LG M227WD Manual de usuario

LCD MONITOR TV

SERVICE MANUAL

CAUTION

BEFORE SERVICING THE CHASSIS,

READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

CHASSIS : LD84G

MODEL : M227WD M227WD-PZJ

North/Latin A erica http://aic.lgservice.co

Europe/Africa http://eic.lgservice.co

Asia/Oceania http://biz.lgservice.co

Internal Use Only

Only for training and service purposes

LGE Internal Use Only

C2008

- 2 -

CONTENTS

CONTENTS .............................................................................................. 2

PRODUCT SAFETY ..................................................................................3

SPECIFICATION ........................................................................................6

ADJUSTMENT INSTRUCTION ...............................................................15

TROUBLE SHOOTING ............................................................................19

BLOCK DIAGRAM...................................................................................25

EXPLODED VIE .................................................................................. 27

SVC. SHEET ...............................................................................................

Only for training and service purposes

LGE Internal Use Only

C2008

- 3 -

PRECAUTION

WARNING FOR THE SAFETY-RELATED COMPONENT.

• There are some special components used in LCD

monitor that are important for safety. These parts are

marked on the schematic diagram and the

Exploded View. It is essential that these critical parts

should be replaced with the manufacturer’s specified

parts to prevent electric shock, fire or other hazard.

• Do not modify original design without obtaining written

permission from manufacturer or you will void the

original parts and labor guarantee.

TAKE CARE DURING HANDLING THE LCD MODULE

WITH BACKLIGHT UNIT.

• Must mount the module using mounting holes arranged

in four corners.

• Do not press on the panel, edge of the frame strongly

or electric shock as this will result in damage to the

screen.

• Do not scratch or press on the panel with any sharp

objects, such as pencil or pen as this may result in

damage to the panel.

• Protect the module from the ESD as it may damage the

electronic circuit (C-MOS).

• Make certain that treatment person’s body are

grounded through wrist band.

• Do not leave the module in high temperature and in

areas of high humidity for a long time.

• The module not be exposed to the direct sunlight.

• Avoid contact with water as it may a short circuit within

the module.

• If the surface of panel become dirty, please wipe it off

with a softmaterial. (Cleaning with a dirty or rough cloth

may damage the panel.)

WARNING

BE CAREFUL ELECTRIC SHOCK !

• If you want to replace with the new backlight (CCFL) or

inverter circuit, must disconnect the AC adapter

because high voltage appears at inverter circuit about

650Vrms.

• Handle with care wires or connectors of the inverter

circuit. If the wires are pressed cause short and may

burn or take fire.

Leakage Curren Ho Check Circui

•Replaceable ba eries

* CAUTION

RISK OF EXPLOSION IF BATTERY IS REPLACED BY

AN INCORRECT TYPE.

DISPOSE OF USED BATTERIES ACCORDING TO

THE INSTRUCTIONS

CAUTION

Please use only a plastic screwdriver to protect yourself

from shock hazard during service operation.

1.5 Kohm/10W

AC Volt-meter

When 25A is impressed between Earth and 2 Grond

* Base on Adjustment standard

Good Earth Ground

To Instrument's

such as WATER PIPE,

CONDUIT etc.

exposed

METALLIC PARTS

for 1 second, Resistance must be less than 0.1

Ω

0.15uF

Only for training and service purposes

LGE Internal Use Only

C2008

- 4 -

CAUTION: Before servicing receivers covered by this service

manual and its supplements and addenda, read and follow the

SAFETY PRECAUTIONS on page 3 of this publication.

NOTE: If unforeseen circumstances create conflict between the

following servicing precautions and any of the safety precautions on

page 3 of this publication, always follow the safety precautions.

Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power

source before;

a. Removing or reinstalling any component, circuit board

module or any other receiver assembly.

b. Disconnecting or re-connecting any receiver electrical plug

or other electrical connection.

c. Connecting a test substitute in parallel with an electrolytic

capacitor in the receiver.

CAUTION: A wrong part substitution or incorrect polarity

installation of electrolytic capacitors may result in an

explosion hazard.

2. Test high voltage only by measuring it with an appropriate high

voltage meter or other voltage measuring device (DVM,

FETVOM, etc) equipped with a suitable high voltage probe.

Do not test high voltage by "drawing an arc".

3. Do not spray chemicals on or near this receiver or any of its

assemblies.

4. Unless specified otherwise in this service manual, clean

electrical contacts only by applying the following mixture to the

contacts with a pipe cleaner, cotton-tipped stick or comparable

non-abrasive applicator; 10% (by volume) Acetone and 90% (by

volume) is opropyl alcohol (90%-99% strength)

CAUTION: This is a flammable mixture.

Unless specified otherwise in this service manual, lubrication of

contacts in not required.

5. Do not defeat any plug/socket B+ voltage interlocks with which

receivers covered by this service manual might be equipped.

6. Do not apply AC power to this instrument and/or any of its

electrical assemblies unless all solid-state device heat sinks are

correctly installed.

. Always connect the test receiver ground lead to the receiver

chassis ground before connecting the test receiver positive

lead.

Always remove the test receiver ground lead last.

8. Use with this receiver only the test fixtures s ecified in this

service manual.

CAUTION: Do not connect the test fixture ground strap to any

heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged easily

by static electricity. Such components commonly are called

Electrostatically Sensitive (ES) Devices. Examples of typical ES

devices are integrated circuits and some field-effect transistors and

semiconductor "chip" components. The following techniques

should be used to help reduce the incidence of component

damage caused by static by static electricity.

1. Immediately before handling any semiconductor component or

semiconductor-equipped assembly, drain off any electrostatic

charge on your body by touching a known earth ground.

Alternatively, obtain and wear a commercially available

discharging wrist strap device, which should be removed to

prevent potential shock reasons prior to applying power to the

unit under test.

2. After removing an electrical assembly equipped with ES

devices, place the assembly on a conductive surface such as

aluminum foil, to prevent electrostatic charge buildup or

exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES

devices.

4. Use only an anti-static type solder removal device. Some solder

removal devices not classified as "anti-static" can generate

electrical charges sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate

electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective

package until immediately before you are ready to install it.

(Most replacement ES devices are packaged with leads

electrically shorted together by conductive foam, aluminum foil

or comparable conductive material).

. Immediately before removing the protective material from the

leads of a replacement ES device, touch the protective material

to the chassis or circuit assembly into which the device will be

installed.

CAUTION: Be sure no power is applied to the chassis or circuit,

and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged

replacement ES devices. (Otherwise harmless motion such as

the brushing together of your clothes fabric or the lifting of your

foot from a carpeted floor can generate static electricity

sufficient to damage an ES device.)

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropriate

tip size and shape that will maintain tip temperature within the

range or 500ºF to 600ºF.

2. Use an appropriate gauge of RMA resin-core solder composed

of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wire-

bristle (0.5 inch, or 1.25cm) brush with a metal handle.

Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique

a. Allow the soldering iron tip to reach normal temperature.

(500ºF to 600ºF)

b. Heat the component lead until the solder melts.

c. Quickly draw the melted solder with an anti-static, suction-

type solder removal device or with solder braid.

CAUTION: Work quickly to avoid overheating the circuit

board printed foil.

6. Use the following soldering technique.

a. Allow the soldering iron tip to reach a normal temperature

(500ºF to 600ºF)

b. First, hold the soldering iron tip and solder the strand against

the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of the

component lead and the printed circuit foil, and hold it there

only until the solder flows onto and around both the

component lead and the foil.

CAUTION: Work quickly to avoid overheating the circuit

board printed foil.

d. Closely inspect the solder area and remove any excess or

splashed solder with a small wire-bristle brush.

SERVICING PRECAUTIONS

Only for training and service purposes

LGE Internal Use Only

C2008

- 5 -

IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through

which the IC leads are inserted and then bent flat against the

circuit foil. When holes are the slotted type, the following technique

should be used to remove and replace the IC. When working with

boards using the familiar round hole, use the standard technique

as outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation by gently

prying up on the lead with the soldering iron tip as the solder

melts.

2. Draw away the melted solder with an anti-static suction-type

solder removal device (or with solder braid) before removing the

IC.

Re lacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad and

solder it.

3. Clean the soldered areas with a small wire-bristle brush.

(It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor

Removal/Replacement

1. Remove the defective transistor by clipping its leads as close as

possible to the component body.

2. Bend into a "U" shape the end of each of three leads remaining

on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the corresponding

leads extending from the circuit board and crimp the "U" with

long nose pliers to insure metal to metal contact then solder

each connection.

Power Output, Transistor Device

Removal/Replacement

1. Heat and remove all solder from around the transistor leads.

2. Remove the heat sink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the circuit

board.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heat sink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as

possible to diode body.

2. Bend the two remaining leads perpendicular y to the circuit

board.

3. Observing diode polarity, wrap each lead of the new diode

around the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.

5. Inspect (on the circuit board copper side) the solder joints of

the two "original" leads. If they are not shiny, reheat them and if

necessary, apply additional solder.

Fuse and Conventional Resistor

Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board hollow

stake.

2. Securely crimp the leads of replacement component around

notch at stake top.

3. Solder the connections.

CAUTION: Maintain original spacing between the replaced

component and adjacent components and the circuit board to

prevent excessive component temperatures.

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit

board will weaken the adhesive that bonds the foil to the circuit

board causing the foil to separate from or "lift-off" the board. The

following guidelines and procedures should be followed whenever

this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the

following procedure to install a jumper wire on the copper pattern

side of the circuit board. (Use this technique only on IC

connections).

1. Carefully remove the damaged copper pattern with a sharp

knife. (Remove only as much copper as absolutely necessary).

2. carefully scratch away the solder resist and acrylic coating (if

used) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire and

carefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copper

pattern and let it overlap the previously scraped end of the good

copper pattern. Solder the overlapped area and clip off any

excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern

at connections other than IC Pins. This technique involves the

installation of a jumper wire on the component side of the circuit

board.

1. Remove the defective copper pattern with a sharp knife.

Remove at least 1/4 inch of copper, to ensure that a hazardous

condition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern

break and locate the nearest component that is directly

connected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the

nearest component on one side of the pattern break to the lead

of the nearest component on the other side.

Carefully crimp and solder the connections.

CAUTION: Be sure the insulated jumper wire is dressed so the

it does not touch components or sharp edges.

Only for training and service purposes

LGE Internal Use Only

C2008

- 6 -

SPECIFICATION

NOTE : Specifications and others are subject to change without notice for improvement

4. Module Specification

4.1 M22 WD-PZJ : AUO, M215HW01-V0( P/N : EAJ55 29601)

1. Application Range.

This spec sheet is applied to the 22” LCD Monitor TV used

LD84G chassis.

2. Specification

Each part is tested as below without special appointment

2.1 Temperature : 25±5°C( ±9°F), CST : 40±5°C

2.2 Relative Humidity : 65±10%

2.3 Power Voltage : Standard input voltage

(100~240V@ 50/60Hz)

• Standard Voltage of each products is marked by models

2.4 Specification and performance of each parts are followed

each drawing and specification by part number in

accordance with BOM .

2.5 The receiver must be operated for about 5 minutes prior to

the adjustment.

3. Test method

3.1 Performance : LGE TV test method followed.

3.2 Demanded other specification

Safety : CE, IEC specification

EMC : CE, IEC

No Item Specification Unit Remark

1 Type TFT Color LCD Module

2 Diagonal Size 21.53 inches (546.86mm) diagonal

3 Active Display area 4 6.64 (H) x 268.11 (V) mm

4 Outline Dimension 495.6(H) x292.2(V) x 16.35(D) mm Typ.

5 Aspect Ratio 16:9

6 Pixel Number 1920 x RGB x 1080 pixel

Pixel Pitch 0.24825(H) x 0.24825(V) mm

8 Color arrangement RGB vertical Stripe

9 Color Depth 16. M color (6bit with Hi-FRC)

10 Electrical Interface LVDS

11 Surface Treatment Hard coating(3H) & Anti-glare(Haze 25)

12 Operating Mode Normally White

13 Backlight Unit 4 CCFL(4 lamps)

14 Response Time Rising Time : 3.8 + Falling Time : 1.2 ms Typ.

15 Color Gamut Normal 2% Panel(CIE1931)

5. General Specification

5.1 TV

- 7 -

Only for tr ining nd service purposes

LGE Intern l Use Only

No Item Specific tion Rem rks

1 M rket EU(PAL M rket-26Countries) DTV & An log -

UK, Fr nce, Germ ny, Sp in, Sweden,

Finl nd, It ly, Netherl nds, Belgium,

Luxemburg, Greece, Denm rk, Czech,

Austri , Hung ry, Switzerl nd, Cro ti , Turkey

An log Only -

Pol nd, Portug l, Norw y, Bulg ri ,

Serbi ,Sloveni , Russi , Rum ni

2 Bro dc sting system 1) PAL-BG

2) PAL-DK

3) PAL-I/I’

4) SECAM L/L’

5) DVB-T (ID TV)

3 Receiving system An log : Upper Heterodyne

Digit l : COFDM

4 Sc rt J ck (2EA) PAL, SECAM

Sc rt 1 J ck is Full sc rt nd support RF-OUT(ATV)

Sc rt 2 J ck is H lf sc rt nd support MNT/DTV-OUT

5 Component Input (1EA) Y/Cb/Cr

Y/Pb/Pr

6 CVBS Input (1EA) PAL, SECAM, NTSC 4 System(Re r):PAL50, SECAM,NTSC,PAL60

7 S-Video Input (1EA) PAL, SECAM, NTSC 4 System(Re r):PAL50, SECAM,NTSC,PAL60

8 RGB Input RGB-PC An log(D-SUB 15 Pin)

9 DVI Input DVI-D Digit l

10 HDMI Input (2EA) HDMI1-DTV HDMI version 1.3

HDMI2-DTV Support HDCP (Not Support PC)

11 Audio Input (3EA) RGB/DVI Audio L/R Input

Component

CVBS/S-Video

12 SDPIF out (1EA) SPDIF out

13 E rphone (1EA) Antenn , AV1, AV2, AV3, Component,

RGB, DVI, HDMI1, HDMI2

14 USB (1EA) ISP Downlo d (Version 2.0) For service only

15 RS-232C (1EA) For TV Linklo der

- 8 -

Only for tr ining nd service purposes

LGE Intern l Use Only

5.2 RGB / DVI

No Item Specific tion Rem rks

1 Supported Sync. Type Sep r te Sync., Digit l

2 Oper ting Frequency An log Horizont l 30 ~ 83kHz

Vertic l 56 ~ 75 Hz

Digit l Horizont l 30 ~ 83kHz

Vertic l 56 ~ 75 Hz

3 Resolution An log M x. 1920x1080 @ 60Hz

Recommend 1920x1080 @ 60Hz

Digit l M x. 1920x1080 @ 60Hz

Recommend 1920x1080 @ 60Hz

4 Input Volt ge Volt ge :100 – 240 V c, 50 or 60Hz

5 Inrush Current Cold St rt : 50 A Hot : 120 A

6 Oper ting Condition Sync (H/V) Video LED W tt ge

Power S/W On On mode On/On Active Blue 70W M x.

On/On Active Blue 55W Typ.

Sleep mode Off/On Off Amber 1W RGB

On/Off

Power S/W Off Off mode - Off Off 1W

7 MTBF 50,000 HRS with 90% Confidence level L mp Life: 40,000 Hours(min)

8 Using Altitude 5,000 m (for Reli bility) 3,000m(for FOS)

9 Oper ting Environment Temp : 10°C ~ 35°C

Humidity : 20 % ~ 80 %

10 Stor ge Environment Temp : -10°C~60°C non condensing

Humidity : 5 % ~ 90 % non condensing

Only for tr ining nd service purposes

LGE Intern l Use Only

- 9 -

6. Chroma & Brightness

6.1 21.5” LCD Module (for more det ils, refer to the module spec.)

* Optic l Test Condition

- Surrounding Brightness Level : d rk

- Surrounding Temper ture : 25±5°C

- w rm-up Time : 30 Min

- Contr st, Brightness : Outgoing condition

- *Inc se of Vivid Mode, high level s tur tion m y be occurred. Check gr y line rity t st nd rd mode.

* Active re

1. Active re of LCD PANEL is in bezel of c binet.

2. Interv l between ctive re nd bezel

|A-B|<1.0 mm , |C-D|<1.0 mm

A: Interv l between left of ctive re nd bezel

B: Interv l between right of ctive re nd bezel

C: Interv l between top of ctive re nd bezel

D: Interv l between bottom of ctive re nd bezel

No. Item Specific tion Min. Typ. M x. Rem rk

1. Viewing Angle<CR>10> Right/Left 75/75 85/85 CR >10

Up/Down 70/70 80/80

2. Lumin nce Lumin nce (cd/m2) 240 300 DVI or RGB

-St nd rd, 6500K

-Full White(100IRE)

V ri tion(%) 75 80 MIN / MAX

3. Contr st R tio CR 600 1000

Full white/Full bl ck

4. Color Coordin tes[CIE1931] White WXTyp 0.313 Typ DVI or RGB

WY-0.03 0.329 +0.03

-St nd rd, 6500K

RED Xr 0.648

- Full White(100IRE)

Yr 0.339

Green Xg 0.282

Yg 0.603

Blue Xb 0.143

Yb 0.070

Active Are

Bezel

Only for tr ining nd service purposes

LGE Intern l Use Only

- 10 -

8. Component Video Input (Y PB PR)

7. SET Optical Feature

7.1 PC Mode (Me surement Condition: Full white/ St nd rd/6500K) -> Me sure the bl ck lumin nce fter 30 seconds.

7.2 AV Mode (Me surement Condition: Full white(100IRE)/ Vivid) Me sure the bl ck lumin nce fter 30 seconds.

No Item module Lumin nce (cd/m2) C/R(min) Rem rk

Min Typ M x Min Typ

1 22 inch AUO 240 300 - 600:1 1000:1 RGB & DVI

DFC 20000:1

No Item module Lumin nce (cd/m2) C/R(min) Rem rk

Min Typ M x RGB(Full White 100IRE)

1 22 inch AUO 170 220 - 500:1 RF, AV, COMPONENT,HDMI

No. Specific tion Rem rk

Resolution H-freq(kHz) V-freq(Hz)

1. 720x480 15.73 60.00 SDTV, DVD 480i

2. 720x480 15.63 59.94 SDTV, DVD 480i

3. 720x480 31.47 59.94 480p

4. 720x480 31.50 60.00 480p

5. 720x576 15.625 50.00 SDTV, DVD 625 Line

6. 720x576 31.25 50.00 HDTV 576p

7. 1280x720 37.5 60.00 HDTV 720p

8. 1280x720 44.96 59.94 HDTV 720p

9. 1280x720 45.00 60.00 HDTV 720p

10. 1920x1080 28.125 50.00 HDTV 1080i

11. 1920x1080 33.75 60.00 HDTV 1080i

12. 1920x1080 33.72 59.94 HDTV 1080i

13. 1920x1080 26.97//27 23.97/24 HDTV 1080p

14. 1920x1080 33.716/33.75 29.976/30.00 HDTV 1080p

15. 1920x1080 56.250 50 HDTV 1080p

16. 1920x1080 67.43/67.5 59.94/60 HDTV 1080p

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