LG GoldStar CB-28C20X Manual de usuario

GoldStar

Y

COLOUR

TV

SERVICE

MANUAL

|

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MODEL:

CB-28C20X

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SELVICHIIG

PRECAUTIONS

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Exploded

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Parts

List

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11

Replacement

Parts

List

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|

SAFETY

PRECAUTIONS

WARNING

:

BEFORE

SERVICING

THIS

CHASSIS,

READ

THE

"X-RAY

RADIATION

PRECAUTIONS",

SAFETY

INSTRUCTIONS"

AND

"PRODUCT

SAFETY

NOTICE"

DESCRIBED

BELOW.

X-RAY

RADIATION

PRECAUTIONS

Excessive

high

voltage

can

produce

potentially

hazardous

X-

RAY

RADIATION.

To

avoid

such

hazards,

the

high

voltage

Must

not

be

above

the

specified

limit.

The

nominai

value

of

the

high

voltage

of

this

receiver

is

29KV

at

Zero

beam

current

{minimum

brightness)

under

specified

power

source.

The

high

voltage

must

not,

under

any

circumstances,

exceed

30KV.

Each

time

a

receiver

requires

servicing,

the

high

voltage

should

be

checked.

It

is

recommended

the

reading

of

the

high

voltage

be

recorded

as

a

part

of

the

service

record.

It

is

important

to

use

an

accurate

and

reliable

high

voltage

meter.

2.

The

only

source

of

X-RAY

RADIATION

in

this

TV

receiver

is

the

picture

tube.

For

continued

X-RAY

RADIATION

protection,

the

replacement

tube

must

be

exactly

the

same

type

tube

as

specified

in

the

parts

list.

.

Some

parts

in

this

receiver

have

special

safety-related

characteristics

for

X-RAY

RADIATION

protection.

For

continued

safety,

parts

replacement

should

be

undertaken

only

after

referring

to

the

PRODUCT

SAFETY

NOTICE

beiow.

SAFETY

INSTRUCTIONS

Potential

as

high

as

25,000-30,000

volts

is

present

when

this

receiver

is

operating.

Operation

of

the

receiver

outside

the

cabinet

or

with

the

back

cover

removed

invoives

a

shock

hazard

from

the

receiver.

(1)

Servicing

should

not

be

attempted

by

anyone

wno

don't

know

the

precautions

necessary

through

and

through

when

working

on

high-voltage

equipment.

(2)

Always

discharge

the

picture

tube

anode

to

the

CHASSIS

GROUND

to

reduce

the

shock

hazard before

removing

the

anode

cap.

(3)

Perfectly

discharge

the

high

potential

of

the

picture

tube

before

handling.

(WARNING:

Risk

of

implosion.

Handle

with

care.)

2.

If

any

fuse

in

this

TV

receiver

is

blown,

replace

it

with

the

attached

at

back

cover.

(Do

not

use

a

line

isolation

transformer

during

this

check).

Use

an

AC

voitmeter

having

1000

ohms

per

volt

or

more

sensitivity

in

the

following

manner.

Connect

a

1000

ohm

resistor

between

a

known

good

earth

ground,

(water

pipe,

conduit,

etc.)

and

the

exposed

metallic

parts,

one

at

a

time.

Measure

the

AC

voltage

across

the

combination

of

1000

ohm

resistor.

Reverse

the

AC

plug

at

the

AC

outlet

and

repeat

AC

voitage

measurements

for

eacn

exposed

metallic

part.

Voltage

measured

must

not

exceed

1

volt

RMS.

This

corresponds

to

1

mA.

AC.

Any

value

exceeding

this

limit

constitutes

a

potential

shock

hazard

and

must

be

corrected

immediately.

FUSE

specified

in

the

chassis

parts

list

only.

AC

Leakage

Test

3.

When

replacing

parts

or

circuit

boards,

wind

the

lead

wires

around

terminals

before

soldering.

4,

When

replacing

a

high

wattage

resistor

(oxide

metal

film

AC

VOLTMETER

resistor)

in

circuit

board,

keep

the

resistor

10

mm

away

from

Circuit

board.

5.

Keep

wires

away

from

high

voitage

or

high

temperature

GOOD

EARTH

components.

GROUND

SUCH

6.

Before

returning

the

set

to

the

customer,

always

perform

an

AS

A

WATER

AC

leakage

current

check

on

the

exposed

metallic

parts

of

PIPE,

CONDUIT

the

cabinet,

such

as

antennas,

terminals,

screwheads,

metal

ae

L

1000

chm

PLACE

THIS

P

ROBE

overlays,

control

shafts,

etc.,

to

be

sure

the

set

is

safe

to

zs

ON

EACH

EXP

OSED

Operate

without

danger

of

electrical

shock.

Since

this

TV

has

METALLIC

PARRT

AVC

(Automatic

Voltage

Control)

circuit,

it

may

be

operated

nonadjustably

within

the

voltage

area

indicated

in

the

label

PRODUCT

SAFETY

NOTICE

Many

electrical

and

mechanical

parts

in

this

chassis

have

special

safety-related

characteristics.

These

characteristics

xe

often

|

passed

without

being

noticed

by

a

visual

inspection

and

the

X-RAY

RADIATION

protection

afforded

by

some

of

then

cannot

necessarily

be

obtained

by

using

replacement

components

rated

for

higher

voltage,

wattage,

etc.

Replacement

parts

wich

have

these

special

safety

characteristics

are

identified

by

A

marks

on

the

schematic

diagram

and

the

replacement

parts

list.

Before

replacing

any

of

these

components,

read

the

parts

list

in

this

manual

carefully.

The

use

of

substitute

replacemmt.

parts

which

do

not

have

the

same

safety

characteristics

as

specified

in

the

parts

list

may

create

X-RAY

RADIATION.

SERVICING

PRECAUTIONS

CAUTION:

Before

servicing

receivers

covered

by

tnis

service

manual

and

its

supplements

ana

eddenda,

read

anc

*cilow

the

SAFETY

PRECAUTIONS

on

page

3

of

this

puolication.

NOTE:

if

unforeseen

circumstances

create

conflict

5etween

the

following

servicing

precautions

and

any

of

the

safety

precautions

on

page

3

of

this

publication,

always

follow

the

safety

precautions.

Remember.

Safety

First.

General

Servicing

Precautions

1.

Always

unplug

the

receiver

AC

power

cord

from

the

AC

power

source

before;

a.

Rernoving

or

reinsialling

any

component,

circuit

board

module

or

any

other

receiver

assembly.

b.

Disconnecting

or

reconnecting

any

receiver

electrical

plug

or

otner

electrical

connection.

<.

Connecting

a

test

substitute

in

garallel

with

an

electrolytic

capacitor

in

the

receiver.

CAUTION:

A

wrong

part

suostitution

or

incorrect

polarity

inszailation

of

electrolytic

capaecitcis

may

result

in

an

explosion

hazard.

d,

Discharging

the

picture

tube

ancde.

_

Test

hign

voitage

oniy

oy

measuring

it

with

an

appropriate

high

veitage

meter

or

other

voltage

Measuring

device

(DVM,

FETVGM,

etc)

equicced

with

a

suitable

high

voltage

probe.

Do

not

test

hign

voltage

Sy

“drawing

an

arc"

3.

Discharge

the

picture

tube

anode

cmy

by

(a)

first

connecting

one

ena

of

an

insulated

clip

lead

to

the

Cegaussing

or

KIre

aquadeg

grounding

system

shield

at

the

point

where

tne

picture

tube

socket

ground

lead

is

connected,

ana

then

it}

touch

the

other

end

cf

the

insulated

clip

lead

to

the

picture

tube

ancdeé

Dutton,

using

an

insulating

hanale

to

avoid

personal

contact

with

hign

veltage.

_

Do

not

soray

chemicals

on

or

near

this

receiver

or

any

of

its

assemblies.

5.

uniess

specified

otherwise

in

this

service manual,

clean

siectrical

contacts

oniv

oy

applying

the

following

mixture

to

tne

contacts

with

a

pipe

cleaner,

cotton-tipped

stick

or

comparable

nonabrasive

applicator:

1

%

(by

volume)

Acetone

and

90%

(by

volume?

isopropyl

aicchol

(S0%-99%

strength)

CAUTION:

This

is

a

fiammabie

mixture.

Uniess

specified

otherwise

in

this

service

Manual,

lubrication

of

contacts

in

not

required.

6.

Do

not

defeat

any

plug/socket

8+

voltage

interlocks

with

which

receivers

covered

by

this

service

manual

might

be

equipped.

_

Do

net

appiy

AC

power

to

this

instrument

and/or

any

of

it

electrical

assemblies

unless

ail

solid-state

cevice

heat

sinks

are

correctly

installed.

8.

Always

connect

the

test

receiver

ground

!ead

to

the

receiver

chassis

ground

before

connecting

the

test

receiver

positive

lead.

Always

remove

the

test

receiver

ground

lead

last.

9.

Use

with

this

receiver

only

the

test

fixtures

specified

in

this

service

manual.

CAUTION:

Co

not

connect

the

test

fixture

ground

strap

to

any

heatsink

in

this

receiver.

NN)

ott

oJ

Electrostatically

Sensitive

(ES)

Devices

Some

semiconductor

(solid

state)

devices

can

be

damaged

easily

by

static

electricity.

Such

components

commonly

are

called

Electrostatically

Sensitive

(ES)

Devices.

Examples

of

typical

ES

devices

are

integrated

Circuits

and

some

fieldeffect

transistors

and

semicounducto:

‘ship’

components.

Ths

following

techniques

should

be

usea

tc

nein

reduce

tne

incidence

of

component

damage

caused

ny

static

electricity.

+.

Immeciately

before

hancling

any

semiconductor

component

or

semiconductor-equippea

assemuly.

drain

off

any

electrostatic

charge

on

your

body

by

touching

2

known

aarta

ground.

Alternatively,

obtain

and

wear

a

commercially

availabie

discharging

wrist

strap

device,

wnich

should

te

removed

to

prevent

potential

shock

reasons

prior

to

applying

power

to

the

unit

under

test.

_

After

removing

an

electrical

assembiy

equipped

with

ES

devices,

piace

the

assembly

on

2

concuctive

surface

such

as

aluminium

foil,

to

orevent

electrostatic

charge

ouildup

or

exposure

of

the

assembly.

3.

Use

only

a

grounded-tip

soldering

ircn

to

solder

or

unsolder

ES

dev.ces.

4,

Use

only

an

anti-static

tvpe

soider

rernovai

device.

Some

solder

removai

devices

not

classified

as

“ant-static’

can

generate

electrical

charges

sufficient

to

Garnags

ES

devices

5.

Do

not

use

freon-cropeilea

chemicals.

These

can

ge

electrical

charges

sufficier:t

to

gamage

ES

devices.

.

Do

not

remove

a

replacement

ES

device

from

its

protective

package

until

immediately

before

you

are

reacy

<0

install

it.

(Most

replacement

ES

devices

are

packaged

with

leads

alectrically

snorted

together

bv

conductive

foarn,

aluminium

foil

or

comparable

conductive

material,

immediately

oefore

removing

the

srotective

material

from

the

leads

of

a

replacement

ES

device,

touch

he

proiective

material

to

the

chassis

or

circuit

assembiy

inta

whicn

tne

device

will

be

installed.

CAUTION:Be

sure

no

power

is

applied

to

the

chassis

oF

Circuit,

and

observe

all

other

saietv

precauticns

8.

Minimize

bodily

motions

when

hanaling

unpackagec

replacement

ES

devices.

(Otherwise

harmless

metion

such

as

the

bruching

together

of

your

clothes

fabric

cr

the

hiting

ef

your

foot

from

a

carpeted

floor

can

generate

static

electricity

sufficient

to

damage

an

£5

device.)

1)

Oo

“J

General

Soldering

Guidelines

1.

Use

a

grounded-tip,

!ow-wattage

soldering

iron

and

appropriate

tip

size

and

shnace

that

wil

anaintain

tip

temperature

within

the

range

cr

500°

F

to

600°.

2.

Use

an

appropriate

gauge

of

RMA

resin-core

solder

comocsed

of

60

parts

tin/40

parts

lead.

3.

Keep

the

soldering

iron

tip

clean

and

weil

tinned.

4.

Thoroughly

clean

the

surfaces

to

be

soldered.

Use

a

maii

wireoristle

(0.5

inch,

of

125cm)

brush

with

4

meta

handle.

Do

not

use

freon-oropeiled

sprav-on

cleaners.

.

Use

the

foilowing

unsoidering

technique

a.

Allow

the

soldering

iron

tp

to

reach

normal

iemperature.

(5G0°

F

to

600°

Fi

b.

Heat

the

component

lead

until

the

solder

melts.

c.

Quickly

draw

the

meited

soider

with

in

anti-static,

suction-type

solder

removal

device

or

withsclder

braid.

CAUTION:

Work

quickly

to

avoid

overheating

the

aircuitboard

printed

foil.

6.

Use

the

following

soldering

technique.

a.

Allow

the

soldering

iron

tip

to

reach

a

normal

temperature

(500°

F

to

600°

F}

b.

First,

hold

the

soldering

iron

tip

and

solier

the

strand

against

the

component

lead

until

the

soldermelts.

ol

-4-

c.

Quickly

move

the

soldering

ircn

tip

to

the

junction

of

the

component

!ead

and

the

orinted

circuit

foil,

and

hold

it

there

only

untii

the

solder

flows

onto

and

around

both

the

component

lead

and

the

foil.

CAUTION:

Work

quickly

to

avoid

overheating

the

circuit

doard

printed

foil.

.

Closely

inspect

the

solder

area

and

remove

any

excess

or

splashed

solder

with

a

smail

wire-bristle

brush.

C2.

IC

Remove/Replacement

Some

chassis

circuit

boards

have

slotted

holes

(oblong)

through

which

the

IC

leads

are

inserted

and

then

bent

flat

against

the

circuit

foil.

When

holes

are

the

slotted

type,

the

following

technique

should

be

used

to

remove

and

replace

the

IC.

When

working

with

boards

using

the

familiar

round

hole,

use

the

standard

technique

as

outlined

in

paragraphs

5

and

6

above.

Removal

1.

Desolder

and

straighten

each

IC

!ead

in

one

operation

by

gently

prying

up

on

the

lead

with

the

soldering

iron

tip

as

the

solder

melts.

2.

Draw

away

the

melted

solder

with

an

anti-static

suction-

type

solder

removal

device

(or

with

solider

braid)

before

removing

the

IC.

Replacement

1

Carefully

insert

the

replacement

IC

in

the

circuit

board.

2.

Carefully

bend

each

IC

lead

against

the

circuit

foil

pad

and

solder

it.

3.

Clean

the

soldered

areas

with

a

small

wire-bristle

brush.

(it

is

not

necessary

to

reapply

acrylic

coating

to

the

areas).

“Smail-Signal"

Discrete

Transistor

Removal/Replacement

1.

Remove

the

defective

transistor

by

clipping

its

leads

as

close

as

possible

to

the

component

body.

2.

Bend

into

a

“U"

shape

the

end

of

each

of

three

leads

remaining

on

the

circuit

board.

3.

Bend

into

a"U"

shape

the

replacement

transistor

jeads.

4,

Connect

the

replacement

transistor

leads

to

the

corresponding

leads

extending

from

the

circuit

board

and

crimp

the

“U"

with

long

nose

pliers

to

insure

metal

to

metal

contact

then

solder

each

connection.

Power

Output,

Transistor

Device

Removal/Replacement

1.

Heat

and

remove

all

solder

from

around

the

transistor

leads.

2.

Remove

the

heatsink

mounting

screw

(if

so

equipped).

3.

Carefully

remove

the

transistor

from

the

heat

sink

of

the

circuit

board.

.

Insert

new

transistor

in

the

circuit

board.

Solder

each

transistor

lead,

and

clip

off

excess

lead.

Replace

heatsink.

Oop

Diode

Removal/Replacement

1.

Remove

defective

diode

by

clipping

its

leads

as

close

as

possible

to

diode

body.

2.

Bend

the

two

remaining

leads

perpendiculaly

to

the

circuit

board.

’

3.

Observing

diode

polarity,

wrap

each

lead

of

the

new

diode

around

the

corresponding

lead

on

the

circuit

board.

4.

Securely

crimp

each

connection

and

solder

it.

5.

Inspect

(on

the

circuit

board

copper

side)

the

solder

joints

of

the

two

“original”

leads.

If

they

are

not

shiny,

reheat

them

and

if

necessary,

apply

additional

solder.

Fuse

and

Conventional

Resistor

Removal/Replacement

1.

Clip

each

fuse

or

resistor

lead

at

top

of

the

circuit

board

hollow

stake.

2.

Securely

crimo

the

leads

of

replacement

component

around

notch

at

stake

top.

3.

Solder

the

connections.

CAUTION:

Maintain

original

spacing

between

the

replaced

component

and

adjacent

components

and

the

circuit

board

to

prevent

excessive

component

temperatures.

Circuit

Board

Foil

Repair

Excessive

heat

applied

to

the

copper

foil

of

any

printed

circuit

board

will

weaken

the

adhesive

that

bonds

the

foil

to

the

circuit

board

causing

the

foil

to

separate

from

or

‘lift-off*

the

board.

The

following

guidelines

and

procedures

should

be

followed

whenever

this

ccndition

is

encountered.

At

IC

Connections

To

repair

a

defective

copper

pattern

at

IC

connections

use

the

following

procedure

to

install

a

jumper

wire

on

the

copper

pattern

side

of

the

circuit

board.

(Use

this

technique

cnly

on

IC

connections).

1.

Carefully

remove

the

damaged

copper

pattern

with

a

sharo

knife.

(Remove

only

as

much

copper

as

absolutely

necessary).

2.

carefully

scratch

away

the

solder

resist

and

acrylic

coating

(if

used)

from

the

end

of

the

remaining

cooper

pattern.

3.

Bend

a

small

"U"

in

one

end

of*a

smail

gauge

jumper

wire

and

carefully

crimo

it

around

the

IC*pin.

Solder

the

IC

comection.

4.

Route

the

jumper

wire

along

the

path

of

the

cut-away

copper

pattern

and

let

it

overlap

the

oreviously

scraped

end

of

the

good

copper

pattern.

Soider

the

overlapped

area

and

clip

off

any

excess

jumper

wire.

At

Other

Connections

Use

the

following

technique

to

repair

the

defective

copper

pattern

at

connections

other

than

IC

Pins.

This

technique

involves

the

installation

of

a

jumper

wire

on

the

component

side

of

the

circuit

board.

1.

Remove

the

defective

copper

pattern

with

a

sharp

knife.

Remove

at

least

1/4

inch

of

copper,

to

ensure

that

a

hazardous

condition

will

not

exist

if

the

jumper

wire

yp

ens.

2.

Trace

along

the

copper

pattern

from

both

sides

of

the

pattern

break

and

locate

the

nearest

componen:

that

is

directly

connected

to

the

affected

copper

pattern.

3.

Connect

insulated

20-gauge

jumper

wire

from

the

leid

of

the

nearest

component

on

one

side

of

the

pattern

bre«

to

the

lead

of

the

nearest

component

on

the

other

side.

Carefully

crimp

and

solder

the

connections.

CAUTION:

Be

sure

the

insulated

jumper

wire

is

dressed

so

that

it

does

not

touch

components

or

sharp

edges.

-5-

SPECIFICATIONS

NOTE

:

Specifications

and

others

are

subject

to

change

without

notice.

@

Video

input

system

:PAL

-

B/G

@

Power

requirements

:

230Vac

=

10%,

50

HZ

@

Intermediate

Frequency

(unit

:

MHZ)

@

Power

consumption

:

160W

max

.

Carrier

|

PAL-B/G

@

Sound

output

:

12W

max

x

2

way

a

C—O

|

Vision

(Vc)

|

38.9

Duai

/

Stereo

(2

carrier)

Sound

(Sc)

|

33.4

'

7

—————————

Ss

S

as

perenne

|

Color

(Cc)

e@

Tuning

range

|

Band

|

VHF-Low

VHF-High

|

34.47

|

@

Voice

coil

impedance

:

3

onm

fous

a

eae

ee

@

Antenna

input

impedance

:

VHF/UHF

750hm,

Unbalancec

For

TV

For

CATV

|

@

OSD

(On

Screen

Display)

:

Menu

method

Ch2-4

|

StT-S3,S1

|

S2

-

Si0,

i

@

Local

button:

Menu/OK

Ch5-12

|

Si1-

S20

Volume

up(+),

down(-}

i

$21-

S41

|

Program

up(+),

down(-)

Hyper

fg

Sy

a

UHF

Ch

21-

69

|

@

Function:

Auto

Program

Manual

Program

Auto

Sleep

@

Tuning

system:

FS

(Frequency

Synthesizer),

Quick

View

60

Program

Memory

Teletext

(TOP/FLOF/LIST)

Child

Lock;

In

case

of

choosing

Lock

On,

you

can

power

on/off

only

with

e

External

conection:

S-VHS

in/Phono

Jack

AV

in

remote

controller.

To

cancel

of

this

mode,

select

lock

off

Jack

for

external

speaker(P654,

P653)

with

menu

button

on

remote

controller

only.

Scart

1(EURO-Socket,

SK101)

Scart

2

(EURO-Socket,

SK102)

Scart

1

|

Scart

2

:

Specifications

Video

in/out

Audio

in

(2

way)

Audio

out

(2

way)

0.5Vrms

+3cB,

over

10Kohm

|

0.5Vrms+3dB,

below

1Kohm

0.7Vp-p

+

3dB,

750hm

CONTROL

DESCRIPTIONS

e@

Local

control

e@

External

A/V

input

Jack

Video

Audio-L

Audio-R

e

Super

A/V

|

—

Input

Jack

1

|

pot

2 3

|

VIDEO

L-AUDIO-R

P

}

AV3

e@

Head

Phone

Jack

|

Voiurne

&

Dual

|

(Main)/Dual

{I

(Sub)

controlled

sound

output

for

Head-phone

|

Button's

name

Description

To

turn

the

TV

power

on

To

show

control

menu

Refer

to

menu

reference

To

keep

every

selected

control

status

into

memory

Volume

Down

|

To

decrease

(-)

sound

volume

To

increase

(+)

sound

volume

|

Volume

Up

6

Program

Down

|

To

change

program

No

downwards

7

Program

Up

To

change

program

No

upwards

Seer

=U

oO

rep)

=

e@

Stand-by

Indicator

Red

color

:

Stand-by

on

Yellow

color

:

Stand-by

off

e

Stereo/Dual

Sound

Indicator

Mode}

}|

|

—————

Mono

|

off

|

off

|

Stereo

on

|

on

Dual

|

on,

off

|

Dual

I!

off

|

on

e

Menu

Reference

aa

|

4

TYPE

;

OSD

(On

Screen

Display)

Reference

hal

Y

1

|

MENU1

|

'

;

i

I

!

e

O47

inti

Contrast

1

|

&

31

TUN

Brightness

|

‘|

@

31

innit

Coiour

eee

J

7

|

Y

-

HHH

|

Volume

for

speaker

i

MENU

2

:

sevcceeesseen

(oe

|

Balance

|

VLAN

LALITLE

Treble

ra

HATE

|

Bass

TT

|

Volume

for

head-phone

a

;

|

Y

|

MENUS}

|

MODE

ones

|

ee

LOCK

OFF

°

AUTO

SLEEP

OFF

|

@

;

OFF

TIME--:--

|

TIME

Sors=

:

ey

|

;

rd

|

FINE

TUNING

|

Y

AUTO

PROGRAM

MEN

MANUAL SEARCH

j

PR

SKIP

OFF

|

@

FORCED

AV

OFF

°

|

Y

SYSTEM

BG

|

@

Receiving

System

OSD

!

me

hateianet:

i)

H

i

r

|

BBG

~~

DK

BH

lee

een

ee

we

ew ee

ee

eee

wee

eee

{

i

e

Use

Program

Down

/

Up

button

to

select

each

one

function

in

every

MENUs.

@

To

change

analog

level

in

MENU

1,

MENU

2

or

to

change

status

of

each

marked

(

@

)

in

Reference

column,

you

can

control

with

Volume

Down

/

Up

button.

:

NOTE:

To

keep

every

selected

status

in

memory,

press

OK

button.

|

DISASSEMBLY

INSTRUCTIONS

important

note

This

set

is

disconnected

from

the

power

supply

through

the

converter

transformer.

An

isolating

transformer

is

necessary

for

service

operations

on

the

primary

side

of

the

converter

transformer.

Back

Cabinet

Removal

Remove

10

screws

residing

on

the

back

cabinet

and

carefuily

separate

the

back

cabinet

from

the

front

cabinet.

CPT

Removal

1.

Puil

out

the

CPT

board

from

the

CPT

neck.

2.

Place

the

front

cabinet

on

soft

material

not

to

mar

the

front

surface

or

damage

control

knobs.

3.

Remove

4

screws

securing

the

picture

tube

mounting

brackets

to

the

front

cabinet.

4.

Caretully

separate

CPT

from

the

front

cabinet.

Control

Board

Main

Board

Latch

Chassis

Assy

Removal

Slide

the

chassis

back

and

out

of

the

cabinet.

Speaker

Assy

Removal

1.

Remove

P651,

P652

connector

from

Power,

Deflection,

Sound-Amp

Board.

2.

Remove

2

screws

for

tweeter

speaker

and

4

for

squawker

on

front

cabinet.

PICTURE

TUBE

HANDLING

CAUTION

Due

to

high

vacuum

and

large

surface

area

of

picture

tube,

great

care

must

be

exercised

when

handling

picture

tube.

Always

|ift

picture

tube

by

grasping

it

firmly

around

faceplate.

NEVER

LIFT

TUBE

BY

ITS

NECK!

The

picture

tube

must

not

be

scratched

or

subjected

to

excessive

pressure

as

fracture

of

glass

may

result

in

an

implosion

of

considerable

violence

which

can

Cause

personal

injury

or

property

damage.

Euro-Socket_

|

Speaker

Jacks

\

(SK101)

Power,

Deflec

tion,

Sound-Anp

Board

Euro-Socket

(SK102)

EXPLODED

VIEW

a

,

Se

IC:KS51800

COVER,BATTERY

_

01SS518002A

303-H73A

-

10

-

LG GoldStar CB-28C20X Manual de usuario

Manuales populares de TELEVISOR de otras marcas