Murata SN2100 Manual de usuario
SN2100
Bluetooth Class 1 Module
User Manual
And Datasheet
Version: 1.1
June 25, 2013
Note: SyChip, L.L.C. reserves the right to make changes in specifications at any time and without notice. The
information furnished in this data sheet is believed to be accurate and reliable. However, no responsibility is assumed
by SyChip for its use, nor any infringements of patents or other rights of third parties resulting from its use. No license
is generated under any rights of SyChip or its supporters unless specifically agreed.
SyChip/Murata Confidential Page 2 of 31 SN2100 Datasheet Ver. 1.1
Revision History
Revision Date Author Change Description
0.1 Jul-07-2011 Release the first datasheet.
0.5 Nov-15-2011 N. Nagayama Update the block diagram / BT IC product number
Update the SyChip Part Number
0.6 Jan-05-2012 Viet H. Update the spec table
0.61 Jan-31-2012 Y Fang Added disclaimer
0.62 Apr-10-2012 JAG Added packaging, labeling and regulatory information
0.63 May-22-2012 Viet H. Update the spec table
1.0 Aug-10-2012 Y Fang Added Software and Development Tool sections
1.1 Jun-25-2013 Y Fang Added Recommended host (customer) circuit board PCB
pattern
SyChip/Murata Confidential Page 3 of 31 SN2100 Datasheet Ver. 1.1
Table of Contents
1SYSTEM DESCRIPTIONS.....................................................................................................................................6
1.1APPLICATIONS........................................................................................................................................................6
1.2MODULE SUMMARY ...............................................................................................................................................6
1.3BLOCK DIAGRAM ...................................................................................................................................................7
2MECHANICAL SPECIFICATIONS.....................................................................................................................8
2.1MODULE DIMENSION..............................................................................................................................................8
2.2MODULE TOP AND SIDE VIEW .................................................................................................................................8
2.3MODULE BOTTOM VIEW..........................................................................................................................................9
2.4DETAILED MECHANICAL DATA (TOP VIEW)...........................................................................................................10
2.5MODULE PIN-OUT.................................................................................................................................................11
3DC ELECTRICAL SPECIFICATIONS..............................................................................................................13
3.1TYPICAL POWER CONSUMPTION...........................................................................................................................13
3.2DIGITAL IO SPECIFICATION..................................................................................................................................13
4RF SPECIFICATIONS..........................................................................................................................................14
4.1BLUETOOTH SPECIFICATION.................................................................................................................................14
4.2RF CHARACTERISTICS (TX).................................................................................................................................14
4.3RF CHARACTERISTICS (RX).................................................................................................................................16
5ENVIRONMENTAL SPECIFICATIONS...........................................................................................................17
5.1ABSOLUTE MAXIMUM RATINGS ............................................................................................................................17
5.2OPERATION CONDITIONS ......................................................................................................................................17
6APPLICATION INFORMATION........................................................................................................................18
6.1RECOMMENDED HOST (CUSTOMER)CIRCUIT BOARD PCB PATTERN .....................................................................18
6.2HOST PCB LAYOUT RECOMMENDATIONS .............................................................................................................18
6.3MODULE LOCATION .............................................................................................................................................19
6.3.1Location in x-y plane...............................................................................................................................19
6.3.2Location in z-plane..................................................................................................................................21
7SOFTWARE...........................................................................................................................................................22
7.1SOFTWARE ARCHITECTURE..................................................................................................................................22
7.2BLUETOOTH PROFILE STACKS..............................................................................................................................22
8DEVELOPMENT TOOLS....................................................................................................................................23
9ASSEMBLY INFORMATION .............................................................................................................................24
9.1LEAD-FREE SOLDERING REFLOW PROFILE.............................................................................................................24
10PACKAGING AND MARKING INFORMATION............................................................................................25
10.1CARRIER TAPE DIMENSIONS............................................................................................................................25
10.2MODULE MARKING INFORMATION ..................................................................................................................25
11ORDERING INFORMATION .............................................................................................................................26
12ROHS DECLARATION........................................................................................................................................26
13REGULATORY INFORMATION.......................................................................................................................26
13.1FCC NOTICE (USA) ........................................................................................................................................26
13.2FCC LABELING REQUIREMENTS......................................................................................................................27
SyChip/Murata Confidential Page 4 of 31 SN2100 Datasheet Ver. 1.1
13.3RF EXPOSURE..................................................................................................................................................27
13.4IC NOTICE (CANADA)......................................................................................................................................27
13.5IC LABELING REQUIREMENTS .........................................................................................................................28
13.6CE NOTICE (EUROPE)......................................................................................................................................28
13.7CE LABELING REQUIREMENTS ........................................................................................................................28
14TECHNICAL SUPPORT CONTACT .................................................................................................................29
15DISCLAIMER.........................................................................................................................................................29
SyChip/Murata Confidential Page 5 of 31 SN2100 Datasheet Ver. 1.1
LIST OF FIGURES
FIGURE 1SN2100 MODULE BLOCK DIAGRAM ..................................................................................................................7
FIGURE 2MODULE TOP AND SIDE VIEW ............................................................................................................................8
FIGURE 3MODULE BOTTOM VIEW .....................................................................................................................................9
FIGURE 4DETAILED MECHANICAL DATA (TOP VIEW).......................................................................................................10
FIGURE 5RECOMMENDED HOST (CUSTOMER)PCB PATTERN........................................................................................18
FIGURE 6RECOMMENDED HOST CIRCUIT BOARD DESIGN UNDERNEATH THE MODULE................................................19
FIGURE 7RECOMMENDED LOCATIONS IN XY-PLANE .......................................................................................................20
FIGURE 8LOCATIONS NOT RECOMMENDED IN XY-PLANE ...............................................................................................20
FIGURE 9RECOMMENDED LOCATIONS IN Z-PLANE..........................................................................................................21
FIGURE 10 LOCATIONS NOT RECOMMENDED IN XY-PLANE .............................................................................................21
FIGURE 11 REFLOW PROFILE PATTERN ..........................................................................................................................24
FIGURE 12 CARRIER TAPE DIMENSIONS..........................................................................................................................25
FIGURE 13 MODULE MARKING DETAIL.............................................................................................................................25
LIST OF TABLES
TABLE 1MODULE CONNECTOR SIGNAL DESCRIPTION....................................................................................................11
TABLE 2TYPICAL POWER CONSUMPTION........................................................................................................................13
TABLE 3DIGITAL IO SPECIFICATION ................................................................................................................................13
TABLE 4RF SPECIFICATIONS...........................................................................................................................................14
TABLE 5RF SPECIFICATIONS...........................................................................................................................................16
TABLE 6ABSOLUTE MAXIMUM RATING ............................................................................................................................17
TABLE 7RECOMMENDED OPERATING CONDITIONS ........................................................................................................17
TABLE 8BLUETOOTH STACK AVAILABILITY .....................................................................................................................22
TABLE 9DEVELOPMENT TOOLS ........................................................................................................................................23
TABLE 10 REFLOW PROFILE RECOMMENDATION ...........................................................................................................24
TABLE 11 ORDERING INFORMATION.................................................................................................................................26
SyChip/Murata Confidential Page 6 of 31 SN2100 Datasheet Ver. 1.1
1 System Descriptions
1.1 Applications
SN2100 is a complete industrial grade high power (class 1) Bluetooth® module with on-
board antenna for M2M application. It integrates Bluetooth® IC, PA, RF front end, TCXO
and chip antenna into a small LGA form factor and can be simply dropped into the OEM’s
design. The SN2100 offers total 110 dB link budget, which is significantly better than most
of the Bluetooth® modules do in the market. This makes it a good fit for industrial control
application that usually requires longer distance coverage. The module offers extended
product life and industrial standard operating temperature range to fit the industrial usage.
The SN2100 offers standard HCI interface to the host CPU.
1.2 Module Summary
•Bluetooth V2.0
•Power Grade: Class 1
•Dimensions: 17.5mm x 16.0mm x 2.0 mm
•Supply voltage: 2.2V to 3.3V
•Antenna: on-module
•32kHz clock circuit : on-module
•Host Interface : UART/PCM
•RoHS compliant
•MSL JEDEC level 3
•FCC/IC certified; CE compliant
SyChip/Murata Confidential Page 7 of 31 SN2100 Datasheet Ver. 1.1
1.3 Block Diagram
Figure 1 SN2100 Module Block Diagram
SyChip/Murata Confidential Page 8 of 31 SN2100 Datasheet Ver. 1.1
2 Mechanical Specifications
2.1 Module Dimension
Parameter Typical Unit
Dimension (LxWxH) 17.5 x 16.0 x 2.0 mm
Dimension tolerances (LxWxH) +/- 0.2 mm mm
2.2 Module top and side view
UNIT : mm
Figure 2 Module Top and Side View
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2.3 Module bottom view
Figure 3 Module Bottom View
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2.4 Detailed mechanical data (top view)
Figure 4 Detailed Mechanical Data (top view)
Tabla de contenidos
