Mindspeed Technologies M21115 Manual de usuario

21125-EVMD-001-B

July 2013

M21125/M21115 Evaluation Module

User Guide

21125-EVMD-001-B Mindspeed Technologies®2

Mindspeed Proprietary and Confidential

Revision History

Revision Date Description

B July 2013 Updated High Speed output settings, Table 2-3

Added Software Operation, Chapter 3

A February 2009 Initial release

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Contents

1.0 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

2.0 Quick Start Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

3.0 Software Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

3.1 Software Setup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11

3.2 Software Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13

3.2.1 Connection Settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13

3.2.2 Resetting the Device. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13

3.2.3 Direct/Indirect Write Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14

3.2.4 Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15

3.2.5 Direct Register Access . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16

3.2.6 Saving/Loading State and Macro Files . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16

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1.0 Introduction

This user guide describes how to use the M21125/M21115 evaluation module (EVM). The M21125 is a 40 input by

40 output crosspoint switch and the M21115 is a 20 input by 20 output crosspoint switch rated to operate up to 3.8

Gbps. The EVM is a demonstration and test platform that enables system developers and product designers to

quickly evaluate the functionality and performance of the M21125 and M21115.

The EVM is a single PC board that provides access to 16 lanes of the crosspoint switch (XPTS). One group of four

lanes is accessed via HDMI connectors, another group of four lanes is accessed via DVI connectors, and the

remaining two groups of four lanes are accessed via SMA connectors. The HDMI and DVI connectors are DC-

coupled to allow for direct connection to cables interfaced to TMDS sources and sinks. The SMA connectors are

AC-coupled to enable connections to laboratory test equipment such as generators and analyzers. The EVM is

powered utilizing the supplied AC adapter, and controlled with on-board DIP switches. Note that when the EVM is

populated with a M21115 component, the HDMI connectors cannot be used.

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2.0 Quick Start Guide

The EVM is ready to use out of the box. Please refer to Figure 2-1 for the location of the various connectors.

Figure 2-1. M21125/M21115 Evaluation Module

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1. Connect the supplied AC adapter to connector J85 (+5.0 VDC).

2. For HDMI evaluations, attach an HDMI cable from the source to the connector labeled HDMI IN (J86) and an

HDMI cable from the sink to the connector labeled HDMI OUT (J87). Note that when the EVM is populated with

a M21115 component, the HDMI connectors cannot be used.

3. For DVI evaluations, attach a DVI cable from the source to the connector labeled DVI IN (J17) and a DVI cable

from the sink to the connector labeled DVI OUT (J18).

4. In addition, the SMA connectors can be used for an AC-coupled interface to test equipment. Signal generators

should be connected to the EVM by securing 50cables to the SMA connectors labeled IN[7:0], and signal

analyzers should be connected to the EVM by securing 50cables to the SMA connectors labeled OUT[7:0].

Note that the EVM is pre-configured for pass-through mode, routing GRP0 IN0 to GRP0 OUT0, GRP0 IN1 to

GRP0 OUT1, … , GRP1 IN7 to GRP1 OUT7.

5. The crosspoint switch state can be altered utilizing DIP switches XPS CONFIG[1:0] located at SW3, as shown

in Ta bl e 2 - 1 . The EVM has been pre-configured for the group switch mode, where groups of four lanes are

switched at a time. Group 0 consists of inputs/outputs [3:0] and group 1 consists of inputs/outputs [7:4]. See

Tabl e 2-2 for the input/output mapping for two of the switch states. After the DIP switches have been

reconfigured it is necessary to push the button labeled uC RESET located at S3; see Figure 2-2.

Table 2-1. Crosspoint Switch State Configuration

XPS CONFIG[1:0] Input Output

LL GRP0 GRP0

GRP1 GRP1

HDMI HDMI

DVI DVI

LH GRP0 GRP1

GRP1 GRP0

HDMI DVI

DVI HDMI

HL GRP0 HDMI

GRP1 DVI

HDMI GRP0

DVI GRP1

HH GRP0 DVI

GRP1 HDMI

HDMI GRP1

DVI GRP0

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Table 2-2. Input/Output Mapping Examples

XPS CONFIG[1:0] Input Output

LL IN0 OUT0

IN1 OUT1

IN2 OUT2

IN3 OUT3

IN4 OUT4

IN5 OUT5

IN6 OUT6

IN7 OUT7

LH IN0 OUT4

IN1 OUT5

IN2 OUT6

IN3 OUT7

IN4 OUT0

IN5 OUT1

IN6 OUT2

IN7 OUT3

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6. Signal conditioning settings such as input equalization (IE) and output de-emphasis (DE) can be configured

utilizing DIP switches XPS CONFIG[4:2] located at SW3, as shown in Ta b l e 2 - 3 . The EVM has been pre-

configured for the DIP switch setting XPS CONFIG[4:2] = HLH. After the DIP switches have been reconfigured

it is necessary to push the button labeled uC RESET located at S3; see Figure 2-2.

Table 2-3. Input Equalization and Output De-Emphasis Configuration

XPS CONFIG[4:2] IE Level DE Level Output Swing

LLL Disabled Low 1000 mVppd

LLH Disabled Medium 1000 mVppd

LHL Disabled High 1000 mVppd

LHH Low Low 1000 mVppd

HLL Medium Low 1000 mVppd

HLH High Low 1000 mVppd

HHL High High 1000 mVppd

HHH High High 1400 mVppd

Figure 2-2. Location of DIP Switch Bank SW3 and Button S3

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7. Verify the settings of the following DIP switches located at SW4 and SW2. Figure 2-3 shows the location of

these DIP switches.

a. GRP/LANE MODE = H

b. INPUT ENABLE = L

c. OUTPUT ENABLE = L

d. TEST = L

e. I/O CONFIG0 = L

f. I/O CONFIG1 = L

Figure 2-3. Location of DIP Switch Banks SW4 and SW2

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8. Perform the desired electrical evaluations. Figure 2-4 shows a typical eye diagram.

Figure 2-4. Typical Data Output Eye Diagram at 3.8 Gbps

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