E

Code:W

Code:L

Code:J/ F

Code:K

8000

6000

4000

10000

6000

10000





Type

1500

5000

4000

5000

4000

2000

0.145

0.27

0.4 max.

0.2±0.02

0.23

0.43

0.125±0.013

0.4±0.05

0.25±0.013

Type

0.2±0.05

0.26

GRM02

GRM01

0.4±0.02

15000(W8P2)

50000(W8P2)

0.5 max.

0.46

Dimensions(Chip)

A *3

B *3

2.0±0.04

＊2

＊1

φ0.8±0.04

0.9±0.05

4.0±0.05

1.8±0.02

＊1,2：1.0±0.02

0.05以下

Ａ

Ｂ

0.15～0.4

*1,2：1.0±0.02

2.0±0.04

0.9±0.05

4.0±0.05

1.8±0.02

Ａ

Ｂ

0.05 max.

φ0.8±0.04

0.15～0.25

JEMCGP-01796E 6

　(2)GRM03/15(W8P2 CODE:D/E/J/F)

(in:mm)

L W

2 0.2 +0.02/-0.04

0.3±0.03 0.5 max.

0.6±0.05 0.3±0.05 0.3±0.05 0.39 0.69

0.3±0.09 0.6 max.

5 0.5±0.05

2 0.2 +0.02/-0.04

X 0.25±0.05

1.0±0.2 0.5±0.2 0.78 1.29

1.0±0.05 0.5±0.05 0.5±0.05

1.0±0.07 0.5±0.07 0.5±0.07

1.0±0.1 0.5±0.1 0.5±0.1 0.70 1.20

1.0±0.15 0.5±0.15 0.5±0.15 0.72 1.25

0.5 +0/-0.1

0.5±0.2

0.5±0.05 *3 Nominal value

　(3)GRM033/155(W8P1 CODE:W) (in:mm)

L W

0.6±0.03 0.3±0.03 0.3±0.03 0.37 0.67

0.6±0.05 0.3±0.05 0.3±0.05 0.39 0.69

0.6±0.09 0.3±0.09 0.3±0.09 0.44 0.74 0.6 max.

GRM15 5 1.0±0.05 0.5±0.05 0.5±0.05 0.65 1.15 0.8 max.

*3 Nominal value

0.5 max.

Dimensions(Chip)

A *3

B *3

1.0±0.2

0.5±0.2

0.65

0.78

1.15

1.29

0.74

0.8 max.

0.5±0.05

0.3±0.03

0.65

1.15

Type

Dimensions(Chip)

0.6±0.03

GRM03

0.6±0.09

0.3±0.03

0.3±0.09

Package

GRM Type

A *3

B *3

0.37

0.67

GRM03

GRM15

1.0±0.05

Type

0.44

*1,2：2.0±0.05

＊2

4.0±0.1

8.0±0.3

3.5±0.05

0.05以下

＊1

φ1.5

+0.1

-0

Ａ

*1,2：2.0±0.05

1.75±0.1

Ｂ

4.0±0.1

φ1.5

+0.1

-0

1.75±0.1

8.0±0.3

3.5±0.05

Ａ

Ｂ

0.05 max.

1.0±0.05

4.0±0.1

φ1.5

+0.1

-0

1.75±0.1

8.0±0.3

3.5±0.05

Ａ

Ｂ

1.0±0.05

JEMCGP-01796E 7

　(4)GRM18/21/31/32 (in:mm)

L W

1.6±0.1 0.8±0.1 1.05±0.10 1.85±0.10

50.5±0.05

6 0.6 +0/-0.1

7 0.7±0.1

1.6±0.1 0.8±0.1 0.8±0.1

8 1.6±0.15 0.8±0.15 0.8±0.15

1.6±0.2 0.8±0.2 0.8±0.2 1.10±0.10 2.00±0.10

0.6±0.1

0.6 +0/-0.15

0.85±0.05

0.85±0.1

0.85 +0.15/-0.1

0.85 +0/-0.2

2.0±0.15 1.25±0.15

0.85 +0.15/-0.05 1.50±0.20 2.30±0.20

2.0±0.1 1.25±0.1 1.0 +0/-0.2 1.45±0.20 2.25±0.20

2.0±0.2 1.25±0.2 1.0±0.2 1.50±0.20 2.30±0.20

2.0±0.1 1.25±0.1 1.25±0.1 1.45±0.20 2.25±0.20

B 2.0±0.15 1.25±0.15 1.25±0.15

2.0±0.2 1.25±0.2 1.25±0.2

6 0.6±0.1

3.2±0.2 1.6±0.2

B 1.25±0.1

1.15±0.1

1.15±0.15

X 1.2±0.1

1.6±0.2

3.2±0.3 1.6±0.3 1.6±0.3 2.10±0.20 3.60±0.20

9 0.85 +0.15/-0.05 2.80±0.20 3.60±0.20 1.15 max.

Paper Tape

A 1.0 +0/-0.2

M 1.15±0.1

N 1.35±0.15

C 1.6±0.2

R 1.8±0.2

D 2.0±0.2

E 2.5±0.2 3.7 max.

Dimensions

of Tape

Package

GRM Type

1.15 max.

2.0±0.1

2.0±0.2

1.25±0.1

0.85±0.1

1.7 max.

Plastic Tape

Type

Dimensions(Chip)

1.6±0.2

Plastic Tape

2.5 max.

3.0 max.

2.5 max.

3.2±0.3

1.6±0.15

1.6±0.2

2.5±0.2

GRM32

2.80±0.20

3.50±0.20

1.7 max.

GRM31

2.00±0.20

3.60±0.20

1.15 max.

0.85±0.1

1.6±0.15

Paper Tape

1.90±0.20

3.50±0.20

1.7 max.

Plastic Tape

2.0 max.

1.50±0.20

2.30±0.20

3.2±0.15

3.2±0.2

GRM21

1.55±0.15

2.30±0.15

Paper Tape

1.05±0.10

1.85±0.10

1.25±0.2

0.8±0.2

0.8 max.

0.5 +0/-0.1

GRM18

1.10±0.10

2.00±0.10

4.0±0.1

2.0±0.1

φ1.5

+0.1

-0

1.75±0.1

8.0±0.3

3.5±0.05

Ａ

Ｂ

8.0±0.3

4.0±0.1

3.5±0.05

1.75±0.1

Ａ

Ｂ

2.0±0.1

φ1.5

+0.1

-0

4.0±0.1

0.25±0.1(T≦2.0mm)

0.3±0.1(T：2.5mm)

JEMCGP-01796E 8

(5)GRM43/55 (in:mm)

L W

M 1.15±0.1

N 1.35±0.15

R 1.8±0.2

D 2.0±0.2

E 2.5±0.2

S 2.8±0.2 4.7 max.

M 1.15±0.1

N 1.35±0.15

C 1.6±0.2

R 1.8±0.2

D 2.0±0.2

E 2.5±0.2

F 3.2±0.2 4.7 max.

*1 Nominal value

3.7 max.

4.5±0.4

3.2±0.3

5.7±0.4

5.0±0.4

GRM55

5.2

6.1

2.5 max.

3.7 max.

Package

GRM Type

GRM43

3.6

4.9

2.5 max.

Type

Dimensions(Chip)

A *1

B *1

φ1.5

+0.1

-0

4.0±0.1

8.0±0.1

φ1.5

+0.2

-0

12.0±0.3

5.5±0.1

1.75±0.1

Ａ

2.0±0.1

4.0±0.1

Ｂ

*：2.0±0.1

0.3±0.1

JEMCGP-01796E 9

Package

GRM Type

図

ﾁｯﾌﾟ詰め状態

(

単位：

mm)



ｗ1

Top Tape : Thickness 0.06

Feeding Hole :As specified in 1.2.

Hole for Chip : As specified in 1.2.

Base Tape : As specified in 1.2.

Bottom Tape :Thickness 0.05

(Only a bottom tape existence )

GRM01/02

8.0 max.

5±1.5

GRM03/15/18/21/31/32

16.5 max.

10±1.5

GRM43/55

20.5 max.

14±1.5

-3.0



 min.



2.0±0.5

Chip

(in:mm)

Fig.1 Package Chips

Fig.2 Dimensions of Reel

Fig.3 Taping Diagram

JEMCGP-01796E 10

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